GB2582470B - Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication - Google Patents
Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication Download PDFInfo
- Publication number
- GB2582470B GB2582470B GB2007518.0A GB202007518A GB2582470B GB 2582470 B GB2582470 B GB 2582470B GB 202007518 A GB202007518 A GB 202007518A GB 2582470 B GB2582470 B GB 2582470B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- phase change
- aspect ratio
- change material
- high aspect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012782 phase change material Substances 0.000 title 1
- 239000011148 porous material Substances 0.000 title 1
- 238000005389 semiconductor device fabrication Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/023—Formation of switching materials, e.g. deposition of layers by chemical vapor deposition, e.g. MOCVD, ALD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/828—Current flow limiting means within the switching material region, e.g. constrictions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of switching materials after formation, e.g. doping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
- H10N70/8265—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices on sidewalls of dielectric structures, e.g. mesa-shaped or cup-shaped devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/803,349 US10141503B1 (en) | 2017-11-03 | 2017-11-03 | Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication |
| PCT/IB2018/058468 WO2019087050A1 (en) | 2017-11-03 | 2018-10-30 | Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB202007518D0 GB202007518D0 (en) | 2020-07-01 |
| GB2582470A GB2582470A (en) | 2020-09-23 |
| GB2582470B true GB2582470B (en) | 2021-05-19 |
Family
ID=64315486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2007518.0A Active GB2582470B (en) | 2017-11-03 | 2018-10-30 | Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10141503B1 (enExample) |
| JP (1) | JP7267271B2 (enExample) |
| CN (1) | CN111279500B (enExample) |
| DE (1) | DE112018004630B4 (enExample) |
| GB (1) | GB2582470B (enExample) |
| WO (1) | WO2019087050A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10141503B1 (en) | 2017-11-03 | 2018-11-27 | International Business Machines Corporation | Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication |
| US10825514B2 (en) * | 2018-04-20 | 2020-11-03 | International Business Machines Corporation | Bipolar switching operation of confined phase change memory for a multi-level cell memory |
| US11158788B2 (en) * | 2018-10-30 | 2021-10-26 | International Business Machines Corporation | Atomic layer deposition and physical vapor deposition bilayer for additive patterning |
| US11482669B2 (en) * | 2019-09-10 | 2022-10-25 | Globalfoundries Singapore Pte. Ltd. | Memory device and a method for forming the memory device |
| CN112635661B (zh) * | 2019-10-09 | 2023-08-01 | 联华电子股份有限公司 | 多位可变电阻式存储器单元及其形成方法 |
| US12279538B2 (en) * | 2019-12-19 | 2025-04-15 | Shanghai Integrated Circuit Equipment & Materials Industry Innovation Center Co., Ltd | Phase change memory unit and preparation method therefor |
| US11380843B2 (en) * | 2020-02-13 | 2022-07-05 | International Business Machines Corporation | Phase change memory using multiple stacks of PCM materials |
| KR102766575B1 (ko) | 2020-04-07 | 2025-02-12 | 삼성전자주식회사 | 메모리 소자 |
| US11251370B1 (en) * | 2020-08-12 | 2022-02-15 | International Business Machines Corporation | Projected memory device with carbon-based projection component |
| CN112133825A (zh) * | 2020-09-03 | 2020-12-25 | 中国科学院上海微系统与信息技术研究所 | 一种高稳定性相变存储单元及其制备方法 |
| KR20220039629A (ko) * | 2020-09-22 | 2022-03-29 | 에이에스엠 아이피 홀딩 비.브이. | 게르마늄 칼코지나이드를 포함한 층을 증착하기 위한 시스템, 소자, 및 방법 |
| US11665985B2 (en) * | 2020-11-23 | 2023-05-30 | International Business Machines Corporation | Projected memory device with reduced minimum conductance state |
