GB2256968A - Connections in semiconductor memory devices - Google Patents

Connections in semiconductor memory devices Download PDF

Info

Publication number
GB2256968A
GB2256968A GB9212830A GB9212830A GB2256968A GB 2256968 A GB2256968 A GB 2256968A GB 9212830 A GB9212830 A GB 9212830A GB 9212830 A GB9212830 A GB 9212830A GB 2256968 A GB2256968 A GB 2256968A
Authority
GB
United Kingdom
Prior art keywords
voltage source
lines
ground
guard ring
semiconductor memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9212830A
Other languages
English (en)
Other versions
GB9212830D0 (en
Inventor
Young-Ho Seo
Hyoung-Kyu Yim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9212830D0 publication Critical patent/GB9212830D0/en
Publication of GB2256968A publication Critical patent/GB2256968A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • H01L23/5286Arrangements of power or ground buses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0214Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0218Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
GB9212830A 1991-06-19 1992-06-17 Connections in semiconductor memory devices Withdrawn GB2256968A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910010194A KR930001392A (ko) 1991-06-19 1991-06-19 반도체 메모리 장치의 전원 접지선 배선방법

Publications (2)

Publication Number Publication Date
GB9212830D0 GB9212830D0 (en) 1992-07-29
GB2256968A true GB2256968A (en) 1992-12-23

Family

ID=19316015

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9212830A Withdrawn GB2256968A (en) 1991-06-19 1992-06-17 Connections in semiconductor memory devices

Country Status (7)

Country Link
JP (1) JPH0719851B2 (ko)
KR (1) KR930001392A (ko)
DE (1) DE4219927A1 (ko)
FR (1) FR2678109B1 (ko)
GB (1) GB2256968A (ko)
IT (1) IT1258990B (ko)
TW (1) TW245835B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249166B1 (ko) * 1997-03-07 2000-03-15 김영환 이에스디(esd) 보호회로 및 그 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2087183A (en) * 1980-11-07 1982-05-19 Hitachi Ltd Semiconductor integrated circuit device
GB2199695A (en) * 1987-01-06 1988-07-13 Samsung Semiconductor Inc Dynamic random access memory with selective well biasing
EP0283046A2 (en) * 1987-03-18 1988-09-21 Nec Corporation Complementary integrated circuit device equipped with latch-up preventing means

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922357A (ja) * 1982-07-28 1984-02-04 Toshiba Corp Cmos形半導体集積回路
JPH0693497B2 (ja) * 1986-07-30 1994-11-16 日本電気株式会社 相補型mis集積回路

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2087183A (en) * 1980-11-07 1982-05-19 Hitachi Ltd Semiconductor integrated circuit device
GB2199695A (en) * 1987-01-06 1988-07-13 Samsung Semiconductor Inc Dynamic random access memory with selective well biasing
EP0283046A2 (en) * 1987-03-18 1988-09-21 Nec Corporation Complementary integrated circuit device equipped with latch-up preventing means

Also Published As

Publication number Publication date
ITMI921460A0 (it) 1992-06-12
JPH06112435A (ja) 1994-04-22
ITMI921460A1 (it) 1993-12-12
IT1258990B (it) 1996-03-11
KR930001392A (ko) 1993-01-16
FR2678109A1 (fr) 1992-12-24
GB9212830D0 (en) 1992-07-29
JPH0719851B2 (ja) 1995-03-06
DE4219927A1 (de) 1992-12-24
FR2678109B1 (fr) 1994-01-21
TW245835B (ko) 1995-04-21

Similar Documents

Publication Publication Date Title
KR930011797B1 (ko) 반도체 집적회로장치
US6417721B2 (en) Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice
JPS6336557A (ja) 相補型mis集積回路
US20020085329A1 (en) Electrostatic discharge protection circuit
KR100194312B1 (ko) 정전 파괴 보호 회로를 구비한 반도체 디바이스
US5646434A (en) Semiconductor component with protective structure for protecting against electrostatic discharge
EP0283046B1 (en) Complementary integrated circuit device equipped with latch-up preventing means
JPH09275191A (ja) 半導体集積回路及びそれを使用した回路装置
GB2256968A (en) Connections in semiconductor memory devices
KR970017607A (ko) 반도체 집적회로
JP3111938B2 (ja) 半導体装置
JPH08330521A (ja) 半導体装置
US5923076A (en) Integrated device with pads
US5608594A (en) Semiconductor integrated circuit with surge-protected output MISFET's
JP2591576B2 (ja) 集積回路装置
KR100631961B1 (ko) 정전기 방전 보호 회로
US5994943A (en) Data output circuits having enhanced ESD resistance and related methods
JPH05102393A (ja) 半導体装置
KR100189989B1 (ko) 패드를 이용한 커패시터를 갖춘 반도체 장치
JP7020981B2 (ja) 半導体装置
JPH0440863B2 (ko)
JPH11243639A (ja) 半導体回路
JP2002110798A (ja) 半導体装置およびそのレイアウト方法
JP3055233B2 (ja) 入力バッファ回路
JPH0448773A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)