GB1458846A - Semiconductor packages - Google Patents

Semiconductor packages

Info

Publication number
GB1458846A
GB1458846A GB4763874A GB4763874A GB1458846A GB 1458846 A GB1458846 A GB 1458846A GB 4763874 A GB4763874 A GB 4763874A GB 4763874 A GB4763874 A GB 4763874A GB 1458846 A GB1458846 A GB 1458846A
Authority
GB
United Kingdom
Prior art keywords
leads
semi
frame
lead frame
fingers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4763874A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of GB1458846A publication Critical patent/GB1458846A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
GB4763874A 1973-12-03 1974-11-04 Semiconductor packages Expired GB1458846A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42100473A 1973-12-03 1973-12-03

Publications (1)

Publication Number Publication Date
GB1458846A true GB1458846A (en) 1976-12-15

Family

ID=23668787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4763874A Expired GB1458846A (en) 1973-12-03 1974-11-04 Semiconductor packages

Country Status (7)

Country Link
JP (2) JPS5087587A (enExample)
CA (1) CA1032276A (enExample)
CH (1) CH585968A5 (enExample)
DE (1) DE2456951A1 (enExample)
FR (1) FR2253282B1 (enExample)
GB (1) GB1458846A (enExample)
SE (1) SE403852B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2247988A (en) * 1990-09-12 1992-03-18 Seiko Epson Corp Lead frame for semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485262A1 (fr) * 1980-06-19 1981-12-24 Thomson Csf Boitier d'encapsulation resistant a de fortes pressions externes
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
DE2003423C3 (de) * 1970-01-27 1975-11-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren von Halbleiteranordnungen
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
JPS4727491U (enExample) 1971-04-17 1972-11-28
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
JPS4836983A (enExample) 1971-09-10 1973-05-31

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2247988A (en) * 1990-09-12 1992-03-18 Seiko Epson Corp Lead frame for semiconductor device
GB2247988B (en) * 1990-09-12 1995-03-29 Seiko Epson Corp Semi-conductor device and method of producing the same

Also Published As

Publication number Publication date
SE403852B (sv) 1978-09-04
DE2456951A1 (de) 1975-06-05
CA1032276A (en) 1978-05-30
JPS5087587A (enExample) 1975-07-14
JPS5860940U (ja) 1983-04-25
SE7415064L (enExample) 1975-06-04
FR2253282A1 (enExample) 1975-06-27
FR2253282B1 (enExample) 1980-09-12
CH585968A5 (enExample) 1977-03-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19941103