SG11201606945PA - Workpiece double-disc grinding method - Google Patents
Workpiece double-disc grinding methodInfo
- Publication number
- SG11201606945PA SG11201606945PA SG11201606945PA SG11201606945PA SG11201606945PA SG 11201606945P A SG11201606945P A SG 11201606945PA SG 11201606945P A SG11201606945P A SG 11201606945PA SG 11201606945P A SG11201606945P A SG 11201606945PA SG 11201606945P A SG11201606945P A SG 11201606945PA
- Authority
- SG
- Singapore
- Prior art keywords
- grinding method
- disc grinding
- workpiece double
- workpiece
- double
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014031004A JP6040947B2 (en) | 2014-02-20 | 2014-02-20 | Double-head grinding method for workpieces |
| PCT/JP2015/000295 WO2015125412A1 (en) | 2014-02-20 | 2015-01-23 | Double-headed workpiece grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201606945PA true SG11201606945PA (en) | 2016-10-28 |
Family
ID=53877940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201606945PA SG11201606945PA (en) | 2014-02-20 | 2015-01-23 | Workpiece double-disc grinding method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9962802B2 (en) |
| JP (1) | JP6040947B2 (en) |
| KR (1) | KR102098260B1 (en) |
| CN (1) | CN105980103B (en) |
| DE (1) | DE112015000522T5 (en) |
| SG (1) | SG11201606945PA (en) |
| TW (1) | TWI602656B (en) |
| WO (1) | WO2015125412A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7159861B2 (en) | 2018-12-27 | 2022-10-25 | 株式会社Sumco | Double-headed grinding method |
| CN110118683B (en) * | 2019-06-12 | 2020-06-19 | 华东理工大学 | Micro-sample grinding device |
| CN114227524A (en) * | 2021-12-30 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | Double-side polishing apparatus and double-side polishing method |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616578A (en) * | 1969-01-10 | 1971-11-02 | Ingersoll Milling Machine Co | Method for turning workpieces |
| JPS5733928A (en) * | 1980-07-29 | 1982-02-24 | Inoue Japax Res Inc | Carbon electrode for electric discharge machining |
| JPS5871062A (en) * | 1981-10-24 | 1983-04-27 | Ntn Toyo Bearing Co Ltd | Machining method of inner ring in tapered roller bearing |
| US5643051A (en) * | 1995-06-16 | 1997-07-01 | The University Of Connecticut | Centerless grinding process and apparatus therefor |
| KR100227924B1 (en) * | 1995-07-28 | 1999-11-01 | 가이데 히사오 | Wafer fabricating method and polishing method therefor and apparatus thereof |
| JP3471167B2 (en) * | 1996-05-21 | 2003-11-25 | 昭和電工株式会社 | Method for producing cubic boron nitride |
| TW589415B (en) * | 1998-03-09 | 2004-06-01 | Shinetsu Handotai Kk | Method for producing silicon single crystal wafer and silicon single crystal wafer |
| JP2000052209A (en) * | 1998-08-06 | 2000-02-22 | Nippon Sheet Glass Co Ltd | Double-headed flat surface grinding device and grinding method using it |
| JP2005238444A (en) * | 1999-05-07 | 2005-09-08 | Shin Etsu Handotai Co Ltd | Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method and double-sided simultaneous lapping machine |
| GB2357720B (en) * | 1999-10-27 | 2003-05-07 | Unova Uk Ltd | Crankpin grinding method |
| DE10023002B4 (en) * | 2000-05-11 | 2006-10-26 | Siltronic Ag | Set of carriers and its use |
| US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| JP4038429B2 (en) * | 2000-10-26 | 2008-01-23 | 信越半導体株式会社 | Wafer manufacturing method, polishing apparatus, and wafer |
| DE10058305A1 (en) * | 2000-11-24 | 2002-06-06 | Wacker Siltronic Halbleitermat | Process for the surface polishing of silicon wafers |
| JP4093793B2 (en) * | 2002-04-30 | 2008-06-04 | 信越半導体株式会社 | Semiconductor wafer manufacturing method and wafer |
| JP2005246510A (en) * | 2004-03-02 | 2005-09-15 | Nissan Motor Co Ltd | Highly smooth grinding method for metal material, and highly smooth grinding device for metal material |
