JP2591576B2 - 集積回路装置 - Google Patents
集積回路装置Info
- Publication number
- JP2591576B2 JP2591576B2 JP5048748A JP4874893A JP2591576B2 JP 2591576 B2 JP2591576 B2 JP 2591576B2 JP 5048748 A JP5048748 A JP 5048748A JP 4874893 A JP4874893 A JP 4874893A JP 2591576 B2 JP2591576 B2 JP 2591576B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- leads
- signal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 10
- 230000001939 inductive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
し、特に、複数のリード線を有する半導体集積回路装置
に関する。
高まっている。このように素子の実装密度が大きくなる
と、それに関連するリード線の数も増加する。実際、2
56本のリード線を有する集積回路も市販されている。
このようなリード線は、主にチップ駆動回路(外部の相
互接続を行うIC出力)と、接地リターンと、電力線
と、他の信号線等である。一般的に、図1、2、3にお
いて、リード線10がシリコンチップから出ており、図
1ではリードフレーム20に、図2、3では回路基板3
0に接続されている。そして、これらのリード線10
は、最小の間隔が0.004インチで、その直径は最小
のもので0.001インチで、その長さは0.10イン
チである。一般的に、シリコンウェーハからリードフレ
ームあるいは回路ボードへの接続はワイヤボンディング
によりなされている。このリード線の長さはその機械的
設備により制限され、0.04インチ以下にすることは
不可能である。しかし、このリード線の長さを減少させ
て、リード線のインダクタンスを減少させることが望ま
れている。
ドに戻るAC信号は共通の接地リード間に電位差を生成
する(このAC信号はデジタル信号情報を含む)。同一
方向で急速に切り替えるチップ駆動回路を多数有する集
積回路においては(16チップ駆動回路は1ナノ秒でス
イッチングし、さらに、32チップ駆動回路も1ナノ秒
でスイッチングする)、このように接地電位差に差があ
ると、誘導ノイズの問題は重要である。すなわち、図4
において、誘導的遷位電位差は、集積回路45の接地面
42と集積回路間を接続する相互接続に関連する接地面
41との差である。この接地面の間のポテンシャル電位
差は情報処理に際し、エラーを生成することがある。こ
れに対し、電力リードの誘導性ノイズの問題は電力変動
を減少するために、チップに極めて近接して配置される
バイパスキャパシターのために、それほど問題とはなら
ない。
替えの数、即ち、接地リターンインダクタンス(貫通導
体43、接地面41、貫通導体70、リード線10、貫
通導体44を含む)に比例し、接地リターンの数に反比
例する。かくして、誘導性接地電位は大きくなり、変化
の比率が増大し、その結果、データ速度の増加、また
は、立ち上がりTrの減少、電流差△Iの増加(立ち上
がり時間の間に発生する)とチップ駆動リードNdの数
の増加と共にエラーが増加する。一般的に△INd/Tr
の値は16ma/ns以上で、エラー率は大きくなり、
32ma/ns以上になると、さらに問題となる。(ア
ナログ信号においては、このような数字は妥当である
が、ICがアナログとデジタルの両方の回路を有する場
合にはデジタル要素からのエラーが支配的となる)
試み得られている。例えば、非線形回路に関しでは、米
国特許第4398106号明細書で提案されている。さ
らに、ハンダバンプリードが提案され、少なくとも部分
的にインダクタンスを減少させることができる。このア
プローチにおいては、ハンダの小さなノードが集積回路
の上の電気接点に存在する。そして、このハンダに対応
するノードがプリント回路基板にも存在する。このハン
ダバンプの整合とリフローが、複数の比較的低インピー
ダンス接続を形成する。しかし、このハンダバンプの使
用及び近年採用されている技術は、従来のワイヤボンデ
ィングよりも高価で、従来のワイヤボンドの信頼性まで
達成することができない。
回路をワイヤボンディングする際において、誘導性ノイ
ズを生成することのない接続方法を提供しようとするも
のである。
に関連するエラーを減少するために、チップ駆動リード
線(一次リード線51)と集積回路に接続される対応リ
ード線(二次リード線52)とを有する。このチップ駆
動リード線は、出力信号を伝播する線(これは接地線、
あるいは入力信号のみ、あるいは電力供給線を含まな
い)で、ここで、チップ駆動リード線を駆動する回路
は、信号立ち上がり時間の二倍以内に、出力信号を少な
くとも8本の他のリード線に付加するように、信号を付
加する。信号がリード線に付加するこの時間は、最大振
幅の10%に到達する時間である。各二次リード線は集
積回路内で内部的に接続されて、いつでも二次リード線
を流れる電流は同一の振幅であるが、逆符号の信号で、
これはAC電流が一次リード線を流れる際にも起きる。
ペア線の各リード線は、互いに、あるいは接地線から所
定距離離間して保持され、このペア線により得られたイ
ンピーダンスは、回路の他の部分のインピーダンスに適
合する。このペア線は、更に、他のICのような相互接
続装置内のチップレシーバに接続される。
リード線51の電流は、関連する第2リード52に戻
る。それ故に、接地インダクタンスを有する共通接地リ
ード(貫通導体と接地面)を介して戻る電流は存在しな
