GB1265896A - - Google Patents

Info

Publication number
GB1265896A
GB1265896A GB1265896DA GB1265896A GB 1265896 A GB1265896 A GB 1265896A GB 1265896D A GB1265896D A GB 1265896DA GB 1265896 A GB1265896 A GB 1265896A
Authority
GB
United Kingdom
Prior art keywords
layer
semi
conductor
level
interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1265896A publication Critical patent/GB1265896A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB1265896D 1968-05-17 1969-05-08 Expired GB1265896A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72998568A 1968-05-17 1968-05-17
US73004768A 1968-05-17 1968-05-17

Publications (1)

Publication Number Publication Date
GB1265896A true GB1265896A (enExample) 1972-03-08

Family

ID=27111970

Family Applications (2)

Application Number Title Priority Date Filing Date
GB22235/69A Expired GB1263381A (en) 1968-05-17 1969-05-01 Metal contact and interconnection system for nonhermetic enclosed semiconductor devices
GB1265896D Expired GB1265896A (enExample) 1968-05-17 1969-05-08

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB22235/69A Expired GB1263381A (en) 1968-05-17 1969-05-01 Metal contact and interconnection system for nonhermetic enclosed semiconductor devices

Country Status (4)

Country Link
DE (2) DE1923253A1 (enExample)
FR (2) FR2008771B1 (enExample)
GB (2) GB1263381A (enExample)
NL (2) NL6907539A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE763522A (fr) * 1970-03-03 1971-07-16 Licentia Gmbh Serie de couches de contact pour des elements de construction semi-conducteurs
US4166279A (en) * 1977-12-30 1979-08-28 International Business Machines Corporation Electromigration resistance in gold thin film conductors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134170C (enExample) * 1963-12-17 1900-01-01
US3368113A (en) * 1965-06-28 1968-02-06 Westinghouse Electric Corp Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation
DE1283970B (de) * 1966-03-19 1968-11-28 Siemens Ag Metallischer Kontakt an einem Halbleiterbauelement
NL6706641A (enExample) * 1966-11-07 1968-11-13

Also Published As

Publication number Publication date
FR2008771B1 (enExample) 1973-08-10
DE1924845A1 (de) 1969-11-27
GB1263381A (en) 1972-02-09
NL6907539A (enExample) 1969-11-19
FR2011844B1 (enExample) 1973-07-13
DE1924845C3 (de) 1978-11-16
FR2008771A1 (enExample) 1970-01-23
NL163065C (nl) 1980-07-15
FR2011844A1 (enExample) 1970-03-13
NL163065B (nl) 1980-02-15
DE1923253A1 (de) 1969-12-11
NL6907540A (enExample) 1969-11-19
DE1924845B2 (de) 1978-03-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years