| JP4420023B2 (en) * | 2004-08-17 | 2010-02-24 | 信越半導体株式会社 | Semiconductor wafer measurement method, manufacturing process management method, and semiconductor wafer manufacturing method |
| CN101056741B (en) * | 2004-11-19 | 2010-12-08 | 丰田万磨株式会社 | Grinding wheel |
| JP4670566B2 (en) * | 2005-09-29 | 2011-04-13 | 信越半導体株式会社 | Semiconductor wafer double-head grinding apparatus, hydrostatic pad and double-head grinding method using the same |
| JP2007210054A (en) * | 2006-02-08 | 2007-08-23 | Toshiba Ceramics Co Ltd | Cup type grinding wheel, double-end grinder and double-end grinding method |
| JP5141072B2 (en) * | 2006-04-25 | 2013-02-13 | 日本精工株式会社 | Manufacturing method of outer ring for bearing unit |
| DE102006032455A1 (en) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Method for simultaneous double-sided grinding of a plurality of semiconductor wafers and semiconductor wafer with excellent flatness |
| KR100772034B1 (en) * | 2006-12-08 | 2007-10-31 | 주식회사 썬텍인더스트리 | Method for preparing abrasive sheet having coated three-dimensional abrasive structures |
| JP2009094326A (en) | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | Method of grinding wafer |
| JP4985451B2 (en) * | 2008-02-14 | 2012-07-25 | 信越半導体株式会社 | Double-head grinding apparatus for workpiece and double-head grinding method for workpiece |
| JP6032087B2 (en) * | 2012-03-30 | 2016-11-24 | 三菱化学株式会社 | Method for producing group 13 nitride crystal substrate |
| JP5724958B2 (en) * | 2012-07-03 | 2015-05-27 | 信越半導体株式会社 | Double-head grinding apparatus and double-head grinding method for workpiece |
-
2014
- 2014-02-20 JP JP2014031004A patent/JP6040947B2/en active Active
-
2015
- 2015-01-23 WO PCT/JP2015/000295 patent/WO2015125412A1/en active Application Filing
- 2015-01-23 KR KR1020167022753A patent/KR102098260B1/en active IP Right Grant
- 2015-01-23 CN CN201580008363.2A patent/CN105980103B/en active Active
- 2015-01-23 US US15/116,130 patent/US9962802B2/en active Active
- 2015-01-23 SG SG11201606945PA patent/SG11201606945PA/en unknown
- 2015-01-23 DE DE112015000522.6T patent/DE112015000522T5/en active Pending
- 2015-02-09 TW TW104104270A patent/TWI602656B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015155129A (en) | 2015-08-27 |
| CN105980103B (en) | 2017-12-01 |
| TW201600247A (en) | 2016-01-01 |
| JP6040947B2 (en) | 2016-12-07 |
| US20170136596A1 (en) | 2017-05-18 |
| DE112015000522T5 (en) | 2016-10-13 |
| US9962802B2 (en) | 2018-05-08 |
| CN105980103A (en) | 2016-09-28 |
| KR102098260B1 (en) | 2020-04-07 |
| WO2015125412A1 (en) | 2015-08-27 |
| KR20160124110A (en) | 2016-10-26 |
| TWI602656B (en) | 2017-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL253117B (en) | Abrasive articles and methods for forming same | |
| PL3046983T3 (en) | Multilayer grinding particle | |
| SG11201608004XA (en) | Polishing pad and process for producing same | |
| SG10201508134VA (en) | Workpiece Processing Method | |
| SG10201705676VA (en) | Grinding apparatus | |
| SG10201802846XA (en) | Polishing apparatus | |
| SG10201502285YA (en) | Polishing apparatus | |
| HUE038938T2 (en) | Honing tool and honing method | |
| SG10201501193YA (en) | Polishing apparatus | |
| SG10201608734WA (en) | Polishing apparatus | |
| SG10201604365YA (en) | Polishing apparatus | |
| SG11201702302QA (en) | Polishing apparatus | |
| SG10201504316QA (en) | Polishing Apparatus | |
| AU367799S (en) | Sanding tool | |
| PL2987556T3 (en) | Grinding machine | |
| HK1222242A1 (en) | Diamond processing | |
| PL2965864T3 (en) | Sanding machine | |
| SG11201700400UA (en) | Polishing apparatus | |
| SG10201505284QA (en) | Polishing apparatus | |
| AU367719S (en) | Sanding tool | |
| SG10201607697VA (en) | Polishing apparatus | |
| SG11201606945PA (en) | Workpiece double-disc grinding method | |
| SG11201800067VA (en) | Grinding disc | |
| SG10201600749RA (en) | Abrasive grindstone | |
| PL2957382T3 (en) | Machining centre for machining workpieces |