GB2247988B - Semi-conductor device and method of producing the same - Google Patents

Semi-conductor device and method of producing the same

Info

Publication number
GB2247988B
GB2247988B GB9119362A GB9119362A GB2247988B GB 2247988 B GB2247988 B GB 2247988B GB 9119362 A GB9119362 A GB 9119362A GB 9119362 A GB9119362 A GB 9119362A GB 2247988 B GB2247988 B GB 2247988B
Authority
GB
United Kingdom
Prior art keywords
semi
producing
same
conductor device
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9119362A
Other versions
GB2247988A (en
GB9119362D0 (en
Inventor
Tetsuya Ootsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of GB9119362D0 publication Critical patent/GB9119362D0/en
Publication of GB2247988A publication Critical patent/GB2247988A/en
Application granted granted Critical
Publication of GB2247988B publication Critical patent/GB2247988B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49177—Combinations of different arrangements
    • H01L2224/49179—Corner adaptations, i.e. disposition of the wire connectors at the corners of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB9119362A 1990-09-12 1991-09-11 Semi-conductor device and method of producing the same Expired - Fee Related GB2247988B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2240161A JPH04120765A (en) 1990-09-12 1990-09-12 Semiconductor device and manufacture thereof

Publications (3)

Publication Number Publication Date
GB9119362D0 GB9119362D0 (en) 1991-10-23
GB2247988A GB2247988A (en) 1992-03-18
GB2247988B true GB2247988B (en) 1995-03-29

Family

ID=17055406

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9119362A Expired - Fee Related GB2247988B (en) 1990-09-12 1991-09-11 Semi-conductor device and method of producing the same

Country Status (5)

Country Link
JP (1) JPH04120765A (en)
KR (1) KR970000219B1 (en)
GB (1) GB2247988B (en)
HK (1) HK101497A (en)
TW (1) TW198767B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2550900B2 (en) * 1993-11-18 1996-11-06 日本電気株式会社 Semiconductor device
JP3506341B2 (en) * 1994-06-28 2004-03-15 株式会社ルネサステクノロジ Semiconductor device
US5929513A (en) * 1994-08-16 1999-07-27 Fujitsu Limited Semiconductor device and heat sink used therein
US5834831A (en) * 1994-08-16 1998-11-10 Fujitsu Limited Semiconductor device with improved heat dissipation efficiency
KR0156622B1 (en) * 1995-04-27 1998-10-15 문정환 Semiconductor leadframe and the manufacturing method
US5796158A (en) * 1995-07-31 1998-08-18 Micron Technology, Inc. Lead frame coining for semiconductor devices
JP2891692B1 (en) * 1997-08-25 1999-05-17 株式会社日立製作所 Semiconductor device
US7102216B1 (en) * 2001-08-17 2006-09-05 Amkor Technology, Inc. Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
GB1458846A (en) * 1973-12-03 1976-12-15 Raytheon Co Semiconductor packages
EP0063408A1 (en) * 1981-03-27 1982-10-27 AMP INCORPORATED (a New Jersey corporation) Semiconductor chip carrier
GB2178895A (en) * 1985-08-06 1987-02-18 Gen Electric Co Plc Improved preparation of fragile devices
GB2178894A (en) * 1985-08-06 1987-02-18 Gen Electric Co Plc Preparation of fragile devices such as lead frames
EP0405330A2 (en) * 1989-06-29 1991-01-02 Motorola, Inc. Flagless leadframe, package and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
GB1458846A (en) * 1973-12-03 1976-12-15 Raytheon Co Semiconductor packages
EP0063408A1 (en) * 1981-03-27 1982-10-27 AMP INCORPORATED (a New Jersey corporation) Semiconductor chip carrier
GB2178895A (en) * 1985-08-06 1987-02-18 Gen Electric Co Plc Improved preparation of fragile devices
GB2178894A (en) * 1985-08-06 1987-02-18 Gen Electric Co Plc Preparation of fragile devices such as lead frames
EP0405330A2 (en) * 1989-06-29 1991-01-02 Motorola, Inc. Flagless leadframe, package and method

Also Published As

Publication number Publication date
HK101497A (en) 1997-08-15
KR920007155A (en) 1992-04-28
TW198767B (en) 1993-01-21
GB2247988A (en) 1992-03-18
KR970000219B1 (en) 1997-01-06
GB9119362D0 (en) 1991-10-23
JPH04120765A (en) 1992-04-21

Similar Documents

Publication Publication Date Title
EP0452950A3 (en) Semiconductor device using whiskers and manufacturing method of the same
GB9023215D0 (en) Semiconductor device and method of manufacturing the same
EP0543361A3 (en) Semiconductor device and method of manufacturing the same
EP0421735A3 (en) Semiconductor device and method of manufacturing the same
KR960011862B1 (en) Semiconductor device and method of fabricating the same
EP0506980A4 (en) Structure of semiconductor device and manufacturing method thereof
EP0721211A3 (en) Semiconductor device and method of manufacturing the same
EP0543392A3 (en) Diamond semiconductor device and method of producing the same
EP0523861A3 (en) Optical device and method of manufacturing the same
EP0599595A3 (en) Ceramic electronic device and method of producing the same.
HK1004843A1 (en) Semiconductor device and manufacture method of same
EP0599730A3 (en) Semiconductor device and method of producing the same.
EP0451632A3 (en) Semiconductor structure and method of its manufacture
EP0341821A3 (en) Semiconductor device and method of manufacturing the same
EP0433051A3 (en) A semiconductor laser device and a method of producing the same
EP0488091A3 (en) Plastic-packaged semiconductor device and method of forming the same
EP0435331A3 (en) Semiconductor device and a method of fabricating the same
EP0477013A3 (en) Semiconductor laser and method of producing the semiconductor laser
EP0476815A3 (en) Thyristor and method of manufacturing the same
EP0450558A3 (en) Semiconductor device and method of manufacturing the same
EP0487220A3 (en) Soi-field effect transistor and method of manufacturing the same
HK1009308A1 (en) Semi-conductor device and method of manufacturing the same
EP0336977A4 (en) Semiconducteur device and method of producing the same
EP0452801A3 (en) Semiconductor device having light receiving element and method of producing the same
EP0456254A3 (en) Semiconductor device and method of screening the same

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080911