BE763522A - Serie de couches de contact pour des elements de construction semi-conducteurs - Google Patents
Serie de couches de contact pour des elements de construction semi-conducteursInfo
- Publication number
- BE763522A BE763522A BE763522A BE763522A BE763522A BE 763522 A BE763522 A BE 763522A BE 763522 A BE763522 A BE 763522A BE 763522 A BE763522 A BE 763522A BE 763522 A BE763522 A BE 763522A
- Authority
- BE
- Belgium
- Prior art keywords
- series
- contact layers
- construction elements
- semiconductor construction
- semiconductor
- Prior art date
Links
- 238000010276 construction Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702009863 DE2009863C3 (de) | 1970-03-03 | Nichtsperrender Kontakt aus mehreren Schichten für Silizium-Halbleiterbauelemente |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE763522A true BE763522A (fr) | 1971-07-16 |
Family
ID=5763893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE763522A BE763522A (fr) | 1970-03-03 | 1971-02-26 | Serie de couches de contact pour des elements de construction semi-conducteurs |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3706015A (fr) |
| BE (1) | BE763522A (fr) |
| FR (1) | FR2081661B1 (fr) |
| GB (1) | GB1341124A (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042954A (en) * | 1975-05-19 | 1977-08-16 | National Semiconductor Corporation | Method for forming gang bonding bumps on integrated circuit semiconductor devices |
| JPS5287360A (en) * | 1976-01-16 | 1977-07-21 | Nec Home Electronics Ltd | Semiconductor device |
| US4290079A (en) * | 1979-06-29 | 1981-09-15 | International Business Machines Corporation | Improved solder interconnection between a semiconductor device and a supporting substrate |
| US4360142A (en) * | 1979-06-29 | 1982-11-23 | International Business Machines Corporation | Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate |
| US4737839A (en) * | 1984-03-19 | 1988-04-12 | Trilogy Computer Development Partners, Ltd. | Semiconductor chip mounting system |
| US4954870A (en) * | 1984-12-28 | 1990-09-04 | Kabushiki Kaisha Toshiba | Semiconductor device |
| DE4139908A1 (de) * | 1991-12-04 | 1993-06-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | Halbleiteranordnung mit metallschichtsystem sowie verfahren zur herstellung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436614A (en) * | 1965-04-20 | 1969-04-01 | Nippon Telegraph & Telephone | Nonrectifying laminated ohmic contact for semiconductors consisting of chromium and 80% nickel |
| DE1283970B (de) * | 1966-03-19 | 1968-11-28 | Siemens Ag | Metallischer Kontakt an einem Halbleiterbauelement |
| GB1263381A (en) * | 1968-05-17 | 1972-02-09 | Texas Instruments Inc | Metal contact and interconnection system for nonhermetic enclosed semiconductor devices |
| US3599060A (en) * | 1968-11-25 | 1971-08-10 | Gen Electric | A multilayer metal contact for semiconductor device |
-
1971
- 1971-02-26 BE BE763522A patent/BE763522A/fr unknown
- 1971-03-02 US US120220A patent/US3706015A/en not_active Expired - Lifetime
- 1971-03-02 FR FR7107159A patent/FR2081661B1/fr not_active Expired
- 1971-04-19 GB GB2273771A patent/GB1341124A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2009863B2 (de) | 1977-05-05 |
| US3706015A (en) | 1972-12-12 |
| FR2081661A1 (fr) | 1971-12-10 |
| DE2009863A1 (de) | 1971-09-30 |
| GB1341124A (en) | 1973-12-19 |
| FR2081661B1 (fr) | 1977-01-28 |
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