GB1313197A - Copper electrodeposition bath and method - Google Patents
Copper electrodeposition bath and methodInfo
- Publication number
- GB1313197A GB1313197A GB5998270A GB5998270A GB1313197A GB 1313197 A GB1313197 A GB 1313197A GB 5998270 A GB5998270 A GB 5998270A GB 5998270 A GB5998270 A GB 5998270A GB 1313197 A GB1313197 A GB 1313197A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- bath
- polyethyleneimine
- electro
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 6
- 229910052802 copper Inorganic materials 0.000 title abstract 6
- 239000010949 copper Substances 0.000 title abstract 6
- 238000004070 electrodeposition Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 229920002873 Polyethylenimine Polymers 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- FSSPGSAQUIYDCN-UHFFFAOYSA-N 1,3-Propane sultone Chemical compound O=S1(=O)CCCO1 FSSPGSAQUIYDCN-UHFFFAOYSA-N 0.000 abstract 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 abstract 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 abstract 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract 1
- GNVMUORYQLCPJZ-UHFFFAOYSA-M Thiocarbamate Chemical compound NC([S-])=O GNVMUORYQLCPJZ-UHFFFAOYSA-M 0.000 abstract 1
- 230000002378 acidificating effect Effects 0.000 abstract 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 abstract 1
- 238000005282 brightening Methods 0.000 abstract 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 229920000570 polyether Polymers 0.000 abstract 1
- 229920000151 polyglycol Polymers 0.000 abstract 1
- 239000010695 polyglycol Substances 0.000 abstract 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 abstract 1
- 238000007670 refining Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1102470A | 1970-02-12 | 1970-02-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1313197A true GB1313197A (en) | 1973-04-11 |
Family
ID=21748527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5998270A Expired GB1313197A (en) | 1970-02-12 | 1970-12-17 | Copper electrodeposition bath and method |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5118894B1 (enrdf_load_stackoverflow) |
| BR (1) | BR7100263D0 (enrdf_load_stackoverflow) |
| FR (1) | FR2079372B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1313197A (enrdf_load_stackoverflow) |
| NL (1) | NL172085C (enrdf_load_stackoverflow) |
| ZA (1) | ZA708430B (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
| CN103397354A (zh) * | 2013-08-08 | 2013-11-20 | 上海新阳半导体材料股份有限公司 | 一种用于减少硅通孔技术镀铜退火后空洞的添加剂 |
| US9222188B2 (en) | 2002-03-05 | 2015-12-29 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US9493884B2 (en) | 2002-03-05 | 2016-11-15 | Enthone Inc. | Copper electrodeposition in microelectronics |
| CN114351195A (zh) * | 2022-03-19 | 2022-04-15 | 深圳市创智成功科技有限公司 | 一种脉冲通孔填孔的电镀铜配方及其电镀工艺 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ZA739310B (en) * | 1972-12-14 | 1974-11-27 | M & T Chemicals Inc | Electrode position of copper |
| JPS53114596U (enrdf_load_stackoverflow) * | 1977-02-14 | 1978-09-12 | ||
| CA1105045A (en) * | 1977-05-04 | 1981-07-14 | Hans G. Creutz (Deceased) | Electrodeposition of copper |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1246347B (de) * | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
-
1970
- 1970-12-14 ZA ZA708430A patent/ZA708430B/xx unknown
- 1970-12-17 GB GB5998270A patent/GB1313197A/en not_active Expired
-
1971
- 1971-01-11 NL NLAANVRAGE7100321,A patent/NL172085C/xx not_active IP Right Cessation
- 1971-01-15 BR BR263/71A patent/BR7100263D0/pt unknown
- 1971-01-22 FR FR717102162A patent/FR2079372B1/fr not_active Expired
- 1971-02-09 JP JP46005046A patent/JPS5118894B1/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
| US9222188B2 (en) | 2002-03-05 | 2015-12-29 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US9493884B2 (en) | 2002-03-05 | 2016-11-15 | Enthone Inc. | Copper electrodeposition in microelectronics |
| CN103397354A (zh) * | 2013-08-08 | 2013-11-20 | 上海新阳半导体材料股份有限公司 | 一种用于减少硅通孔技术镀铜退火后空洞的添加剂 |
| CN103397354B (zh) * | 2013-08-08 | 2016-10-26 | 上海新阳半导体材料股份有限公司 | 一种用于减少硅通孔技术镀铜退火后空洞的添加剂 |
| CN114351195A (zh) * | 2022-03-19 | 2022-04-15 | 深圳市创智成功科技有限公司 | 一种脉冲通孔填孔的电镀铜配方及其电镀工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5118894B1 (enrdf_load_stackoverflow) | 1976-06-14 |
| BR7100263D0 (pt) | 1973-05-24 |
| FR2079372A1 (enrdf_load_stackoverflow) | 1971-11-12 |
| ZA708430B (en) | 1971-09-29 |
| FR2079372B1 (enrdf_load_stackoverflow) | 1974-02-22 |
| DE2105472A1 (de) | 1971-08-26 |
| NL7100321A (enrdf_load_stackoverflow) | 1971-08-16 |
| DE2105472B2 (de) | 1975-11-20 |
| NL172085C (nl) | 1983-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3275936D1 (en) | Acid copper electroplating baths containing brightening and levelling additives | |
| GB1354840A (en) | Electro deposition of copper from acidic baths | |
| ES390675A1 (es) | Un metodo para producir un abrillantador primadio para ba- nos acidos de chapado de estano. | |
| GB1313197A (en) | Copper electrodeposition bath and method | |
| ES448837A1 (es) | Un metodo para efectuar un recubrimiento electrolitico de cinc. | |
| GB806403A (en) | Process for the production of electrolytic metal coatings | |
| GB1368749A (en) | Electrodeposition of chromium | |
| GB1497839A (en) | Alkaline electroplating bath | |
| SE8106867L (sv) | Elektrolytisk avsettning av palladium och palladiumlegeringar | |
| GB1205589A (en) | Electroplating bath for electrodeposition of nickel plate | |
| ES433440A1 (es) | Perfeccionamientos introducidos en el chapado electroliticode sustratos ferreos. | |
| GB1433040A (en) | Electrodeposition of copper | |
| GB614014A (en) | Improvement in electrodeposition of nickel from an acid bath | |
| GB774614A (en) | Improvements in or relating to the electrodeposition of nickel | |
| GB1456583A (en) | Electroplating composition and process | |
| GB1000311A (en) | Electrodeposition of nickel | |
| GB758162A (en) | Improvements in or relating to the electro-deposition of nickel | |
| GB1335951A (en) | Nickel plating | |
| GB1438554A (en) | Electrodeposition of bright nickel-iron or nickel-cobalt-iron deposits | |
| GB970268A (en) | Electrodeposition of nickel | |
| GB1372850A (en) | Acidic copper electrolytes | |
| GB898774A (en) | Nickel electroplating | |
| KR850002979A (ko) | 1,2,3-트리티안화합물의 신규 제조방법 | |
| GB1508823A (en) | Electrodeposition of metal deposits | |
| KR830005165A (ko) | 알킬 설폰의 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PE20 | Patent expired after termination of 20 years |