GB1286086A - Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating - Google Patents

Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Info

Publication number
GB1286086A
GB1286086A GB50667/69A GB5066769A GB1286086A GB 1286086 A GB1286086 A GB 1286086A GB 50667/69 A GB50667/69 A GB 50667/69A GB 5066769 A GB5066769 A GB 5066769A GB 1286086 A GB1286086 A GB 1286086A
Authority
GB
United Kingdom
Prior art keywords
layer
soldered
polyimide
covered
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50667/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1286086A publication Critical patent/GB1286086A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
GB50667/69A 1968-11-08 1969-10-15 Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating Expired GB1286086A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77430268A 1968-11-08 1968-11-08

Publications (1)

Publication Number Publication Date
GB1286086A true GB1286086A (en) 1972-08-16

Family

ID=25100841

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50667/69A Expired GB1286086A (en) 1968-11-08 1969-10-15 Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Country Status (9)

Country Link
US (1) US3615913A (enExample)
JP (1) JPS497995B1 (enExample)
BE (1) BE741192A (enExample)
BR (1) BR6913970D0 (enExample)
DE (1) DE1955730A1 (enExample)
ES (1) ES372779A1 (enExample)
FR (1) FR2022876A1 (enExample)
GB (1) GB1286086A (enExample)
NL (1) NL6916814A (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027105C3 (de) * 1970-06-03 1981-03-26 Robert Bosch Gmbh, 70469 Stuttgart Verfahren zur Herstellung eines Halbleiterbauelements
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
DE2322347A1 (de) * 1973-05-03 1974-11-14 Siemens Ag Verfahren zum herstellen eines halbleiterelementes mit isolierender schutzschicht
JPS5067575A (enExample) * 1973-10-15 1975-06-06
US3916073A (en) * 1974-03-11 1975-10-28 Gen Instrument Corp Process for passivating semiconductor surfaces and products thereof
DE2442276A1 (de) * 1974-09-04 1976-03-25 Siemens Ag Elektrooptischer wandler
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
US3978426A (en) * 1975-03-11 1976-08-31 Bell Telephone Laboratories, Incorporated Heterostructure devices including tapered optical couplers
US4030948A (en) * 1975-07-21 1977-06-21 Abe Berger Polyimide containing silicones as protective coating on semiconductor device
US4040874A (en) * 1975-08-04 1977-08-09 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
US4198444A (en) * 1975-08-04 1980-04-15 General Electric Company Method for providing substantially hermetic sealing means for electronic components
US4017340A (en) * 1975-08-04 1977-04-12 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
DE2655725A1 (de) * 1975-12-11 1977-06-16 Gen Electrit Co Halbleiterelement mit einem schutzueberzug
DE2655803C2 (de) * 1975-12-11 1986-04-17 General Electric Co., Schenectady, N.Y. Verfahren zum Behandeln eines ausgewählten Oberflächenbereiches eines Halbleiterelementes
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
GB1585477A (en) * 1976-01-26 1981-03-04 Gen Electric Semiconductors
US4140572A (en) * 1976-09-07 1979-02-20 General Electric Company Process for selective etching of polymeric materials embodying silicones therein
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
CH661932A5 (en) * 1978-09-18 1987-08-31 Gen Electric Process for the preparation of a coating composition for semiconductor components, this composition, and the use thereof
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
US4225686A (en) * 1979-07-19 1980-09-30 The Upjohn Company Blends of copolyimides with copolyamideimides
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56114335A (en) * 1980-02-13 1981-09-08 Fujitsu Ltd Semiconductor device and its manufacture
US4426769A (en) 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
US4535350A (en) * 1981-10-29 1985-08-13 National Semiconductor Corporation Low-cost semiconductor device package and process
US4468411A (en) * 1982-04-05 1984-08-28 Motorola, Inc. Method for providing alpha particle protection for an integrated circuit die
US4670325A (en) * 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
JPS59204295A (ja) * 1983-04-29 1984-11-19 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属回路構造体
US4603372A (en) * 1984-11-05 1986-07-29 Direction De La Meteorologie Du Ministere Des Transports Method of fabricating a temperature or humidity sensor of the thin film type, and sensors obtained thereby
US5026667A (en) * 1987-12-29 1991-06-25 Analog Devices, Incorporated Producing integrated circuit chips with reduced stress effects
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip
KR0159287B1 (ko) * 1991-01-24 1999-01-15 윤종용 실록산 변성 폴리이미드 수지의 제조방법
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5783452A (en) * 1996-02-02 1998-07-21 University Of Washington Covered microchannels and the microfabrication thereof
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US6319604B1 (en) 1999-07-08 2001-11-20 Phelps Dodge Industries, Inc. Abrasion resistant coated wire
US6914093B2 (en) 2001-10-16 2005-07-05 Phelps Dodge Industries, Inc. Polyamideimide composition
DE10253163B4 (de) * 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
US7658709B2 (en) * 2003-04-09 2010-02-09 Medtronic, Inc. Shape memory alloy actuators
US7973122B2 (en) * 2004-06-17 2011-07-05 General Cable Technologies Corporation Polyamideimide compositions having multifunctional core structures
US20070151743A1 (en) * 2006-01-03 2007-07-05 Murray Thomas J Abrasion resistant coated wire
US20080193637A1 (en) * 2006-01-03 2008-08-14 Murray Thomas J Abrasion resistant coated wire
US7790501B2 (en) * 2008-07-02 2010-09-07 Ati Technologies Ulc Semiconductor chip passivation structures and methods of making the same
US7994044B2 (en) * 2009-09-03 2011-08-09 Ati Technologies Ulc Semiconductor chip with contoured solder structure opening
US8647974B2 (en) 2011-03-25 2014-02-11 Ati Technologies Ulc Method of fabricating a semiconductor chip with supportive terminal pad
JP2014192500A (ja) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd メサ型半導体装置の製造方法

Also Published As

Publication number Publication date
NL6916814A (enExample) 1970-05-12
DE1955730A1 (de) 1970-06-04
FR2022876A1 (enExample) 1970-08-07
BE741192A (enExample) 1970-04-16
JPS497995B1 (enExample) 1974-02-23
ES372779A1 (es) 1971-11-01
US3615913A (en) 1971-10-26
BR6913970D0 (pt) 1973-01-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee