KR920018880A - 유리봉지형 세라믹 패키지 - Google Patents

유리봉지형 세라믹 패키지 Download PDF

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Publication number
KR920018880A
KR920018880A KR1019920004682A KR920004682A KR920018880A KR 920018880 A KR920018880 A KR 920018880A KR 1019920004682 A KR1019920004682 A KR 1019920004682A KR 920004682 A KR920004682 A KR 920004682A KR 920018880 A KR920018880 A KR 920018880A
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South Korea
Prior art keywords
glass
film layer
metal film
main surface
ceramic
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KR1019920004682A
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English (en)
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KR950009625B1 (ko
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마사오 요꼬찌
유끼오 까투타니
꼬히찌 꾸마자와
테투오 노무라
Original Assignee
노자끼 또구히꼬
가부시끼가이샤 수미또모 긴조구 세라믹구스
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Publication of KR920018880A publication Critical patent/KR920018880A/ko
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Publication of KR950009625B1 publication Critical patent/KR950009625B1/ko

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Abstract

내용 없음

Description

유리봉지형 세라믹 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 유리봉지형 세라믹 패키지의 중앙종단면도.
제2도는 금속막층을 형성한 상태의 세라믹 기판의 평면도.
제3도는 반도체 소자와 리드프레임을 와이어 본드에 직접 접속한 상태의 개략 단면도.

Claims (2)

  1. 중앙에 반도체소자를 수납하는 캐비티를 구비하고 또 주면에 유리층을 배치한 세라믹 기판과 주면에 유리층을 배치한 세라믹 캡으로 이 양주면끼리를 대향배치하여 리드프레임을 사이에 끼워 지지하고 이 유리층을 용융일체화함으로써 상기 반도체소자를 내부에 기밀봉지하도록 한 유리봉지형 세라믹 패키지에 있어서, 상기 세라믹기판의 주면에 알루미늄 증착막으로 된 금속막층을 형성하고 이 금속막층위에 상기 캐비티의 외측주연부 근방을 남겨 유리층을 배치하고 상기 리드프레임과 반도체소자와의 전기적 접속을 상기 리드프레임중의 70~90%의 개수를 상기 반도체 소자의 패드에 금속세선에 의한 와이어 본드로 직접 접속하고 나머지 리드프레임을 상기 금속막층을 거쳐서 상기 반도체 소자의 패드에 간접 접속하도록 한 것을 특징으로 하는 유리봉지형 세라믹 패키지.
  2. 제1항에 있어서, 상기 나머지 리드프레임과 알루미늄 증착막으로 된 금속막층 및 상기 금속막층과 반도체 소자의 패드와의 접속을 금속세선에 의한 와이어본드에 의한 접속으로한 유리봉지형 세라믹 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920004682A 1991-03-21 1992-03-21 유리봉지형 세라믹 패키지 KR950009625B1 (ko)

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JP91-083333 1991-03-21
JP3083333A JPH0831490B2 (ja) 1991-03-21 1991-03-21 ガラス封止型セラミックパッケージ

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KR920018880A true KR920018880A (ko) 1992-10-22
KR950009625B1 KR950009625B1 (ko) 1995-08-25

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JPH07321140A (ja) * 1994-05-19 1995-12-08 Toshiba Corp 半導体装置
US5543657A (en) * 1994-10-07 1996-08-06 International Business Machines Corporation Single layer leadframe design with groundplane capability
US6222261B1 (en) * 1999-05-03 2001-04-24 The United States Of America As Represented By The Secretary Of The Army Barrier layers for thin film electronic materials
JP4565728B2 (ja) * 2000-10-10 2010-10-20 三洋電機株式会社 中空気密パッケージ型の半導体装置
US20030125077A1 (en) * 2002-01-03 2003-07-03 Hsi-Che Lee Multimedia watch
TW471143B (en) * 2001-01-04 2002-01-01 Wen-Wen Chiou Integrated circuit chip package
JP2007305856A (ja) * 2006-05-12 2007-11-22 Olympus Corp 封止構造及び該封止構造の製造方法
US9785186B2 (en) 2012-10-16 2017-10-10 Samsung Electronics Co., Ltd. Package system with cover structure and method of operation thereof

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US4796083A (en) * 1987-07-02 1989-01-03 Olin Corporation Semiconductor casing
JPH0626224B2 (ja) * 1987-10-26 1994-04-06 日本電気株式会社 集積回路用パッケージ
JPH01278760A (ja) * 1988-04-30 1989-11-09 Sumitomo Electric Ind Ltd 半導体素子搭載用パツケージ
US4992628A (en) * 1990-05-07 1991-02-12 Kyocera America, Inc. Ceramic-glass integrated circuit package with ground plane

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JPH04293245A (ja) 1992-10-16
KR950009625B1 (ko) 1995-08-25
JPH0831490B2 (ja) 1996-03-27

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