GB2582470B - Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication - Google Patents

Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication Download PDF

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Publication number
GB2582470B
GB2582470B GB2007518.0A GB202007518A GB2582470B GB 2582470 B GB2582470 B GB 2582470B GB 202007518 A GB202007518 A GB 202007518A GB 2582470 B GB2582470 B GB 2582470B
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United Kingdom
Prior art keywords
semiconductor device
phase change
aspect ratio
change material
high aspect
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GB2007518.0A
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English (en)
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GB2582470A (en
GB202007518D0 (en
Inventor
Bruce Robert
Joseph Brightsky Matthew
Masuda Takeshi
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Ulvac Inc
International Business Machines Corp
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Ulvac Inc
International Business Machines Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/021Formation of switching materials, e.g. deposition of layers
    • H10N70/023Formation of switching materials, e.g. deposition of layers by chemical vapor deposition, e.g. MOCVD, ALD
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • H10N70/066Shaping switching materials by filling of openings, e.g. damascene method
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/828Current flow limiting means within the switching material region, e.g. constrictions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/041Modification of switching materials after formation, e.g. doping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Shaping switching materials
    • H10N70/063Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H10N70/8265Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices on sidewalls of dielectric structures, e.g. mesa-shaped or cup-shaped devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • H10N70/8413Electrodes adapted for resistive heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8825Selenides, e.g. GeSe

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Chemical Vapour Deposition (AREA)
GB2007518.0A 2017-11-03 2018-10-30 Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication Active GB2582470B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/803,349 US10141503B1 (en) 2017-11-03 2017-11-03 Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication
PCT/IB2018/058468 WO2019087050A1 (en) 2017-11-03 2018-10-30 Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication

Publications (3)

Publication Number Publication Date
GB202007518D0 GB202007518D0 (en) 2020-07-01
GB2582470A GB2582470A (en) 2020-09-23
GB2582470B true GB2582470B (en) 2021-05-19

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GB2007518.0A Active GB2582470B (en) 2017-11-03 2018-10-30 Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication

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US (2) US10141503B1 (enExample)
JP (1) JP7267271B2 (enExample)
CN (1) CN111279500B (enExample)
DE (1) DE112018004630B4 (enExample)
GB (1) GB2582470B (enExample)
WO (1) WO2019087050A1 (enExample)

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US12279538B2 (en) * 2019-12-19 2025-04-15 Shanghai Integrated Circuit Equipment & Materials Industry Innovation Center Co., Ltd Phase change memory unit and preparation method therefor
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KR20220039629A (ko) * 2020-09-22 2022-03-29 에이에스엠 아이피 홀딩 비.브이. 게르마늄 칼코지나이드를 포함한 층을 증착하기 위한 시스템, 소자, 및 방법
US11665985B2 (en) * 2020-11-23 2023-05-30 International Business Machines Corporation Projected memory device with reduced minimum conductance state
KR20220071026A (ko) 2020-11-23 2022-05-31 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 제조 방법
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US11476418B2 (en) * 2020-12-08 2022-10-18 International Business Machines Corporation Phase change memory cell with a projection liner
US12150392B2 (en) * 2020-12-22 2024-11-19 International Business Machines Corporation Transfer length phase change material (PCM) based bridge cell
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Also Published As

Publication number Publication date
DE112018004630T5 (de) 2020-07-16
US10141503B1 (en) 2018-11-27
DE112018004630B4 (de) 2022-02-03
JP2021501987A (ja) 2021-01-21
JP7267271B2 (ja) 2023-05-01
CN111279500B (zh) 2023-12-22
US10886464B2 (en) 2021-01-05
GB2582470A (en) 2020-09-23
CN111279500A (zh) 2020-06-12
GB202007518D0 (en) 2020-07-01
WO2019087050A1 (en) 2019-05-09
US20190140171A1 (en) 2019-05-09

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