FR2732467B1 - Capteur d'acceleration et procede de fabrication d'un tel capteur - Google Patents
Capteur d'acceleration et procede de fabrication d'un tel capteurInfo
- Publication number
- FR2732467B1 FR2732467B1 FR9601504A FR9601504A FR2732467B1 FR 2732467 B1 FR2732467 B1 FR 2732467B1 FR 9601504 A FR9601504 A FR 9601504A FR 9601504 A FR9601504 A FR 9601504A FR 2732467 B1 FR2732467 B1 FR 2732467B1
- Authority
- FR
- France
- Prior art keywords
- sensor
- manufacturing
- acceleration
- acceleration sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001133 acceleration Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/135—Removal of substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/159—Strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19504151 | 1995-02-10 | ||
| DE19530736A DE19530736B4 (de) | 1995-02-10 | 1995-08-22 | Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2732467A1 FR2732467A1 (fr) | 1996-10-04 |
| FR2732467B1 true FR2732467B1 (fr) | 1999-09-17 |
Family
ID=26012252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9601504A Expired - Lifetime FR2732467B1 (fr) | 1995-02-10 | 1996-02-07 | Capteur d'acceleration et procede de fabrication d'un tel capteur |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US5723353A (fr) |
| JP (2) | JPH08248058A (fr) |
| FR (1) | FR2732467B1 (fr) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19632060B4 (de) * | 1996-08-09 | 2012-05-03 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Drehratensensors |
| US5996411A (en) * | 1996-11-25 | 1999-12-07 | Alliedsignal Inc. | Vibrating beam accelerometer and method for manufacturing the same |
| JP3284921B2 (ja) * | 1997-04-24 | 2002-05-27 | 富士電機株式会社 | 加速度センサならびに角加速度センサおよびそれらの製造方法 |
| JP3187754B2 (ja) * | 1997-09-26 | 2001-07-11 | 富士電機株式会社 | 半導体センサおよびその製造方法 |
| US6332359B1 (en) | 1997-04-24 | 2001-12-25 | Fuji Electric Co., Ltd. | Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
| JP4665942B2 (ja) * | 1998-02-12 | 2011-04-06 | 株式会社デンソー | 半導体力学量センサ |
| JP4003326B2 (ja) | 1998-02-12 | 2007-11-07 | 株式会社デンソー | 半導体力学量センサおよびその製造方法 |
| JP3846094B2 (ja) | 1998-03-17 | 2006-11-15 | 株式会社デンソー | 半導体装置の製造方法 |
| DE19817311B4 (de) * | 1998-04-18 | 2007-03-22 | Robert Bosch Gmbh | Herstellungsverfahren für mikromechanisches Bauelement |
| DE19819456B4 (de) * | 1998-04-30 | 2011-06-09 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements |
| US6287885B1 (en) * | 1998-05-08 | 2001-09-11 | Denso Corporation | Method for manufacturing semiconductor dynamic quantity sensor |
| US6291875B1 (en) | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
| DE19844686A1 (de) * | 1998-09-29 | 2000-04-06 | Fraunhofer Ges Forschung | Mikromechanischer Drehratensensor und Verfahren zur Herstellung |
| JP2000206142A (ja) | 1998-11-13 | 2000-07-28 | Denso Corp | 半導体力学量センサおよびその製造方法 |
| US6433401B1 (en) | 1999-04-06 | 2002-08-13 | Analog Devices Imi, Inc. | Microfabricated structures with trench-isolation using bonded-substrates and cavities |
| WO2001004593A1 (fr) * | 1999-07-09 | 2001-01-18 | Tokin Corporation | Capteur de contrainte capacitif et son procédé d'utilisation |
| DE19939318A1 (de) * | 1999-08-19 | 2001-02-22 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikromechanischen Bauelements |
