GB2098800B - Resin encapsulated semiconductor devices - Google Patents

Resin encapsulated semiconductor devices

Info

Publication number
GB2098800B
GB2098800B GB8120607A GB8120607A GB2098800B GB 2098800 B GB2098800 B GB 2098800B GB 8120607 A GB8120607 A GB 8120607A GB 8120607 A GB8120607 A GB 8120607A GB 2098800 B GB2098800 B GB 2098800B
Authority
GB
United Kingdom
Prior art keywords
film
moisture permeability
semiconductor device
semiconductor devices
encapsulated semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8120607A
Other languages
English (en)
Other versions
GB2098800A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Publication of GB2098800A publication Critical patent/GB2098800A/en
Application granted granted Critical
Publication of GB2098800B publication Critical patent/GB2098800B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB8120607A 1981-05-18 1981-07-03 Resin encapsulated semiconductor devices Expired GB2098800B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56075291A JPS57188853A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device

Publications (2)

Publication Number Publication Date
GB2098800A GB2098800A (en) 1982-11-24
GB2098800B true GB2098800B (en) 1986-03-26

Family

ID=13571981

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8120607A Expired GB2098800B (en) 1981-05-18 1981-07-03 Resin encapsulated semiconductor devices

Country Status (3)

Country Link
JP (1) JPS57188853A (https=)
DE (1) DE3126361C2 (https=)
GB (1) GB2098800B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012744A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd 半導体装置
JPS60208358A (ja) * 1984-04-02 1985-10-19 Hitachi Ltd 複合体
JPS60221426A (ja) * 1984-04-17 1985-11-06 Hitachi Chem Co Ltd ポリイミド複合体の製造法
JPS60238817A (ja) * 1984-05-12 1985-11-27 Citizen Watch Co Ltd 液晶表示装置
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS60245150A (ja) * 1984-05-21 1985-12-04 Hitachi Ltd 半導体装置
JPH01110559A (ja) * 1987-10-23 1989-04-27 Hitachi Chem Co Ltd 半導体素子保護膜用組成物
JPH0682649B2 (ja) * 1988-01-08 1994-10-19 日産化学工業株式会社 電気・電子デバイス用絶縁膜
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
JPH05198786A (ja) * 1992-01-22 1993-08-06 Sharp Corp クリアモールドｃｃｄ固体撮像素子
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
DE19741437A1 (de) * 1997-09-19 1999-04-01 Siemens Ag Elektronisches Bauteil mit verbesserter Gehäusepreßmasse
KR100767233B1 (ko) 2000-04-18 2007-10-17 이 잉크 코포레이션 박막 트랜지스터의 제조 공정 및 기판
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
JP5732884B2 (ja) * 2011-02-09 2015-06-10 富士通株式会社 半導体装置及びその製造方法、電源装置
CN105254886A (zh) * 2015-11-02 2016-01-20 株洲时代新材料科技股份有限公司 聚酰胺酸树脂组合物、热塑性聚酰亚胺薄膜及其制备方法
JP6790756B2 (ja) * 2016-11-18 2020-11-25 宇部興産株式会社 ポリイミド、ポリイミド前駆体、及びポリイミドフィルム
CN116478400B (zh) * 2023-02-06 2024-10-18 中山大学 含四联苯衍生结构的聚酰亚胺、二胺单体及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226989B2 (https=) * 1973-05-18 1977-07-18
JPS5176078A (en) * 1974-12-23 1976-07-01 Hitachi Ltd Handaboshokumakuo hodokoshita handotaisochi
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS55156343A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
DE3126361A1 (de) 1982-11-25
JPS57188853A (en) 1982-11-19
GB2098800A (en) 1982-11-24
DE3126361C2 (de) 1986-12-04
JPS628035B2 (https=) 1987-02-20

Similar Documents

Publication Publication Date Title
GB2098800B (en) Resin encapsulated semiconductor devices
FI943021A0 (fi) Organofiilisen kerrossilikaatin hienojakoinen vesidispersio
DE3378605D1 (en) Resin sealed semiconductor devices
DE69429474D1 (de) Epoxy Resin enthaltende weichgemachte Polyvinyl Butyral Schicht
CA2014821A1 (en) Semiconductor integrated circuit device
ATE32518T1 (de) Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen.
EP0174510A3 (en) Epoxy resin composition for encapsulation of semiconductor device
CA2024784A1 (en) Stackable multilayer substrate for mounting integrated circuits
ATE21190T1 (de) Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen.
JPS5354971A (en) Semiconductor device
EP0088557A3 (en) Resin encapsulated semiconductor device
JPS52104087A (en) Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic parts
EP0098079A3 (en) Semiconductor memory device with redundancy decoder circuit
AU550102B2 (en) Semiconductor integrated circuit device
EP0146330A3 (en) Integrated circuit device with textured bar pad
DK0443286T3 (da) Lynafleder til elektriske ledninger
JPS6411337A (en) Semiconductor device
FR2634618B1 (fr) Dispositif formant ouie d'aeration pour boitier de protection electrique ou electronique
IT8520196A0 (it) Scatola per l'installazione, l'isolamento e l'incapsulazione di dispositivi ed apparecchi elettrici, elettronici e pneumatici.
JPS554917A (en) Resin-enclosed semi-conductor device
JPS57103330A (en) Semiconductor device
JPS54105988A (en) Semiconductor memory device
JPS56165341A (en) Semiconductor device
JPS53101980A (en) Semiconductor device
JPS5340278A (en) Manufacture of semiconductor device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930703