JPS55104496A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPS55104496A JPS55104496A JP951279A JP951279A JPS55104496A JP S55104496 A JPS55104496 A JP S55104496A JP 951279 A JP951279 A JP 951279A JP 951279 A JP951279 A JP 951279A JP S55104496 A JPS55104496 A JP S55104496A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- rubber
- conductive
- pattern
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To enable to form a sharp plating film at a minute part, by pushing out non-plating part by anisoyropic electroconductive rubber connected with cathode and plating the exposure part, at the time of carrying out partial plating of conductive body pattern on insulating substrate.
CONSTITUTION: At the time of carrying out partial plating of a fixed part of the conductive pattern 2 on the insulation substrate 1 such as ceramic substrate, etc., the anisotropic conductive rubber 8 filling graphite fiber or metal fiber in silicone rubber, is pressed against non-plating part of the pattern 2 and the above part is sealed. Then, the conductor 4 connceted with the cathode at the upper part of the rubber 8 and the insulating material 5, are combined with conductive bonding agent and the pattern 2 and the cathode are connected electrically. By carrying out the plating in such a condition, side face of the rubber 8 is not plated as isoelectric rubber of usual method because the above face is not conductive and the sharp partial plating layer 9 is formed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP951279A JPS6057517B2 (en) | 1979-01-29 | 1979-01-29 | Partial plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP951279A JPS6057517B2 (en) | 1979-01-29 | 1979-01-29 | Partial plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55104496A true JPS55104496A (en) | 1980-08-09 |
JPS6057517B2 JPS6057517B2 (en) | 1985-12-16 |
Family
ID=11722292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP951279A Expired JPS6057517B2 (en) | 1979-01-29 | 1979-01-29 | Partial plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6057517B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59163889A (en) * | 1983-03-08 | 1984-09-14 | 松下電器産業株式会社 | Method of partially plating conductor on substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01134018U (en) * | 1988-03-05 | 1989-09-12 |
-
1979
- 1979-01-29 JP JP951279A patent/JPS6057517B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59163889A (en) * | 1983-03-08 | 1984-09-14 | 松下電器産業株式会社 | Method of partially plating conductor on substrate |
JPH0244157B2 (en) * | 1983-03-08 | 1990-10-02 | Matsushita Electric Ind Co Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS6057517B2 (en) | 1985-12-16 |
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