FR2079372B1 - - Google Patents

Info

Publication number
FR2079372B1
FR2079372B1 FR717102162A FR7102162A FR2079372B1 FR 2079372 B1 FR2079372 B1 FR 2079372B1 FR 717102162 A FR717102162 A FR 717102162A FR 7102162 A FR7102162 A FR 7102162A FR 2079372 B1 FR2079372 B1 FR 2079372B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR717102162A
Other languages
French (fr)
Other versions
FR2079372A1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Corp
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of FR2079372A1 publication Critical patent/FR2079372A1/fr
Application granted granted Critical
Publication of FR2079372B1 publication Critical patent/FR2079372B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR717102162A 1970-02-12 1971-01-22 Expired FR2079372B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1102470A 1970-02-12 1970-02-12

Publications (2)

Publication Number Publication Date
FR2079372A1 FR2079372A1 (enrdf_load_stackoverflow) 1971-11-12
FR2079372B1 true FR2079372B1 (enrdf_load_stackoverflow) 1974-02-22

Family

ID=21748527

Family Applications (1)

Application Number Title Priority Date Filing Date
FR717102162A Expired FR2079372B1 (enrdf_load_stackoverflow) 1970-02-12 1971-01-22

Country Status (6)

Country Link
JP (1) JPS5118894B1 (enrdf_load_stackoverflow)
BR (1) BR7100263D0 (enrdf_load_stackoverflow)
FR (1) FR2079372B1 (enrdf_load_stackoverflow)
GB (1) GB1313197A (enrdf_load_stackoverflow)
NL (1) NL172085C (enrdf_load_stackoverflow)
ZA (1) ZA708430B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
JPS53114596U (enrdf_load_stackoverflow) * 1977-02-14 1978-09-12
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
CN114351195A (zh) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 一种脉冲通孔填孔的电镀铜配方及其电镀工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246347B (de) * 1966-03-08 1967-08-03 Schering Ag Saures galvanisches Kupferbad
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Also Published As

Publication number Publication date
JPS5118894B1 (enrdf_load_stackoverflow) 1976-06-14
BR7100263D0 (pt) 1973-05-24
FR2079372A1 (enrdf_load_stackoverflow) 1971-11-12
ZA708430B (en) 1971-09-29
DE2105472A1 (de) 1971-08-26
NL7100321A (enrdf_load_stackoverflow) 1971-08-16
DE2105472B2 (de) 1975-11-20
NL172085C (nl) 1983-07-01
GB1313197A (en) 1973-04-11

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
ST Notification of lapse