GB2111746B - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
GB2111746B
GB2111746B GB08233407A GB8233407A GB2111746B GB 2111746 B GB2111746 B GB 2111746B GB 08233407 A GB08233407 A GB 08233407A GB 8233407 A GB8233407 A GB 8233407A GB 2111746 B GB2111746 B GB 2111746B
Authority
GB
United Kingdom
Prior art keywords
plate
bottom plate
metalized layer
stepped portion
silver solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08233407A
Other languages
English (en)
Other versions
GB2111746A (en
Inventor
Shinobu Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB2111746A publication Critical patent/GB2111746A/en
Application granted granted Critical
Publication of GB2111746B publication Critical patent/GB2111746B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/68—
    • H10W74/114—
    • H10W76/157—
    • H10W76/47—
    • H10W72/381—
    • H10W72/5363—
    • H10W72/5475—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB08233407A 1981-11-30 1982-11-23 Semiconductor package Expired GB2111746B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56194698A JPS5893358A (ja) 1981-11-30 1981-11-30 半導体装置

Publications (2)

Publication Number Publication Date
GB2111746A GB2111746A (en) 1983-07-06
GB2111746B true GB2111746B (en) 1985-09-25

Family

ID=16328778

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08233407A Expired GB2111746B (en) 1981-11-30 1982-11-23 Semiconductor package

Country Status (4)

Country Link
US (1) US4677741A (cg-RX-API-DMAC10.html)
JP (1) JPS5893358A (cg-RX-API-DMAC10.html)
DE (1) DE3243689A1 (cg-RX-API-DMAC10.html)
GB (1) GB2111746B (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235658A (ja) * 1985-08-09 1987-02-16 Fuji Electric Co Ltd 半導体装置
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
US5182628A (en) * 1989-06-28 1993-01-26 Hitachi, Ltd. Semiconductor device having particular solder interconnection arrangement
US5285690A (en) * 1992-01-24 1994-02-15 The Foxboro Company Pressure sensor having a laminated substrate
US5313091A (en) * 1992-09-28 1994-05-17 Sundstrand Corporation Package for a high power electrical component
US5297001A (en) * 1992-10-08 1994-03-22 Sundstrand Corporation High power semiconductor assembly
KR100322177B1 (ko) 1993-12-27 2002-05-13 이누이 도모지 내연기관용점화장치
DE10221857A1 (de) * 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
US7209366B2 (en) * 2004-03-19 2007-04-24 Intel Corporation Delivery regions for power, ground and I/O signal paths in an IC package
DE102006022254B4 (de) * 2006-05-11 2008-12-11 Infineon Technologies Ag Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Anordnung für eine Mehrzahl von Halbleiterbauteilen und Verfahren zur Herstellung von Halbleiterbauteilen
US8049323B2 (en) * 2007-02-16 2011-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Chip holder with wafer level redistribution layer
CN103094129B (zh) * 2011-10-28 2016-04-06 无锡华润安盛科技有限公司 一种半导体器件封装工艺
CN103311133B (zh) * 2013-05-20 2015-11-04 临海市志鼎电子科技有限公司 一种功率半导体模块焊接前倒装工艺

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2921245A (en) * 1958-10-08 1960-01-12 Int Rectifier Corp Hermetically sealed junction means
US3223903A (en) * 1961-02-24 1965-12-14 Hughes Aircraft Co Point contact semiconductor device with a lead having low effective ratio of length to diameter
US3141226A (en) * 1961-09-27 1964-07-21 Hughes Aircraft Co Semiconductor electrode attachment
DE1231811B (de) * 1962-04-06 1967-01-05 Bosch Gmbh Robert Halbleiteranordnung
US3241011A (en) * 1962-12-26 1966-03-15 Hughes Aircraft Co Silicon bonding technology
GB1163785A (en) * 1965-12-22 1969-09-10 Texas Instruments Inc Composite Header for a Semiconductor Device
JPS4810904B1 (cg-RX-API-DMAC10.html) * 1969-03-12 1973-04-09
US3681513A (en) * 1971-01-26 1972-08-01 American Lava Corp Hermetic power package
US3793064A (en) * 1971-11-15 1974-02-19 Du Pont Product and process for cavity metallization of semiconductor packages
US3964155A (en) * 1972-02-23 1976-06-22 The United States Of America As Represented By The Secretary Of The Navy Method of planar mounting of silicon solar cells
DE2230863C2 (de) * 1972-06-23 1981-10-08 Intersil Inc., Cupertino, Calif. Gehäuse für ein Halbleiterelement
US3908185A (en) * 1974-03-06 1975-09-23 Rca Corp High frequency semiconductor device having improved metallized patterns
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
JPS5336468A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Package for integrated circuit
US4176443A (en) * 1977-03-08 1979-12-04 Sgs-Ates Componenti Elettronici S.P.A. Method of connecting semiconductor structure to external circuits
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
JPS5450269A (en) * 1977-09-28 1979-04-20 Nec Home Electronics Ltd Semiconductor device
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
JPS54140468A (en) * 1978-04-24 1979-10-31 Hitachi Ltd Glass sealing package type device and its manufacture
JPS5568661A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Structure for mounting power transistor
DE3030763A1 (de) * 1979-08-17 1981-03-26 Amdahl Corp., Sunnyvale, Calif. Packung fuer eine integrierte schaltung in plaettchenform
DE3028178C2 (de) * 1980-07-25 1985-05-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiter-Modul

Also Published As

Publication number Publication date
GB2111746A (en) 1983-07-06
US4677741A (en) 1987-07-07
DE3243689C2 (cg-RX-API-DMAC10.html) 1987-12-23
JPS5893358A (ja) 1983-06-03
JPS6146061B2 (cg-RX-API-DMAC10.html) 1986-10-11
DE3243689A1 (de) 1983-06-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951123