いか、あるいは、存在しても極めて少ない。このよう
に、1本のリード線を各チップドライバに追加すること
により、全体のリード線の数はそれほど増加しない。か
くして、複雑な構成をとること無しに、誘導性ノイズか
ら発生するエラーは極めて減少し、従来のワイヤボンド
技術が使用できる。実際、立ち上がり時間が100ps
の160maの全駆動回路信号にとって、誘導性ノイズ
から発生する信号エラーは、各チップドライバ回路に対
し、マッチングリード線(第2リード)を有さない素子
とは対照的に、ほとんどない。32ビット/1ワードを
ベースにしたデジタル技術に必要とされる多くのチップ
ドライバ54を同時切り替えることができる。副産物と
して、本発明はクロストークを減少させ、ノイズ不感受
性を増加させる。
路のチップ駆動リードに一対の第1リード51、第2リ
ード52を追加することにより減少できる。これらのリ
ード線は一次リード線と二次リード線とも称する。この
一次リード線51と二次リード52線は、従来の集積回
路においては、駆動信号伝送リードと考えられる(この
リード線は、例えば、電力リード、接地リード、入力信
号のみ用のリードに対して、外部相互接続を行う)。二
次リード線52は、相補的AC電流を伝送するよう駆動
され、この相補的AC電流とは、一次リード線と同一の
振幅で、符号が反対のものを指す。本明細書において、
AC電流とはデジタル信号をも含む意味で広義に解釈さ
れたい。一次リード線51と二次リード線52は、集積
回路の駆動リード線から相互接続路を介して、他の集積
回路のチップ受信回路にまで接続されている。
駆動メカニズムは公知である。例えば、MECL SYSTEM DE
DIGN HANDBOOK(「モトローラ半導体製品」、1980
年5月)に記載されているように、一般的な集積回路駆
動装置は対応する反転信号を生成する必要があり、それ
らは多くのIC(すなわちバランスドライバ54)内の
に存在するが、これらは誘導性ノイズを減少する目的に
は使用されていない。かくして、これらの駆動回路は、
一次出力と二次出力とを生成する。この駆動回路は一次
リード線51にパルス状の信号を二次リード線52上に
一次信号と同一振幅で180度位相の異なる対応するパ
ルス状の出力を生成する。
状は、電気システムのそれにマッチするインピーダンス
を生成するよう保持される。今日、バランスインピーダ
ンスは90−110オームの範囲に限定されている。一
次/二次線対のインピーダンスは、これらリード線の分
離と接地電位に保持されている導体に対する各リード線
の分離に依存する。一般的に、プリント回路基板、ある
いはプリント回路基板の接地面41は、例えば、マイク
ロスクリップ伝送ラインを形成するよう接地点で保持さ
れる。それ故に、このインピーダンスは主に一次リード
線51と二次リード線52との間のスペース56とプリ
ント回路基板の接地面からの高さに依存する。一般的に
インピーダンスは以下の式により決定される。
体と二次導体との間のスペース、r0=W+s0、h=接
地面の高さ+t0/2、d=2h、p=2(W+t0)、
εr=比誘電体率。一般的に、W=6ミル、t0=0.5
ミル、s0=4ミル、εr=4.2で、接地面からのこれ
ら導体の高さは5−20ミルの範囲で、インピーダンス
を所定の範囲内におさめる。尚、ミルは1/1000イ
ンチである。
次信号リードを有する必要がある。すなわち、二次リー
ドに印加される信号は、一次リードのそれと対応するも
の(同一振幅、反転符号)である。この関連二次リード
線を用いることにより、少なくとも20%、好ましくは
50%、最大90%までの同時切り替えノイズにより誘
起されるエラーを減少させることができる。それ故に、
32本一次リード線と30本の二次リード線を用いると
(かくして2本の無バランスドライバ57になり)、9
4%がエラーの減少に作用する。同様に32本の一次リ
ード線と(各リード線は10maのデジタル信号を伝送
し)、そして32本の二次リード線は(それぞれ9ma
のデジタル信号を伝送する)と90%の保証が得られ
た。従って、対応一次リード線は正確にまねる二次AC
電流に加えて、一次リード線よりも少ない二次リード線
を追加することにより、精度を向上させることができ
る。
リード線を追加することにより、エラーを減少させるこ
とができる。
とリードフレーム20との接続方法を示す側面図であ
る。
す図である。
す図である。
装置の斜視図である。
回路装置の斜視図である。
Claims (2)
- 【請求項1】 回路基板(30)上に形成された集積回
路と、 前記集積回路を駆動するチップドライバー(54)と、 前記集積回路の端子と前記チップドライバーとを接続す
る一対の電気信号駆動用出力リード線(51、52)と
を有する集積回路装置において、 前記一対のリード線は、互いに同一の振幅で、符号が異
なる信号を伝送することを特徴とする集積回路装置。 - 【請求項2】 前記一対リード線は、それぞれチップド
ライバー(54)の正信号ポートと反転信号ポートから
取り出されることを特徴とする請求項1の集積回路装
置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84113992A | 1992-02-25 | 1992-02-25 | |
US841139 | 1992-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0613421A JPH0613421A (ja) | 1994-01-21 |
JP2591576B2 true JP2591576B2 (ja) | 1997-03-19 |
Family
