GB201405926D0 - Semiconductor wafer weighing apparatus and methods - Google Patents

Semiconductor wafer weighing apparatus and methods

Info

Publication number
GB201405926D0
GB201405926D0 GB201405926A GB201405926A GB201405926D0 GB 201405926 D0 GB201405926 D0 GB 201405926D0 GB 201405926 A GB201405926 A GB 201405926A GB 201405926 A GB201405926 A GB 201405926A GB 201405926 D0 GB201405926 D0 GB 201405926D0
Authority
GB
United Kingdom
Prior art keywords
methods
semiconductor wafer
weighing apparatus
wafer weighing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB201405926A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Priority to GB201405926A priority Critical patent/GB201405926D0/en
Publication of GB201405926D0 publication Critical patent/GB201405926D0/en
Priority to EP15714608.5A priority patent/EP3126796A1/en
Priority to US15/301,661 priority patent/US20170115158A1/en
Priority to SG11201608239RA priority patent/SG11201608239RA/en
Priority to JP2016560345A priority patent/JP6550397B2/ja
Priority to PCT/GB2015/050851 priority patent/WO2015150733A1/en
Priority to TW104110772A priority patent/TWI676006B/zh
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/06—Means for damping oscillations, e.g. of weigh beams
    • G01G23/10—Means for damping oscillations, e.g. of weigh beams by electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G17/00—Apparatus for or methods of weighing material of special form or property
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB201405926A 2014-04-02 2014-04-02 Semiconductor wafer weighing apparatus and methods Ceased GB201405926D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB201405926A GB201405926D0 (en) 2014-04-02 2014-04-02 Semiconductor wafer weighing apparatus and methods
EP15714608.5A EP3126796A1 (en) 2014-04-02 2015-03-23 Semiconductor wafer weighing apparatus and methods
US15/301,661 US20170115158A1 (en) 2014-04-02 2015-03-23 Semiconductor wafer weighing apparatus and methods
SG11201608239RA SG11201608239RA (en) 2014-04-02 2015-03-23 Semiconductor wafer weighing apparatus and methods
JP2016560345A JP6550397B2 (ja) 2014-04-02 2015-03-23 半導体ウェハ重量計測装置および方法
PCT/GB2015/050851 WO2015150733A1 (en) 2014-04-02 2015-03-23 Semiconductor wafer weighing apparatus and methods
TW104110772A TWI676006B (zh) 2014-04-02 2015-04-01 半導體晶圓稱重裝置及其稱重方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201405926A GB201405926D0 (en) 2014-04-02 2014-04-02 Semiconductor wafer weighing apparatus and methods

Publications (1)

Publication Number Publication Date
GB201405926D0 true GB201405926D0 (en) 2014-05-14

Family

ID=50737877

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201405926A Ceased GB201405926D0 (en) 2014-04-02 2014-04-02 Semiconductor wafer weighing apparatus and methods

Country Status (7)

Country Link
US (1) US20170115158A1 (https=)
EP (1) EP3126796A1 (https=)
JP (1) JP6550397B2 (https=)
GB (1) GB201405926D0 (https=)
SG (1) SG11201608239RA (https=)
TW (1) TWI676006B (https=)
WO (1) WO2015150733A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN113819985A (zh) * 2020-06-18 2021-12-21 拓荆科技股份有限公司 晶圆防干扰称重装置及其应用
CN114136422A (zh) * 2020-09-03 2022-03-04 长鑫存储技术有限公司 称重装置
CN112707148B (zh) * 2020-12-31 2022-07-08 至微半导体(上海)有限公司 一种晶圆片高速装卸输送系统

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH621409A5 (https=) * 1978-02-24 1981-01-30 Mettler Instrumente Ag
AU565314B2 (en) * 1983-12-28 1987-09-10 K.S. Ishida K.K. Weight sensor
JP3312626B2 (ja) * 1989-12-01 2002-08-12 株式会社石田衡器製作所 ロードセル型重量測定装置
DE4001614A1 (de) * 1990-01-20 1991-07-25 Bosch Gmbh Robert Kompensationswaage
JP2647585B2 (ja) * 1991-11-28 1997-08-27 三菱電機株式会社 自動薄膜計測装置
JP3251706B2 (ja) * 1993-04-30 2002-01-28 株式会社イシダ 計量装置
JP3539582B2 (ja) * 1993-12-02 2004-07-07 株式会社イシダ 多点セル型計量装置
US5936206A (en) * 1993-12-31 1999-08-10 Ishida Co., Ltd. Weighing machines with means for correcting effects of floor vibrations on weight signals therefrom
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
US5569887A (en) * 1994-03-09 1996-10-29 Ishida Co., Ltd. Load cell for detecting vibrations and weighing device comprising same
JPH08219230A (ja) * 1995-02-14 1996-08-27 Atsushi Shimamoto 除振装置
EP0756158B1 (en) * 1995-07-26 2002-10-02 ISHIDA CO., Ltd. Weighing apparatus
US5801337A (en) * 1996-01-11 1998-09-01 Barnstead/Thermolyne Corporation Method of and apparatus for compensating for load/environment temperature differential-induced measured load weight error
US6284986B1 (en) * 1999-03-15 2001-09-04 Seh America, Inc. Method of determining the thickness of a layer on a silicon substrate
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
DE19912974A1 (de) * 1999-03-23 2000-09-28 Mettler Toledo Gmbh Dämpfungsvorrichtung und Aktuator hierfür
DE10024986C2 (de) * 2000-05-19 2002-03-07 Sartorius Gmbh Elektronischer Wägeaufnehmer
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
JP4355536B2 (ja) * 2003-08-20 2009-11-04 倉敷化工株式会社 除振台のアクティブ振動制御装置
DE102006059260B4 (de) * 2006-12-15 2013-02-07 Sartorius Weighing Technology Gmbh Elektronische Waage mit Libelle
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
US9004838B2 (en) * 2011-04-07 2015-04-14 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
JP2013002941A (ja) * 2011-06-16 2013-01-07 Ishida Co Ltd 計量システム
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
GB201321423D0 (en) * 2013-12-04 2014-01-15 Metryx Ltd Semiconductor wafer processing methods and apparatus

Also Published As

Publication number Publication date
JP6550397B2 (ja) 2019-07-24
EP3126796A1 (en) 2017-02-08
JP2017517874A (ja) 2017-06-29
SG11201608239RA (en) 2016-10-28
TWI676006B (zh) 2019-11-01
TW201543008A (zh) 2015-11-16
US20170115158A1 (en) 2017-04-27
WO2015150733A1 (en) 2015-10-08

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)