GB1250099A - - Google Patents

Info

Publication number
GB1250099A
GB1250099A GB1892069A GB1250099DA GB1250099A GB 1250099 A GB1250099 A GB 1250099A GB 1892069 A GB1892069 A GB 1892069A GB 1250099D A GB1250099D A GB 1250099DA GB 1250099 A GB1250099 A GB 1250099A
Authority
GB
United Kingdom
Prior art keywords
layer
glaze
silicon
semi
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1892069A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1250099A publication Critical patent/GB1250099A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
GB1892069A 1969-04-14 1969-04-14 Expired GB1250099A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1892069 1969-04-14

Publications (1)

Publication Number Publication Date
GB1250099A true GB1250099A (enExample) 1971-10-20

Family

ID=10120730

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1892069A Expired GB1250099A (enExample) 1969-04-14 1969-04-14

Country Status (1)

Country Link
GB (1) GB1250099A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2382095A1 (fr) * 1977-02-24 1978-09-22 Rca Corp Structure de passivation en plusieurs couches et procede de fabrication
FR2382094A1 (fr) * 1977-02-24 1978-09-22 Rca Corp Passivation d'une interception de surface d'une jonction pn
FR2402303A1 (fr) * 1977-09-03 1979-03-30 Semikron Gleichrichterbau Traitement de surface de stabilisation de corps semi-conducteurs
FR2406309A1 (fr) * 1977-10-11 1979-05-11 Western Electric Co Dispositf optique a semiconducteurs comportant un revetement de verre
FR2423866A1 (fr) * 1978-04-18 1979-11-16 Westinghouse Electric Corp Diode encapsulee dans du verre
GB2180991A (en) * 1985-08-28 1987-04-08 Mitsubishi Electric Corp Silicide electrode for semiconductor device
US4729969A (en) * 1985-09-05 1988-03-08 Mitsubishi Denki Kabushiki Kaisha Method for forming silicide electrode in semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2382095A1 (fr) * 1977-02-24 1978-09-22 Rca Corp Structure de passivation en plusieurs couches et procede de fabrication
FR2382094A1 (fr) * 1977-02-24 1978-09-22 Rca Corp Passivation d'une interception de surface d'une jonction pn
FR2402303A1 (fr) * 1977-09-03 1979-03-30 Semikron Gleichrichterbau Traitement de surface de stabilisation de corps semi-conducteurs
FR2406309A1 (fr) * 1977-10-11 1979-05-11 Western Electric Co Dispositf optique a semiconducteurs comportant un revetement de verre
FR2423866A1 (fr) * 1978-04-18 1979-11-16 Westinghouse Electric Corp Diode encapsulee dans du verre
GB2180991A (en) * 1985-08-28 1987-04-08 Mitsubishi Electric Corp Silicide electrode for semiconductor device
US4729969A (en) * 1985-09-05 1988-03-08 Mitsubishi Denki Kabushiki Kaisha Method for forming silicide electrode in semiconductor device

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLE Entries relating assignments, transmissions, licences in the register of patents
PLNP Patent lapsed through nonpayment of renewal fees