ID=25284121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5048748A Expired - Lifetime JP2591576B2 (ja) | 1992-02-25 | 1993-02-16 | 集積回路装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5329170A (ja) |
EP (1) | EP0558226B1 (ja) |
JP (1) | JP2591576B2 (ja) |
KR (1) | KR100260664B1 (ja) |
DE (1) | DE69330411T2 (ja) |
TW (1) | TW214631B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5761049A (en) * | 1994-09-19 | 1998-06-02 | Hitachi, Ltd. | Inductance cancelled condenser implemented apparatus |
US6452442B1 (en) | 1995-12-04 | 2002-09-17 | Intel Corporation | Apparatus for obtaining noise immunity in electrical circuits |
DE19927285C2 (de) | 1999-06-15 | 2003-05-22 | Eupec Gmbh & Co Kg | Niederinduktives Halbleiterbauelement |
TW200501580A (en) * | 2003-06-23 | 2005-01-01 | Mitac Technology Corp | Offset circuit for constraining electromagnetic interference and operation method thereof |
EP3017471B1 (en) * | 2013-07-03 | 2020-03-11 | Rosenberger Hochfrequenztechnik GmbH & Co. KG | Die package with low electromagnetic interference interconnection |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3383618A (en) * | 1966-03-10 | 1968-05-14 | Bell Telephone Labor Inc | Suppression of intermodulation distortion |
US3584235A (en) * | 1968-10-18 | 1971-06-08 | Bell Telephone Labor Inc | Video defect eliminator |
US4398106A (en) * | 1980-12-19 | 1983-08-09 | International Business Machines Corporation | On-chip Delta-I noise clamping circuit |
KR910002302B1 (ko) * | 1986-02-07 | 1991-04-11 | 후지쓰 가부시끼가이샤 | 반도체 장치 |
US4816984A (en) * | 1987-02-06 | 1989-03-28 | Siemens Aktiengesellschaft | Bridge arm with transistors and recovery diodes |
US5006820A (en) * | 1989-07-03 | 1991-04-09 | Motorola, Inc. | Low reflection input configuration for integrated circuit packages |
-
1992
- 1992-04-10 TW TW081102783A patent/TW214631B/zh active
-
1993
- 1993-02-16 JP JP5048748A patent/JP2591576B2/ja not_active Expired - Lifetime
- 1993-02-17 DE DE69330411T patent/DE69330411T2/de not_active Expired - Lifetime
- 1993-02-17 EP EP93301117A patent/EP0558226B1/en not_active Expired - Lifetime
- 1993-02-22 KR KR1019930002428A patent/KR100260664B1/ko not_active IP Right Cessation
- 1993-12-13 US US08/166,342 patent/US5329170A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5329170A (en) | 1994-07-12 |
EP0558226A2 (en) | 1993-09-01 |
DE69330411T2 (de) | 2002-05-29 |
JPH0613421A (ja) | 1994-01-21 |
DE69330411D1 (de) | 2001-08-16 |
EP0558226B1 (en) | 2001-07-11 |
KR930018710A (ko) | 1993-09-22 |
TW214631B (ja) | 1993-10-11 |
EP0558226A3 (ja) | 1994-03-23 |
KR100260664B1 (ko) | 2000-07-01 |
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