| US6703679B1 (en) | 1999-08-31 | 2004-03-09 | Analog Devices, Imi, Inc. | Low-resistivity microelectromechanical structures with co-fabricated integrated circuit |
| US6798312B1 (en) | 1999-09-21 | 2004-09-28 | Rockwell Automation Technologies, Inc. | Microelectromechanical system (MEMS) analog electrical isolator |
| GB0000619D0 (en) * | 2000-01-13 | 2000-03-01 | British Aerospace | Accelerometer |
| US6868726B2 (en) * | 2000-01-20 | 2005-03-22 | Analog Devices Imi, Inc. | Position sensing with improved linearity |
| US6440766B1 (en) | 2000-02-16 | 2002-08-27 | Analog Devices Imi, Inc. | Microfabrication using germanium-based release masks |
| US6629461B2 (en) | 2000-03-24 | 2003-10-07 | Onix Microsystems, Inc. | Biased rotatable combdrive actuator methods |
| US6330102B1 (en) | 2000-03-24 | 2001-12-11 | Onix Microsystems | Apparatus and method for 2-dimensional steered-beam NxM optical switch using single-axis mirror arrays and relay optics |
| US6744173B2 (en) * | 2000-03-24 | 2004-06-01 | Analog Devices, Inc. | Multi-layer, self-aligned vertical combdrive electrostatic actuators and fabrication methods |
| US6593677B2 (en) | 2000-03-24 | 2003-07-15 | Onix Microsystems, Inc. | Biased rotatable combdrive devices and methods |
| JP2002005955A (ja) | 2000-06-26 | 2002-01-09 | Denso Corp | 容量式力学量センサ |
| US6988408B2 (en) * | 2000-07-13 | 2006-01-24 | Dong-Il Cho | Surface/bulk micromachined single-crystalline silicon micro-gyroscope |
| US6573154B1 (en) | 2000-10-26 | 2003-06-03 | Institute Of Microelectronics | High aspect ratio trench isolation process for surface micromachined sensors and actuators |
| US6795752B1 (en) | 2000-11-03 | 2004-09-21 | Memsic, Inc. | Thermal convection accelerometer with closed-loop heater control |
| US6629367B2 (en) | 2000-12-06 | 2003-10-07 | Motorola, Inc. | Electrically isolated via in a multilayer ceramic package |
| US6761829B2 (en) * | 2001-04-26 | 2004-07-13 | Rockwell Automation Technologies, Inc. | Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void |
| US6815243B2 (en) * | 2001-04-26 | 2004-11-09 | Rockwell Automation Technologies, Inc. | Method of fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate |
| US6756310B2 (en) * | 2001-09-26 | 2004-06-29 | Rockwell Automation Technologies, Inc. | Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques |
| JP2002357619A (ja) * | 2001-06-01 | 2002-12-13 | Mitsubishi Electric Corp | 加速度センサ及びその製造方法 |
| JP4890689B2 (ja) * | 2001-07-24 | 2012-03-07 | オリンパス株式会社 | 三次元構造体の製造方法及び揺動体の製造方法 |
| US6792804B2 (en) * | 2001-10-19 | 2004-09-21 | Kionix, Inc. | Sensor for measuring out-of-plane acceleration |
| US6690178B2 (en) | 2001-10-26 | 2004-02-10 | Rockwell Automation Technologies, Inc. | On-board microelectromechanical system (MEMS) sensing device for power semiconductors |
| US20040035206A1 (en) * | 2002-03-26 | 2004-02-26 | Ward Paul A. | Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same |
| US6925710B1 (en) | 2002-03-27 | 2005-08-09 | Analog Devices, Inc. | Method for manufacturing microelectromechanical combdrive device |
| JP3652671B2 (ja) * | 2002-05-24 | 2005-05-25 | 沖電気工業株式会社 | 測定用配線パターン及びその測定方法 |
| DE60333756D1 (de) * | 2002-06-28 | 2010-09-23 | Sumitomo Precision Prod Co | Leiter für eine bewegliche elektrische schaltung und kreisel des vibrationstyps |
