JPS55104496A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS55104496A
JPS55104496A JP951279A JP951279A JPS55104496A JP S55104496 A JPS55104496 A JP S55104496A JP 951279 A JP951279 A JP 951279A JP 951279 A JP951279 A JP 951279A JP S55104496 A JPS55104496 A JP S55104496A
Authority
JP
Japan
Prior art keywords
plating
rubber
conductive
pattern
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP951279A
Other languages
Japanese (ja)
Other versions
JPS6057517B2 (en
Inventor
Tatsuyuki Tomioka
Kiyoharu Yamashita
Mitsuo Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP951279A priority Critical patent/JPS6057517B2/en
Publication of JPS55104496A publication Critical patent/JPS55104496A/en
Publication of JPS6057517B2 publication Critical patent/JPS6057517B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To enable to form a sharp plating film at a minute part, by pushing out non-plating part by anisoyropic electroconductive rubber connected with cathode and plating the exposure part, at the time of carrying out partial plating of conductive body pattern on insulating substrate.
CONSTITUTION: At the time of carrying out partial plating of a fixed part of the conductive pattern 2 on the insulation substrate 1 such as ceramic substrate, etc., the anisotropic conductive rubber 8 filling graphite fiber or metal fiber in silicone rubber, is pressed against non-plating part of the pattern 2 and the above part is sealed. Then, the conductor 4 connceted with the cathode at the upper part of the rubber 8 and the insulating material 5, are combined with conductive bonding agent and the pattern 2 and the cathode are connected electrically. By carrying out the plating in such a condition, side face of the rubber 8 is not plated as isoelectric rubber of usual method because the above face is not conductive and the sharp partial plating layer 9 is formed.
COPYRIGHT: (C)1980,JPO&Japio
JP951279A 1979-01-29 1979-01-29 Partial plating method Expired JPS6057517B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP951279A JPS6057517B2 (en) 1979-01-29 1979-01-29 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP951279A JPS6057517B2 (en) 1979-01-29 1979-01-29 Partial plating method

Publications (2)

Publication Number Publication Date
JPS55104496A true JPS55104496A (en) 1980-08-09
JPS6057517B2 JPS6057517B2 (en) 1985-12-16

Family

ID=11722292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP951279A Expired JPS6057517B2 (en) 1979-01-29 1979-01-29 Partial plating method

Country Status (1)

Country Link
JP (1) JPS6057517B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163889A (en) * 1983-03-08 1984-09-14 松下電器産業株式会社 Method of partially plating conductor on substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134018U (en) * 1988-03-05 1989-09-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163889A (en) * 1983-03-08 1984-09-14 松下電器産業株式会社 Method of partially plating conductor on substrate
JPH0244157B2 (en) * 1983-03-08 1990-10-02 Matsushita Electric Ind Co Ltd

Also Published As

Publication number Publication date
JPS6057517B2 (en) 1985-12-16

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