JPS51118390A - Multi layer wiring unig - Google Patents
Multi layer wiring unigInfo
- Publication number
- JPS51118390A JPS51118390A JP4320275A JP4320275A JPS51118390A JP S51118390 A JPS51118390 A JP S51118390A JP 4320275 A JP4320275 A JP 4320275A JP 4320275 A JP4320275 A JP 4320275A JP S51118390 A JPS51118390 A JP S51118390A
- Authority
- JP
- Japan
- Prior art keywords
- unig
- layer wiring
- multi layer
- wiring
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To get wiring unit with high reliability by improving adhesion between wiring layer isolating film and metal wiring conductor layer in thin film integrated circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4320275A JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4320275A JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51118390A true JPS51118390A (en) | 1976-10-18 |
Family
ID=12657333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4320275A Pending JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51118390A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5917266A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | Semiconductor device |
US5200026A (en) * | 1990-05-18 | 1993-04-06 | International Business Machines Corporation | Manufacturing method for multi-layer circuit boards |
US7611982B2 (en) | 2003-04-15 | 2009-11-03 | Tdk Corporation | Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
-
1975
- 1975-04-11 JP JP4320275A patent/JPS51118390A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5917266A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | Semiconductor device |
US5200026A (en) * | 1990-05-18 | 1993-04-06 | International Business Machines Corporation | Manufacturing method for multi-layer circuit boards |
US7611982B2 (en) | 2003-04-15 | 2009-11-03 | Tdk Corporation | Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52101967A (en) | Semiconductor device | |
ES319749A2 (en) | Method of manufacturing an integrated circuit, by selective corrosión, of a coated substrate of multiple layers of perfected pelicula. (Machine-translation by Google Translate, not legally binding) | |
JPS5351985A (en) | Semiconductor wiring constitution | |
JPS51118390A (en) | Multi layer wiring unig | |
JPS51150284A (en) | Semiconductor unvolatile memory unit | |
JPS5258491A (en) | Semiconductor device | |
JPS5356969A (en) | Production of tape for tape carrier | |
JPS5217846A (en) | Liquid crystal indicator | |
JPS51134158A (en) | Electronic watch and its manufacturing method | |
JPS5248371A (en) | Electronic timepiece | |
JPS5257972A (en) | Method of plating conductive layer on circuit substrate | |
JPS5262660A (en) | Copper layer laminated board | |
JPS52129279A (en) | Production of semiconductor device | |
JPS5254963A (en) | Circuit substrate having metalized wiring layer | |
JPS5376728A (en) | Microwave circuit | |
JPS51147289A (en) | Semiconductor device | |
JPS5345149A (en) | Circulator | |
JPS5288067A (en) | Electrical connection method | |
ES338800A1 (en) | Method to produce fine film circuits. (Machine-translation by Google Translate, not legally binding) | |
JPS5267530A (en) | Semiconductor memory circuit | |
JPS53129584A (en) | Connection method of integrated circuit | |
JPS5242076A (en) | Semiconductor | |
CA807339A (en) | Multilayer thin-film coated substrate with metallic parting layer to permit selective sequential etching | |
JPS5429588A (en) | Manufacture for semicomdudtor device | |
JPS5213669A (en) | Thick film circuit substrate |