IT995589B - Complesso di semiconduttori - Google Patents
Complesso di semiconduttoriInfo
- Publication number
- IT995589B IT995589B IT29738/73A IT2973873A IT995589B IT 995589 B IT995589 B IT 995589B IT 29738/73 A IT29738/73 A IT 29738/73A IT 2973873 A IT2973873 A IT 2973873A IT 995589 B IT995589 B IT 995589B
- Authority
- IT
- Italy
- Prior art keywords
- semiconductors
- complex
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00301041A US3808471A (en) | 1972-10-26 | 1972-10-26 | Expandible pressure mounted semiconductor assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT995589B true IT995589B (it) | 1975-11-20 |
Family
ID=23161680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT29738/73A IT995589B (it) | 1972-10-26 | 1973-10-04 | Complesso di semiconduttori |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3808471A (it) |
| JP (1) | JPS4974338A (it) |
| AU (1) | AU6023873A (it) |
| CA (1) | CA989511A (it) |
| DE (1) | DE2348172A1 (it) |
| FR (1) | FR2204888A1 (it) |
| IT (1) | IT995589B (it) |
| ZA (1) | ZA737231B (it) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916435A (en) * | 1974-09-09 | 1975-10-28 | Gen Motors Corp | Heat sink assembly for button diode rectifiers |
| CS180334B1 (en) * | 1975-11-28 | 1977-12-30 | Jiri Kovar | Power semiconducting disc elements suppressing and jigging equipment |
| US4263607A (en) * | 1979-03-06 | 1981-04-21 | Alsthom-Atlantique | Snap fit support housing for a semiconductor power wafer |
| DE2909138A1 (de) * | 1979-03-08 | 1980-09-11 | Siemens Ag | Thyristorsaeule |
| FR2451632A1 (fr) * | 1979-03-12 | 1980-10-10 | Alsthom Atlantique | Montage de semi-conducteurs de puissance refroidis par un flugene |
| US4504850A (en) * | 1981-10-02 | 1985-03-12 | Westinghouse Electric Corp. | Disc-type semiconductor mounting arrangement with force distribution spacer |
| US5034803A (en) * | 1988-08-01 | 1991-07-23 | Sundstrand Corporation | Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies |
| US4830979A (en) * | 1988-08-01 | 1989-05-16 | Sundstrand Corp. | Method of manufacturing hermetically sealed compression bonded circuit assemblies |
| US4954876A (en) * | 1988-08-01 | 1990-09-04 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements |
| US4985752A (en) * | 1988-08-01 | 1991-01-15 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements |
| US5105262A (en) * | 1988-09-19 | 1992-04-14 | Ford Motor Company | Thick film circuit housing assembly design |
| US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
| DE102007016222B3 (de) * | 2007-04-04 | 2008-11-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL288523A (it) * | 1961-08-04 | 1900-01-01 | ||
| US3413532A (en) * | 1965-02-08 | 1968-11-26 | Westinghouse Electric Corp | Compression bonded semiconductor device |
| CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
| DE1914790A1 (de) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
| US3652903A (en) * | 1971-02-01 | 1972-03-28 | Gen Electric | Fluid cooled pressure assembly |
-
1972
- 1972-10-26 US US00301041A patent/US3808471A/en not_active Expired - Lifetime
-
1973
- 1973-09-11 ZA ZA737231A patent/ZA737231B/xx unknown
- 1973-09-12 AU AU60238/73A patent/AU6023873A/en not_active Expired
- 1973-09-19 CA CA181,458A patent/CA989511A/en not_active Expired
- 1973-09-25 DE DE19732348172 patent/DE2348172A1/de active Pending
- 1973-10-01 JP JP48109434A patent/JPS4974338A/ja active Pending
- 1973-10-04 IT IT29738/73A patent/IT995589B/it active
- 1973-10-25 FR FR7338114A patent/FR2204888A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2204888A1 (it) | 1974-05-24 |
| ZA737231B (en) | 1974-09-25 |
| CA989511A (en) | 1976-05-18 |
| US3808471A (en) | 1974-04-30 |
| AU6023873A (en) | 1975-03-13 |
| DE2348172A1 (de) | 1974-05-09 |
| JPS4974338A (it) | 1974-07-18 |
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