| FR2849014B1 (fr) * | 2002-12-20 | 2005-06-10 | Commissariat Energie Atomique | Microstruture encapsulee et procede de fabrication d'une telle microstructure |
| US6916728B2 (en) * | 2002-12-23 | 2005-07-12 | Freescale Semiconductor, Inc. | Method for forming a semiconductor structure through epitaxial growth |
| US7122395B2 (en) * | 2002-12-23 | 2006-10-17 | Motorola, Inc. | Method of forming semiconductor devices through epitaxy |
| US6770506B2 (en) * | 2002-12-23 | 2004-08-03 | Motorola, Inc. | Release etch method for micromachined sensors |
| US7514283B2 (en) * | 2003-03-20 | 2009-04-07 | Robert Bosch Gmbh | Method of fabricating electromechanical device having a controlled atmosphere |
| US6975193B2 (en) * | 2003-03-25 | 2005-12-13 | Rockwell Automation Technologies, Inc. | Microelectromechanical isolating circuit |
| US8912174B2 (en) * | 2003-04-16 | 2014-12-16 | Mylan Pharmaceuticals Inc. | Formulations and methods for treating rhinosinusitis |
| US7075160B2 (en) | 2003-06-04 | 2006-07-11 | Robert Bosch Gmbh | Microelectromechanical systems and devices having thin film encapsulated mechanical structures |
| US6936491B2 (en) | 2003-06-04 | 2005-08-30 | Robert Bosch Gmbh | Method of fabricating microelectromechanical systems and devices having trench isolated contacts |
| US6952041B2 (en) * | 2003-07-25 | 2005-10-04 | Robert Bosch Gmbh | Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
| US7056757B2 (en) * | 2003-11-25 | 2006-06-06 | Georgia Tech Research Corporation | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
| US7068125B2 (en) | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
| US7102467B2 (en) * | 2004-04-28 | 2006-09-05 | Robert Bosch Gmbh | Method for adjusting the frequency of a MEMS resonator |
| JP2005342808A (ja) * | 2004-05-31 | 2005-12-15 | Oki Electric Ind Co Ltd | Memsデバイスの製造方法 |
| US20070001267A1 (en) * | 2004-11-22 | 2007-01-04 | Farrokh Ayazi | Methods of forming oxide masks with submicron openings and microstructures formed thereby |
| FI121539B (fi) * | 2005-06-03 | 2010-12-31 | Valtion Teknillinen | Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö |
| US7210352B2 (en) * | 2005-06-14 | 2007-05-01 | Innovative Micro Technology | MEMS teeter-totter apparatus with curved beam and method of manufacture |
| US7509870B2 (en) * | 2005-10-26 | 2009-03-31 | Orthodata Technologies Llc | MEMS capacitive bending and axial strain sensor |
| US20070170528A1 (en) * | 2006-01-20 | 2007-07-26 | Aaron Partridge | Wafer encapsulated microelectromechanical structure and method of manufacturing same |
| US7482192B2 (en) * | 2006-05-16 | 2009-01-27 | Honeywell International Inc. | Method of making dimple structure for prevention of MEMS device stiction |
| US7982558B2 (en) * | 2006-06-29 | 2011-07-19 | Nxp B.V. | Integrated single-crystal MEMS device |
| US8216870B2 (en) * | 2006-12-27 | 2012-07-10 | Dai Nippon Printing Co., Ltd. | Mechanical quantity sensor and method of manufacturing the same |
| JP4952346B2 (ja) * | 2007-04-06 | 2012-06-13 | 株式会社デンソー | 半導体力学量センサ |
| JP5105968B2 (ja) | 2007-06-22 | 2012-12-26 | 株式会社日立製作所 | 角速度検出装置 |
| JP5790297B2 (ja) * | 2011-08-17 | 2015-10-07 | セイコーエプソン株式会社 | 物理量センサー及び電子機器 |
| US8648432B2 (en) * | 2011-11-28 | 2014-02-11 | Texas Instruments Deutschland Gmbh | Fully embedded micromechanical device, system on chip and method for manufacturing the same |
| JP5481545B2 (ja) * | 2012-10-02 | 2014-04-23 | 株式会社日立製作所 | 角速度検出装置 |
| US10023459B2 (en) * | 2013-03-11 | 2018-07-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS and method for forming the same |
| JP6464738B2 (ja) * | 2014-12-26 | 2019-02-06 | 株式会社デンソー | 加速度センサ |
| DE102017200725A1 (de) | 2017-01-18 | 2018-07-19 | Robert Bosch Gmbh | Mikromechanischer Sensor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4022495A1 (de) * | 1990-07-14 | 1992-01-23 | Bosch Gmbh Robert | Mikromechanischer drehratensensor |
| DE69012555T2 (de) * | 1990-07-25 | 1995-04-06 | International Business Machines Corp., Armonk, N.Y. | Methode zur Herstellung von mikromechanischen Sensoren für AFM/STM/MFM-Profilometrie und mikromechanischer AFM/STM/MFM-Sensorkopf. |
| JP2940293B2 (ja) * | 1992-03-31 | 1999-08-25 | 日産自動車株式会社 | 半導体加速度センサの製造方法 |
| US5349855A (en) * | 1992-04-07 | 1994-09-27 | The Charles Stark Draper Laboratory, Inc. | Comb drive micromechanical tuning fork gyro |
| FR2700003B1 (fr) * | 1992-12-28 | 1995-02-10 | Commissariat Energie Atomique | Procédé de fabrication d'un capteur de pression utilisant la technologie silicium sur isolant et capteur obtenu. |
| FR2700012B1 (fr) * | 1992-12-28 | 1995-03-03 | Commissariat Energie Atomique | Accéléromètre intégré à axe sensible parallèle au substrat. |
| FR2700065B1 (fr) * | 1992-12-28 | 1995-02-10 | Commissariat Energie Atomique | Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant. |
| EP0618450A1 (fr) * | 1993-03-30 | 1994-10-05 | Siemens Aktiengesellschaft | Capteur d'accélération |
| US5563343A (en) * | 1993-05-26 | 1996-10-08 | Cornell Research Foundation, Inc. | Microelectromechanical lateral accelerometer |
| DE4318466B4 (de) * | 1993-06-03 | 2004-12-09 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Sensors |
| DE4419844B4 (de) * | 1994-06-07 | 2009-11-19 | Robert Bosch Gmbh | Beschleunigungssensor |
| DE4431478B4 (de) * | 1994-09-03 | 2006-04-13 | Robert Bosch Gmbh | Aufhängung für mikromechanische Struktur und mikromechanischer Beschleunigungssensor |
| DE4432837B4 (de) * | 1994-09-15 | 2004-05-13 | Robert Bosch Gmbh | Beschleunigungssensor und Meßverfahren |
| DE19503236B4 (de) * | 1995-02-02 | 2006-05-24 | Robert Bosch Gmbh | Sensor aus einem mehrschichtigen Substrat |
| US5635638A (en) * | 1995-06-06 | 1997-06-03 | Analog Devices, Inc. | Coupling for multiple masses in a micromachined device |
| KR100327481B1 (ko) * | 1995-12-27 | 2002-06-24 | 윤종용 | 마이크로 자이로스코프 |
-
1996
- 1996-02-07 FR FR9601504A patent/FR2732467B1/fr not_active Expired - Lifetime
- 1996-02-08 JP JP8022429A patent/JPH08248058A/ja active Pending
- 1996-02-12 US US08/599,838 patent/US5723353A/en not_active Expired - Lifetime
-
1997
- 1997-09-18 US US08/933,446 patent/US5959208A/en not_active Expired - Lifetime
-
1999
- 1999-07-28 US US09/362,936 patent/US6055858A/en not_active Expired - Lifetime
-
2006
- 2006-11-30 JP JP2006324560A patent/JP4448845B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6055858A (en) | 2000-05-02 |
| US5959208A (en) | 1999-09-28 |
| JPH08248058A (ja) | 1996-09-27 |
| US5723353A (en) | 1998-03-03 |
| JP4448845B2 (ja) | 2010-04-14 |
| JP2007127658A (ja) | 2007-05-24 |
| FR2732467A1 (fr) | 1996-10-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 20 |