ATE32518T1 - Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen. - Google Patents

Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen.

Info

Publication number
ATE32518T1
ATE32518T1 AT83109035T AT83109035T ATE32518T1 AT E32518 T1 ATE32518 T1 AT E32518T1 AT 83109035 T AT83109035 T AT 83109035T AT 83109035 T AT83109035 T AT 83109035T AT E32518 T1 ATE32518 T1 AT E32518T1
Authority
AT
Austria
Prior art keywords
electronic components
calcium silicate
encapsulation
compositions
containing poly
Prior art date
Application number
AT83109035T
Other languages
English (en)
Inventor
James Seward Dix
Original Assignee
Phillips Petroleum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23656015&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE32518(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Phillips Petroleum Co filed Critical Phillips Petroleum Co
Application granted granted Critical
Publication of ATE32518T1 publication Critical patent/ATE32518T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Details Of Resistors (AREA)
AT83109035T 1982-09-14 1983-09-13 Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen. ATE32518T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/417,949 US4482665A (en) 1982-09-14 1982-09-14 Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
EP83109035A EP0103300B2 (de) 1982-09-14 1983-09-13 Einkapselung elektronischer Bauteile mit Calciumsilikat enthaltenden Poly(arylensulfid)-Zusammensetzungen

Publications (1)

Publication Number Publication Date
ATE32518T1 true ATE32518T1 (de) 1988-03-15

Family

ID=23656015

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83109035T ATE32518T1 (de) 1982-09-14 1983-09-13 Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen.

Country Status (6)

Country Link
US (1) US4482665A (de)
EP (1) EP0103300B2 (de)
JP (1) JPS59132506A (de)
AT (1) ATE32518T1 (de)
CA (1) CA1235839A (de)
DE (1) DE3375695D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680326A (en) * 1985-04-16 1987-07-14 Phillips Petroleum Company Poly(arylene sulfide) composition with improved insulation resistance and cracking resistance
US4767841A (en) * 1987-02-24 1988-08-30 Phillips Petroleum Company Arylene sulfide polymer preparation from dehydrated admixture comprising sulfur source, cyclic amide solvent and water
JPH0621169B2 (ja) * 1987-04-06 1994-03-23 ポリプラスチックス株式会社 改良されたポリフエニレンサルフアイド樹脂の製造方法
EP0302648A3 (de) * 1987-08-03 1989-08-09 Polyplastics Co. Ltd. Schweissnaht enthaltender Formkörper aus Polyarylensulfidharz
US5008316A (en) * 1988-02-25 1991-04-16 Hoechst Celanese Corporation Internal lubricant for glass reinforced polyarylene sulfide
JPH07107133B2 (ja) * 1988-11-30 1995-11-15 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
JP2820720B2 (ja) * 1989-06-23 1998-11-05 タキロン株式会社 ポリプロピレン樹脂成型品
KR940003263B1 (ko) * 1989-12-27 1994-04-16 폴리 플라스틱스 가부시끼가이샤 리이드 프레임 삽입용 수지재료와 그 성형부품
US5064936A (en) * 1990-02-20 1991-11-12 Phillips Petroleum Company Process for preparing high extrusion rate arylene sulfide polymers
DE4017243A1 (de) * 1990-05-29 1991-12-05 Bayer Ag Polyarylensulfide zur herstellung von reflektoren
US5175243A (en) * 1990-11-14 1992-12-29 Phillips Petroleum Company Process for preparing arylene sulfide polymers with halo benzene containing deactivating group
US5115093A (en) * 1990-11-23 1992-05-19 Phillips Petroleum Company Process for preparing arylene sulfide polymers in the presence of functionalized olefin
US5179165A (en) * 1991-06-12 1993-01-12 International Flavors & Fragrances Inc. Ethylene/methacrylic acid copolymers in poly(phenylene sulfide) compositions
JPH0782415A (ja) * 1993-07-23 1995-03-28 Otsuka Chem Co Ltd 電子部品用樹脂組成物
DE4338541A1 (de) * 1993-11-11 1995-05-18 Hoechst Ag Formmasse aus Polyarylensulfiden
GB2295351B (en) * 1994-11-25 1998-12-16 Tenmat Ltd Composite articles
US6271299B1 (en) * 1999-02-02 2001-08-07 Dow Corning Corporation Fire resistant sealant composition
EP1970412A4 (de) * 2005-12-16 2009-09-16 Polyplastics Co Polyarylensulfidharzzusammensetzung
WO2012137554A1 (ja) * 2011-04-05 2012-10-11 東レ株式会社 複合成形体およびその製造方法
WO2014028548A1 (en) * 2012-08-15 2014-02-20 Ticona Llc Directly metallizable polyarylene sulfide composition
US10121607B2 (en) * 2013-08-22 2018-11-06 Corning Incorporated Ceramic separator for ultracapacitors
KR102503262B1 (ko) * 2016-05-19 2023-02-22 에이치디씨폴리올 주식회사 내화학성이 우수한 폴리아릴렌 설파이드 수지 조성물

