JPS4810904B1 - - Google Patents

Info

Publication number
JPS4810904B1
JPS4810904B1 JP44018330A JP1833069A JPS4810904B1 JP S4810904 B1 JPS4810904 B1 JP S4810904B1 JP 44018330 A JP44018330 A JP 44018330A JP 1833069 A JP1833069 A JP 1833069A JP S4810904 B1 JPS4810904 B1 JP S4810904B1
Authority
JP
Japan
Prior art keywords
casing
metallized layer
lead
package
adherent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44018330A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP44018330A priority Critical patent/JPS4810904B1/ja
Priority to US00017207A priority patent/US3729820A/en
Publication of JPS4810904B1 publication Critical patent/JPS4810904B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W76/157—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W72/075—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Coating With Molten Metal (AREA)
JP44018330A 1969-03-12 1969-03-12 Pending JPS4810904B1 (cg-RX-API-DMAC10.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP44018330A JPS4810904B1 (cg-RX-API-DMAC10.html) 1969-03-12 1969-03-12
US00017207A US3729820A (en) 1969-03-12 1970-03-06 Method for manufacturing a package of a semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44018330A JPS4810904B1 (cg-RX-API-DMAC10.html) 1969-03-12 1969-03-12

Publications (1)

Publication Number Publication Date
JPS4810904B1 true JPS4810904B1 (cg-RX-API-DMAC10.html) 1973-04-09

Family

ID=11968601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44018330A Pending JPS4810904B1 (cg-RX-API-DMAC10.html) 1969-03-12 1969-03-12

Country Status (2)

Country Link
US (1) US3729820A (cg-RX-API-DMAC10.html)
JP (1) JPS4810904B1 (cg-RX-API-DMAC10.html)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864728A (en) * 1970-11-20 1975-02-04 Siemens Ag Semiconductor components having bimetallic lead connected thereto
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
US3922775A (en) * 1973-09-13 1975-12-02 Sperry Rand Corp High frequency diode and manufacture thereof
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS6013078B2 (ja) * 1978-09-05 1985-04-04 日本特殊陶業株式会社 金メツキされた電子部品及びその製法
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
US5861670A (en) * 1979-10-04 1999-01-19 Fujitsu Limited Semiconductor device package
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
JPS5893358A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4784974A (en) * 1982-08-05 1988-11-15 Olin Corporation Method of making a hermetically sealed semiconductor casing
US4572924A (en) * 1983-05-18 1986-02-25 Spectrum Ceramics, Inc. Electronic enclosures having metal parts
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
USH498H (en) 1984-08-31 1988-07-05 Electronic component including soldered electrical leads
JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
US4872047A (en) * 1986-11-07 1989-10-03 Olin Corporation Semiconductor die attach system
US4769345A (en) * 1987-03-12 1988-09-06 Olin Corporation Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
US5006963A (en) * 1989-12-18 1991-04-09 Mcdonnell Douglas Corporation Selectable chip carrier
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
FI20031341A7 (fi) * 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
EP2757582A1 (en) * 2013-01-17 2014-07-23 Nxp B.V. Packaged electrical components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3404214A (en) * 1967-07-17 1968-10-01 Alloys Unltd Inc Flat package for semiconductors
US3495023A (en) * 1968-06-14 1970-02-10 Nat Beryllia Corp Flat pack having a beryllia base and an alumina ring

Also Published As

Publication number Publication date
US3729820A (en) 1973-05-01

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