ZA708430B - Electrodeposition of copper from acidic baths - Google Patents

Electrodeposition of copper from acidic baths

Info

Publication number
ZA708430B
ZA708430B ZA708430A ZA708430A ZA708430B ZA 708430 B ZA708430 B ZA 708430B ZA 708430 A ZA708430 A ZA 708430A ZA 708430 A ZA708430 A ZA 708430A ZA 708430 B ZA708430 B ZA 708430B
Authority
ZA
South Africa
Prior art keywords
electrodeposition
copper
acidic baths
baths
acidic
Prior art date
Application number
ZA708430A
Other languages
English (en)
Inventor
H Creutz
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of ZA708430B publication Critical patent/ZA708430B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
ZA708430A 1970-02-12 1970-12-14 Electrodeposition of copper from acidic baths ZA708430B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1102470A 1970-02-12 1970-02-12

Publications (1)

Publication Number Publication Date
ZA708430B true ZA708430B (en) 1971-09-29

Family

ID=21748527

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA708430A ZA708430B (en) 1970-02-12 1970-12-14 Electrodeposition of copper from acidic baths

Country Status (6)

Country Link
JP (1) JPS5118894B1 (enrdf_load_stackoverflow)
BR (1) BR7100263D0 (enrdf_load_stackoverflow)
FR (1) FR2079372B1 (enrdf_load_stackoverflow)
GB (1) GB1313197A (enrdf_load_stackoverflow)
NL (1) NL172085C (enrdf_load_stackoverflow)
ZA (1) ZA708430B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
JPS53114596U (enrdf_load_stackoverflow) * 1977-02-14 1978-09-12
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
CN114351195A (zh) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 一种脉冲通孔填孔的电镀铜配方及其电镀工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246347B (de) * 1966-03-08 1967-08-03 Schering Ag Saures galvanisches Kupferbad
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Also Published As

Publication number Publication date
FR2079372A1 (enrdf_load_stackoverflow) 1971-11-12
NL7100321A (enrdf_load_stackoverflow) 1971-08-16
BR7100263D0 (pt) 1973-05-24
JPS5118894B1 (enrdf_load_stackoverflow) 1976-06-14
FR2079372B1 (enrdf_load_stackoverflow) 1974-02-22
DE2105472B2 (de) 1975-11-20
DE2105472A1 (de) 1971-08-26
GB1313197A (en) 1973-04-11
NL172085C (nl) 1983-07-01

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