KR900009855A - 반도체 소자 밀봉용 열경화성 수지 조성물 - Google Patents
반도체 소자 밀봉용 열경화성 수지 조성물Info
- Publication number
- KR900009855A KR900009855A KR1019880016980A KR880016980A KR900009855A KR 900009855 A KR900009855 A KR 900009855A KR 1019880016980 A KR1019880016980 A KR 1019880016980A KR 880016980 A KR880016980 A KR 880016980A KR 900009855 A KR900009855 A KR 900009855A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- semiconductor devices
- thermosetting resin
- sealing semiconductor
- sealing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880016980A KR910010051B1 (ko) | 1988-12-19 | 1988-12-19 | 반도체 소자 밀봉용 열경화성 수지 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880016980A KR910010051B1 (ko) | 1988-12-19 | 1988-12-19 | 반도체 소자 밀봉용 열경화성 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900009855A true KR900009855A (ko) | 1990-07-05 |
KR910010051B1 KR910010051B1 (ko) | 1991-12-12 |
Family
ID=19280349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016980A KR910010051B1 (ko) | 1988-12-19 | 1988-12-19 | 반도체 소자 밀봉용 열경화성 수지 조성물 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR910010051B1 (ko) |
-
1988
- 1988-12-19 KR KR1019880016980A patent/KR910010051B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR910010051B1 (ko) | 1991-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19971129 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |