FR2869456B1 - Solution de polissage de barriere - Google Patents

Solution de polissage de barriere

Info

Publication number
FR2869456B1
FR2869456B1 FR0551010A FR0551010A FR2869456B1 FR 2869456 B1 FR2869456 B1 FR 2869456B1 FR 0551010 A FR0551010 A FR 0551010A FR 0551010 A FR0551010 A FR 0551010A FR 2869456 B1 FR2869456 B1 FR 2869456B1
Authority
FR
France
Prior art keywords
polishing solution
barrier polishing
barrier
solution
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0551010A
Other languages
English (en)
Other versions
FR2869456A1 (fr
Inventor
Zhendong Liu
John Quanci
Robert E Schmidt
Thomas Terence
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2869456A1 publication Critical patent/FR2869456A1/fr
Application granted granted Critical
Publication of FR2869456B1 publication Critical patent/FR2869456B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0704—Roasting devices for outdoor use; Barbecues with horizontal fire box
    • A47J37/0713—Roasting devices for outdoor use; Barbecues with horizontal fire box with gas burners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0786—Accessories
    • A47J2037/0795—Adjustable food supports, e.g. for height adjustment
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0786—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Food Science & Technology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR0551010A 2004-04-21 2005-04-20 Solution de polissage de barriere Active FR2869456B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/830,268 US7253111B2 (en) 2004-04-21 2004-04-21 Barrier polishing solution

Publications (2)

Publication Number Publication Date
FR2869456A1 FR2869456A1 (fr) 2005-10-28
FR2869456B1 true FR2869456B1 (fr) 2006-11-10

Family

ID=34954976

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0551010A Active FR2869456B1 (fr) 2004-04-21 2005-04-20 Solution de polissage de barriere

Country Status (7)

Country Link
US (1) US7253111B2 (fr)
JP (1) JP4761815B2 (fr)
KR (1) KR101200566B1 (fr)
CN (1) CN1696235B (fr)
DE (1) DE102005016554A1 (fr)
FR (1) FR2869456B1 (fr)
TW (1) TWI363789B (fr)

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JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP5026665B2 (ja) * 2004-10-15 2012-09-12 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US7888302B2 (en) * 2005-02-03 2011-02-15 Air Products And Chemicals, Inc. Aqueous based residue removers comprising fluoride
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US20070068901A1 (en) * 2005-09-29 2007-03-29 Wang Yuchun Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
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US7534753B2 (en) * 2006-01-12 2009-05-19 Air Products And Chemicals, Inc. pH buffered aqueous cleaning composition and method for removing photoresist residue
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US7842192B2 (en) * 2006-02-08 2010-11-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-component barrier polishing solution
US20070209287A1 (en) * 2006-03-13 2007-09-13 Cabot Microelectronics Corporation Composition and method to polish silicon nitride
US7732393B2 (en) * 2006-03-20 2010-06-08 Cabot Microelectronics Corporation Oxidation-stabilized CMP compositions and methods
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KR101032504B1 (ko) * 2006-06-30 2011-05-04 주식회사 엘지화학 Ｃｍｐ 슬러리
JP5335183B2 (ja) * 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
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JP5441345B2 (ja) * 2008-03-27 2014-03-12 富士フイルム株式会社 研磨液、及び研磨方法
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CN104968838A (zh) * 2013-04-12 2015-10-07 三菱瓦斯化学株式会社 用于蚀刻含有铜和钛的多层膜的液体组合物、和使用该组合物的蚀刻方法、多层膜配线的制造方法、基板
US9388328B2 (en) * 2013-08-23 2016-07-12 Diamond Innovations, Inc. Lapping slurry having a cationic surfactant
CN104647197B (zh) * 2013-11-22 2019-01-04 安集微电子（上海）有限公司 一种用于抛光钽的化学机械抛光方法
EP3080240A4 (fr) 2013-12-11 2017-07-19 FujiFilm Electronic Materials USA, Inc. Formulation de nettoyage pour éliminer des résidus présents sur des surfaces
WO2015119925A1 (fr) * 2014-02-05 2015-08-13 Advanced Technology Materials, Inc. Compositions post-cmp sans amine et leur méthode d'utilisation
US9275899B2 (en) 2014-06-27 2016-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing tungsten
KR101682085B1 (ko) * 2015-07-09 2016-12-02 주식회사 케이씨텍 텅스텐 연마용 슬러리 조성물
SG10201904669TA (en) * 2018-06-28 2020-01-30 Kctech Co Ltd Polishing Slurry Composition
CN111378371B (zh) * 2018-12-28 2022-05-13 安集微电子科技（上海）股份有限公司 一种焦性没食子酸在二氧化硅抛光中的用途
CN115101471A (zh) * 2022-03-21 2022-09-23 康劲 一种用于多层铜互连cmp的工艺控制方法

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Also Published As

Publication number Publication date
JP4761815B2 (ja) 2011-08-31
KR101200566B1 (ko) 2012-11-13
US7253111B2 (en) 2007-08-07
TWI363789B (en) 2012-05-11
DE102005016554A1 (de) 2005-11-10
TW200535203A (en) 2005-11-01
US20050236601A1 (en) 2005-10-27
JP2005328043A (ja) 2005-11-24
KR20060047259A (ko) 2006-05-18
FR2869456A1 (fr) 2005-10-28
CN1696235B (zh) 2014-04-09
CN1696235A (zh) 2005-11-16

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