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725362A (en) * 1971-03-08 1973-04-03 Phillips Petroleum Co Poly(arylene sulfide) composition and method for decreasing the melt flow of poly(arylene sulfide)
US3846367A (en) * 1973-05-24 1974-11-05 Du Pont Mineral reinforced nylon composition with high impact strength
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids
NL7703066A (nl) * 1976-03-29 1977-10-03 Gen Electric Werkwijze ter bereiding van polyfenyleenether bevattende materialen.
US4176098A (en) * 1976-07-01 1979-11-27 Phillips Petroleum Company Arc resistant composition
JPS5633401Y2 (de) * 1977-01-17 1981-08-07
US4271061A (en) * 1979-03-06 1981-06-02 Nitto Electric Industrial Co., Ltd. Epoxy resin compositions for sealing semiconductors
JPS5653713Y2 (de) * 1979-07-23 1981-12-15
US4337182A (en) * 1981-03-26 1982-06-29 Phillips Petroleum Company Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
CA1222588A (en) * 1981-09-10 1987-06-02 Jennings P. Blackwell Glass-filled polyarylene sulfide compositions containing organosilanes

Also Published As

Publication number Publication date
EP0103300A3 (en) 1985-01-23
EP0103300B2 (de) 1992-01-02
EP0103300B1 (de) 1988-02-17
US4482665A (en) 1984-11-13
JPS59132506A (ja) 1984-07-30
JPH0345841B2 (de) 1991-07-12
CA1235839A (en) 1988-04-26
EP0103300A2 (de) 1984-03-21
DE3375695D1 (en) 1988-03-24

Similar Documents

Publication Publication Date Title
ATE32518T1 (de) Einkapselung elektronischer bauteile mit calciumsilikat enthaltenden poly(arylensulfid)zusammensetzungen.
EP0135310A3 (en) Moulding compositions for the encapsulation of electronic components
BR8207735A (pt) Composicoes estaveis de resina epoxi pre-catalisada
DE3378605D1 (en) Resin sealed semiconductor devices
AU566548B2 (en) Organopolysiloxane composition
KR850003552A (ko) 전자소자 캡슐화수지용 충전제 및 그를 함유하는 전자소자 캡슐화수지 조성물
DE3278138D1 (en) Glass-filled polyarylene sulfide compositions containing organosilanes
CA1259737C (de)
ATE32394T1 (de) Eingebettete elektronische bauteile und zusammensetzungen zum einbetten.
DE3462513D1 (de) Poly(arylene sulfide) compositions
DE3376270D1 (en) Poly(arylene sulfide) containing talc
SE8100357L (sv) Inkapslingskompositioner
GB2095268B (en) Encapsulated electronic devices and encapsulating compositions
DE3272268D1 (en) Electrically insulating encapsulating substance for semiconductor devices
DE3372422D1 (en) Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
IT1168827B (it) Scatola porta componenti elettrici o elettronici
DE68909175D1 (de) Harzzusammensetzungen zum Abdichten von elektronischen Bauelementen und abgedichtete elektronische Bauelemente.
DE3470047D1 (en) Polymer compositions containing magnetically susceptible fillers
IT1144505B (it) Composizioni di solfuro poliarilenico e relativo procedimento di inurimento
MX162487A (es) Composiciones selladoras modificadas con tioeter
IT1153102B (it) Composti oligomerici e polimerici contenenti zolfo e composizioni polimeriche stabilizzate contenenti detti composti
KR900009855A (ko) 반도체 소자 밀봉용 열경화성 수지 조성물
KR900010973A (ko) 반도체 소자 밀봉용 에폭시수지 조성물
DE3173060D1 (de) Polyarylene sulphide compositions

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee