JPS5651591A - Production of electroplated wire - Google Patents

Abstract

PURPOSE: To lower the cost of production equipment and produce an electroplated wire at a high speed with good efficiency by supplying the power from one electric power source to a degreasing cell and a plating cell and supplying the power in a contactless system through the decreasing soln. and plating soln.

CONSTITUTION: At the time of applying Ni plating to a metal wirelike body 3 comprising a copper wire, the copper wire is run continuously in the arrow A direction through the degreasing soln. 7 and plating soln. 8 above the respective pole plates 5, 6 of a degreasing cell 1 and a plating cell 2. At this same instant, the power is supplied to the pole plates 5, 6 of the respective cells 1, 2 from a rectifier 4. As a result, negative current is supplied to the cell 2 and positive current is induced in the copper wire in the soln. 7, whereby staining by the O₂ gas produced is perfectly eliminated. On the other hand, positive current is supplied to the cell 2 and negative current is induced in the degreased copper wire from the soluble pole plate 6, whereby Ni plating is applied. At this time, the power is supplied to the copper wire through the soln. 8 in the absence of contact; therefore, even the large current may be flowed and since there is no formation of any spark trace at this time, the plating may be performed at a high speed.

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