| KR20220071026A (ko) | 2020-11-23 | 2022-05-31 | 에스케이하이닉스 주식회사 | 반도체 장치 및 반도체 장치의 제조 방법 |
| US11456413B2 (en) | 2020-11-27 | 2022-09-27 | International Business Machines Corporation | In-situ drift-mitigation liner for pillar cell PCM |
| US11456415B2 (en) | 2020-12-08 | 2022-09-27 | International Business Machines Corporation | Phase change memory cell with a wrap around and ring type of electrode contact and a projection liner |
| US11476418B2 (en) * | 2020-12-08 | 2022-10-18 | International Business Machines Corporation | Phase change memory cell with a projection liner |
| US12150392B2 (en) * | 2020-12-22 | 2024-11-19 | International Business Machines Corporation | Transfer length phase change material (PCM) based bridge cell |
| US11545624B2 (en) | 2021-03-29 | 2023-01-03 | International Business Machines Corporation | Phase change memory cell resistive liner |
| US12245530B2 (en) | 2021-06-25 | 2025-03-04 | International Business Machines Corporation | Phase change memory with concentric ring-shaped heater |
| US12219884B2 (en) | 2021-06-25 | 2025-02-04 | International Business Machines Corporation | Phase change memory with conductive rings |
| US12408571B2 (en) | 2021-06-25 | 2025-09-02 | International Business Machines Corporation | Phase change memory with graded heater |
| US11980111B2 (en) * | 2021-09-08 | 2024-05-07 | International Business Machines Corporation | Confined bridge cell phase change memory |
| US12274185B2 (en) | 2021-10-19 | 2025-04-08 | International Business Machines Corporation | Phase change memory cell having pillar bottom electrode with improved thermal insulation |
| US12495722B2 (en) | 2021-12-06 | 2025-12-09 | International Business Machines Corporation | Suppression of void-formation of PCM materials |
| US12274186B2 (en) | 2022-06-07 | 2025-04-08 | International Business Machines Corporation | Low current phase-change memory device |
| CN115768130B (zh) * | 2022-11-28 | 2025-10-28 | 厦门半导体工业技术研发有限公司 | 一种半导体集成电路器件及其制造方法 |
| CN119008598A (zh) * | 2023-05-16 | 2024-11-22 | 台湾积体电路制造股份有限公司 | 电容器结构的制造方法 |
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-
2017
- 2017-11-03 US US15/803,349 patent/US10141503B1/en active Active
-
2018
- 2018-10-03 US US16/151,052 patent/US10886464B2/en active Active
- 2018-10-30 JP JP2020521989A patent/JP7267271B2/ja active Active
- 2018-10-30 GB GB2007518.0A patent/GB2582470B/en active Active
- 2018-10-30 CN CN201880070625.1A patent/CN111279500B/zh active Active
- 2018-10-30 DE DE112018004630.3T patent/DE112018004630B4/de active Active
- 2018-10-30 WO PCT/IB2018/058468 patent/WO2019087050A1/en not_active Ceased
Patent Citations (5)
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| US20030003634A1 (en) * | 2001-06-30 | 2003-01-02 | Lowrey Tyler A. | Utilizing atomic layer deposition for programmable device |
| US20090189138A1 (en) * | 2008-01-28 | 2009-07-30 | Macronix International Co., Ltd. | Fill-in etching free pore device |
| US20120322223A1 (en) * | 2011-05-17 | 2012-12-20 | Samsung Electronics Co., Ltd. | Methods of manufacturing phase-change memory devices |
| US20150041747A1 (en) * | 2013-08-06 | 2015-02-12 | Samsung Electronics Co., Ltd. | Phase change material layers |
| US20170222141A1 (en) * | 2014-02-27 | 2017-08-03 | International Business Machines Corporation | Metal nitride keyhole or spacer phase change memory cell structures |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112018004630T5 (de) | 2020-07-16 |
| US10141503B1 (en) | 2018-11-27 |
| DE112018004630B4 (de) | 2022-02-03 |
| JP2021501987A (ja) | 2021-01-21 |
| JP7267271B2 (ja) | 2023-05-01 |
| CN111279500B (zh) | 2023-12-22 |
| US10886464B2 (en) | 2021-01-05 |
| GB2582470A (en) | 2020-09-23 |
| CN111279500A (zh) | 2020-06-12 |
| GB202007518D0 (en) | 2020-07-01 |
| WO2019087050A1 (en) | 2019-05-09 |
| US20190140171A1 (en) | 2019-05-09 |
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