FR2081661A1 - - Google Patents

Info

Publication number
FR2081661A1
FR2081661A1 FR7107159A FR7107159A FR2081661A1 FR 2081661 A1 FR2081661 A1 FR 2081661A1 FR 7107159 A FR7107159 A FR 7107159A FR 7107159 A FR7107159 A FR 7107159A FR 2081661 A1 FR2081661 A1 FR 2081661A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7107159A
Other versions
FR2081661B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19702009863 external-priority patent/DE2009863C3/de
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2081661A1 publication Critical patent/FR2081661A1/fr
Application granted granted Critical
Publication of FR2081661B1 publication Critical patent/FR2081661B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
FR7107159A 1970-03-03 1971-03-02 Expired FR2081661B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702009863 DE2009863C3 (de) 1970-03-03 Nichtsperrender Kontakt aus mehreren Schichten für Silizium-Halbleiterbauelemente

Publications (2)

Publication Number Publication Date
FR2081661A1 true FR2081661A1 (fr) 1971-12-10
FR2081661B1 FR2081661B1 (fr) 1977-01-28

Family

ID=5763893

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7107159A Expired FR2081661B1 (fr) 1970-03-03 1971-03-02

Country Status (4)

Country Link
US (1) US3706015A (fr)
BE (1) BE763522A (fr)
FR (1) FR2081661B1 (fr)
GB (1) GB1341124A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011563A1 (fr) * 1991-12-04 1993-06-10 Robert Bosch Gmbh Dispositif semi-conducteur avec un systeme de couches metalliques et procede pour sa fabrication

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042954A (en) * 1975-05-19 1977-08-16 National Semiconductor Corporation Method for forming gang bonding bumps on integrated circuit semiconductor devices
JPS5287360A (en) * 1976-01-16 1977-07-21 Nec Home Electronics Ltd Semiconductor device
US4360142A (en) * 1979-06-29 1982-11-23 International Business Machines Corporation Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate
US4290079A (en) * 1979-06-29 1981-09-15 International Business Machines Corporation Improved solder interconnection between a semiconductor device and a supporting substrate
US4737839A (en) * 1984-03-19 1988-04-12 Trilogy Computer Development Partners, Ltd. Semiconductor chip mounting system
US4954870A (en) * 1984-12-28 1990-09-04 Kabushiki Kaisha Toshiba Semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1515415A (fr) * 1966-03-19 1968-03-01 Siemens Ag Surface métallique de contact d'un composant semiconducteur
US3436614A (en) * 1965-04-20 1969-04-01 Nippon Telegraph & Telephone Nonrectifying laminated ohmic contact for semiconductors consisting of chromium and 80% nickel
FR2008771A1 (fr) * 1968-05-17 1970-01-23 Texas Instruments Inc
FR2024203A1 (fr) * 1968-11-25 1970-08-28 Gen Electric

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436614A (en) * 1965-04-20 1969-04-01 Nippon Telegraph & Telephone Nonrectifying laminated ohmic contact for semiconductors consisting of chromium and 80% nickel
FR1515415A (fr) * 1966-03-19 1968-03-01 Siemens Ag Surface métallique de contact d'un composant semiconducteur
FR2008771A1 (fr) * 1968-05-17 1970-01-23 Texas Instruments Inc
FR2024203A1 (fr) * 1968-11-25 1970-08-28 Gen Electric

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011563A1 (fr) * 1991-12-04 1993-06-10 Robert Bosch Gmbh Dispositif semi-conducteur avec un systeme de couches metalliques et procede pour sa fabrication

Also Published As

Publication number Publication date
GB1341124A (en) 1973-12-19
FR2081661B1 (fr) 1977-01-28
DE2009863A1 (de) 1971-09-30
BE763522A (fr) 1971-07-16
DE2009863B2 (de) 1977-05-05
US3706015A (en) 1972-12-12

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Legal Events

Date Code Title Description
ST Notification of lapse