GB1447058A - Gold electroplating composition and process - Google Patents

Gold electroplating composition and process

Info

Publication number
GB1447058A
GB1447058A GB3786073A GB3786073A GB1447058A GB 1447058 A GB1447058 A GB 1447058A GB 3786073 A GB3786073 A GB 3786073A GB 3786073 A GB3786073 A GB 3786073A GB 1447058 A GB1447058 A GB 1447058A
Authority
GB
United Kingdom
Prior art keywords
gold
metals
electro
bath
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3786073A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of GB1447058A publication Critical patent/GB1447058A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07HSUGARS; DERIVATIVES THEREOF; NUCLEOSIDES; NUCLEOTIDES; NUCLEIC ACIDS
    • C07H11/00Compounds containing saccharide radicals esterified by inorganic acids; Metal salts thereof
    • C07H11/04Phosphates; Phosphites; Polyphosphates
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/38Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)]
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Biotechnology (AREA)
  • Genetics & Genomics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
GB3786073A 1972-08-10 1973-08-09 Gold electroplating composition and process Expired GB1447058A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1197572A CH555894A (fr) 1972-08-10 1972-08-10 Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
CH1138873 1973-08-06

Publications (1)

Publication Number Publication Date
GB1447058A true GB1447058A (en) 1976-08-25

Family

ID=25708235

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3786073A Expired GB1447058A (en) 1972-08-10 1973-08-09 Gold electroplating composition and process

Country Status (8)

Country Link
US (1) US3904493A (fr)
CH (1) CH555894A (fr)
DE (1) DE2340462C3 (fr)
ES (1) ES417762A1 (fr)
FR (1) FR2253106B1 (fr)
GB (1) GB1447058A (fr)
IT (1) IT994135B (fr)
NL (1) NL7311108A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN113571698A (zh) * 2021-09-23 2021-10-29 中南大学 一种碳点调控的金属硒化物/碳复合材料及其制备方法和应用

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579720A (en) * 1965-08-24 1986-04-01 Plains Chemical Development Co. Chelation
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
US4029696A (en) * 1976-04-09 1977-06-14 Benckiser-Knapsack Gmbh N-hydroxy alkane amino alkane diphosphonic acids, process of producing same, and compositions for and method of using same
DE2621606A1 (de) * 1976-05-14 1977-11-17 Bayer Ag Propan-1,3-diphosphonsaeuren fuer die wasserkonditionierung
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4212708A (en) * 1979-06-05 1980-07-15 Belikin Alexandr V Gold-plating electrolyte
CH632533A5 (fr) * 1979-06-14 1982-10-15 Aliprandini P Procede pour le depot galvanoplastique d'un alliage d'or.
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4802990A (en) * 1987-07-30 1989-02-07 Inskeep Jr Eugene L Solution and method for dissolving minerals
FI89364C (fi) * 1990-12-20 1993-09-27 Leiras Oy Foerfarande foer framstaellning av nya, farmakologiskt anvaendbara metylenbisfosfonsyraderivat
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
WO2000005747A2 (fr) * 1998-06-30 2000-02-03 Semitool, Inc. Structures de metallisation pour applications de micro-electronique et procede de formation de ces structures
EP1103637A1 (fr) * 1999-11-29 2001-05-30 ENTHONE-OMI, Inc. Procédé de fabrication d'une couche en alliage AuCuGa en utilisant l'électrolyse et les alliages obtenus par ce procédé
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
US6991710B2 (en) 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20100170855A1 (en) * 2009-01-06 2010-07-08 Hay Daniel N T Modification of precipitate morphology and settling characteristics in acid conditions
US9028787B2 (en) * 2009-09-25 2015-05-12 Cytec Technology Corp. Preventing or reducing scale in wet-process phosphoric acid production
ITFI20130057A1 (it) * 2013-03-18 2014-09-19 Bluclad S R L Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3057789A (en) * 1959-02-26 1962-10-09 Paul T Smith Gold plating bath and process
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3672969A (en) * 1970-10-26 1972-06-27 Lea Ronal Inc Electrodeposition of gold and gold alloys
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN113571698A (zh) * 2021-09-23 2021-10-29 中南大学 一种碳点调控的金属硒化物/碳复合材料及其制备方法和应用

Also Published As

Publication number Publication date
IT994135B (it) 1975-10-20
NL7311108A (fr) 1974-02-12
ES417762A1 (es) 1976-06-16
DE2340462B2 (de) 1978-02-02
CH555894A (fr) 1974-11-15
FR2253106B1 (fr) 1976-11-19
DE2340462A1 (de) 1974-02-28
US3904493A (en) 1975-09-09
DE2340462C3 (de) 1978-10-12
FR2253106A1 (fr) 1975-06-27

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee