FR3067627B1 - Procede de polissage cmp a haut debit - Google Patents
Procede de polissage cmp a haut debit Download PDFInfo
- Publication number
- FR3067627B1 FR3067627B1 FR1855166A FR1855166A FR3067627B1 FR 3067627 B1 FR3067627 B1 FR 3067627B1 FR 1855166 A FR1855166 A FR 1855166A FR 1855166 A FR1855166 A FR 1855166A FR 3067627 B1 FR3067627 B1 FR 3067627B1
- Authority
- FR
- France
- Prior art keywords
- high throughput
- polishing process
- cmp polishing
- throughput cmp
- throughput
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
- H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
- H01L21/31056—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching the removal being a selective chemical etching step, e.g. selective dry etching through a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201715623195A | 2017-06-14 | 2017-06-14 | |
US15623195 | 2017-06-14 | ||
US201715624964A | 2017-06-16 | 2017-06-16 | |
US15624964 | 2017-06-16 | ||
US15725876 | 2017-10-05 | ||
US15/725,876 US10857647B2 (en) | 2017-06-14 | 2017-10-05 | High-rate CMP polishing method |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3067627A1 FR3067627A1 (fr) | 2018-12-21 |
FR3067627B1 true FR3067627B1 (fr) | 2022-07-08 |
Family
ID=64457660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1855166A Active FR3067627B1 (fr) | 2017-06-14 | 2018-06-13 | Procede de polissage cmp a haut debit |
Country Status (8)
Country | Link |
---|---|
US (1) | US10857647B2 (fr) |
JP (1) | JP7168352B2 (fr) |
KR (1) | KR102660718B1 (fr) |
CN (1) | CN109079648B (fr) |
DE (1) | DE102018004633A1 (fr) |
FR (1) | FR3067627B1 (fr) |
SG (1) | SG10201804561QA (fr) |
TW (1) | TWI775852B (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102247186B1 (ko) | 2018-11-08 | 2021-05-04 | 주식회사 엘지화학 | 전도성 농축 수지 조성물, 전도성 폴리아미드 수지 조성물, 이의 제조방법 및 성형품 |
TWI718508B (zh) * | 2019-03-25 | 2021-02-11 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法以及研磨方法 |
KR20210116759A (ko) | 2020-03-13 | 2021-09-28 | 삼성전자주식회사 | Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치 |
Family Cites Families (64)
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JPS60242975A (ja) * | 1984-05-14 | 1985-12-02 | Kanebo Ltd | 平面研磨装置 |
US5076024A (en) | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
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US6135856A (en) * | 1996-01-19 | 2000-10-24 | Micron Technology, Inc. | Apparatus and method for semiconductor planarization |
US5778481A (en) | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
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US6749714B1 (en) | 1999-03-30 | 2004-06-15 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
US6220942B1 (en) | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
KR200301077Y1 (ko) | 1999-06-28 | 2003-01-29 | 주식회사 하이닉스반도체 | 반도체 소자 연마장치의 연마패드 |
JP2001071256A (ja) | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
US6827638B2 (en) * | 2000-01-31 | 2004-12-07 | Shin-Etsu Handotai Co., Ltd. | Polishing device and method |
TW479000B (en) | 2000-02-24 | 2002-03-11 | United Microelectronics Corp | Polish pad for polishing semiconductor wafer |
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US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
JP4087581B2 (ja) | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | 研磨装置 |
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US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
US6918824B2 (en) | 2003-09-25 | 2005-07-19 | Novellus Systems, Inc. | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device |
US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
US6955587B2 (en) | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
JP2005262341A (ja) | 2004-03-16 | 2005-09-29 | Noritake Super Abrasive:Kk | Cmpパッドコンディショナー |
US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
KR100568258B1 (ko) * | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
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US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
TWI360459B (en) * | 2008-04-11 | 2012-03-21 | Bestac Advanced Material Co Ltd | A polishing pad having groove structure for avoidi |
JP5472911B2 (ja) * | 2010-02-05 | 2014-04-16 | 浜井産業株式会社 | 研磨装置 |
KR20110100080A (ko) * | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비 |
KR101232787B1 (ko) | 2010-08-18 | 2013-02-13 | 주식회사 엘지화학 | 연마 시스템용 연마 패드 |
US9211628B2 (en) | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
TWI492818B (zh) * | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
US8920219B2 (en) | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
CN103782372A (zh) | 2011-09-15 | 2014-05-07 | 东丽株式会社 | 研磨垫 |
US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
WO2014074521A1 (fr) * | 2012-11-06 | 2014-05-15 | Cabot Microelectronics Corporation | Disque de polissage ayant un motif à rainures concentrique décalé et procédé d'utilisation du disque de polissage pour le polissage d'un substrat avec celui-ci |
US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US9415479B2 (en) * | 2013-02-08 | 2016-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive chemical mechanical planarization polishing pad |
TWM459065U (zh) | 2013-04-29 | 2013-08-11 | Iv Technologies Co Ltd | 硏磨墊以及硏磨系統 |
TWM475334U (en) | 2013-06-07 | 2014-04-01 | Iv Technologies Co Ltd | Polishing pad |
TWI599447B (zh) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
KR102160111B1 (ko) * | 2013-12-11 | 2020-09-25 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드 |
TWI549781B (zh) * | 2015-08-07 | 2016-09-21 | 智勝科技股份有限公司 | 研磨墊、研磨系統及研磨方法 |
CN106564004B (zh) * | 2016-11-17 | 2018-10-19 | 湖北鼎龙控股股份有限公司 | 一种抛光垫 |
-
2017
- 2017-10-05 US US15/725,876 patent/US10857647B2/en active Active
-
2018
- 2018-05-11 CN CN201810445350.7A patent/CN109079648B/zh active Active
- 2018-05-13 TW TW107116213A patent/TWI775852B/zh active
- 2018-05-28 KR KR1020180060234A patent/KR102660718B1/ko active IP Right Grant
- 2018-05-30 SG SG10201804561QA patent/SG10201804561QA/en unknown
- 2018-06-11 DE DE102018004633.9A patent/DE102018004633A1/de active Pending
- 2018-06-11 JP JP2018111060A patent/JP7168352B2/ja active Active
- 2018-06-13 FR FR1855166A patent/FR3067627B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
TW201908058A (zh) | 2019-03-01 |
TWI775852B (zh) | 2022-09-01 |
CN109079648B (zh) | 2021-07-20 |
FR3067627A1 (fr) | 2018-12-21 |
SG10201804561QA (en) | 2019-01-30 |
DE102018004633A1 (de) | 2018-12-20 |
JP7168352B2 (ja) | 2022-11-09 |
JP2019034402A (ja) | 2019-03-07 |
US20180361532A1 (en) | 2018-12-20 |
CN109079648A (zh) | 2018-12-25 |
KR20180136373A (ko) | 2018-12-24 |
KR102660718B1 (ko) | 2024-04-26 |
US10857647B2 (en) | 2020-12-08 |
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