FR2704949B1 - Procédé pour la fabrication de capteurs et capteur fabriqué selon ce procédé. - Google Patents
Procédé pour la fabrication de capteurs et capteur fabriqué selon ce procédé.Info
- Publication number
- FR2704949B1 FR2704949B1 FR9405245A FR9405245A FR2704949B1 FR 2704949 B1 FR2704949 B1 FR 2704949B1 FR 9405245 A FR9405245 A FR 9405245A FR 9405245 A FR9405245 A FR 9405245A FR 2704949 B1 FR2704949 B1 FR 2704949B1
- Authority
- FR
- France
- Prior art keywords
- sensor made
- manufacturing sensors
- sensors
- manufacturing
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4315012A DE4315012B4 (de) | 1993-05-06 | 1993-05-06 | Verfahren zur Herstellung von Sensoren und Sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2704949A1 FR2704949A1 (fr) | 1994-11-10 |
FR2704949B1 true FR2704949B1 (fr) | 1998-02-06 |
Family
ID=6487341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9405245A Expired - Lifetime FR2704949B1 (fr) | 1993-05-06 | 1994-04-29 | Procédé pour la fabrication de capteurs et capteur fabriqué selon ce procédé. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5616523A (fr) |
JP (1) | JPH06349806A (fr) |
DE (1) | DE4315012B4 (fr) |
FR (1) | FR2704949B1 (fr) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5461916A (en) * | 1992-08-21 | 1995-10-31 | Nippondenso Co., Ltd. | Mechanical force sensing semiconductor device |
DE4445177C5 (de) * | 1994-11-22 | 2015-09-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung mikromechanischer Bauelemente mit freistehenden Mikrostrukturen |
WO1996023230A1 (fr) * | 1995-01-24 | 1996-08-01 | Siemens Aktiengesellschaft | Composant micromecanique |
DE19506400C1 (de) * | 1995-02-23 | 1996-03-14 | Siemens Ag | Verfahren zum Freiätzen (Separieren) mikromechanischer Funktionselemente |
DE19509868A1 (de) * | 1995-03-17 | 1996-09-19 | Siemens Ag | Mikromechanisches Halbleiterbauelement |
DE19547584A1 (de) * | 1995-12-20 | 1997-07-03 | Cms Mikrosysteme Gmbh Chemnitz | Mikromechanisches Array und Verfahren zu dessen Herstellung |
FR2736934B1 (fr) * | 1995-07-21 | 1997-08-22 | Commissariat Energie Atomique | Procede de fabrication d'une structure avec une couche utile maintenue a distance d'un substrat par des butees, et de desolidarisation d'une telle couche |
DE19539049A1 (de) * | 1995-10-20 | 1997-04-24 | Bosch Gmbh Robert | Verfahren zur Herstellung eines Coriolis-Drehratensensors |
TW317651B (en) * | 1996-12-19 | 1997-10-11 | Mos Electronics Taiwan Inc | Method of preventing wafer edge region from generating peeling phenomena |
DE19701843C1 (de) * | 1997-01-21 | 1998-04-30 | Bosch Gmbh Robert | Verfahren zur Herstellung von mikromechanischen Strukturen |
US6199430B1 (en) | 1997-06-17 | 2001-03-13 | Denso Corporation | Acceleration sensor with ring-shaped movable electrode |
US6074890A (en) * | 1998-01-08 | 2000-06-13 | Rockwell Science Center, Llc | Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices |
DE19903380B4 (de) | 1998-02-02 | 2007-10-18 | Denso Corp., Kariya | Halbleitersensoren für eine physikalische Grösse und ihre Herstellungsverfahren |
JP4003326B2 (ja) | 1998-02-12 | 2007-11-07 | 株式会社デンソー | 半導体力学量センサおよびその製造方法 |
JP3846094B2 (ja) | 1998-03-17 | 2006-11-15 | 株式会社デンソー | 半導体装置の製造方法 |
US6287885B1 (en) | 1998-05-08 | 2001-09-11 | Denso Corporation | Method for manufacturing semiconductor dynamic quantity sensor |
US6291875B1 (en) | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
GB9819821D0 (en) | 1998-09-12 | 1998-11-04 | Secr Defence | Improvements relating to micro-machining |
JP2000133814A (ja) * | 1998-10-22 | 2000-05-12 | Toyota Motor Corp | 半導体装置 |
JP2000206142A (ja) | 1998-11-13 | 2000-07-28 | Denso Corp | 半導体力学量センサおよびその製造方法 |
JP4238437B2 (ja) | 1999-01-25 | 2009-03-18 | 株式会社デンソー | 半導体力学量センサとその製造方法 |
US6433401B1 (en) | 1999-04-06 | 2002-08-13 | Analog Devices Imi, Inc. | Microfabricated structures with trench-isolation using bonded-substrates and cavities |
US6703679B1 (en) | 1999-08-31 | 2004-03-09 | Analog Devices, Imi, Inc. | Low-resistivity microelectromechanical structures with co-fabricated integrated circuit |
US6868726B2 (en) * | 2000-01-20 | 2005-03-22 | Analog Devices Imi, Inc. | Position sensing with improved linearity |
US6440766B1 (en) | 2000-02-16 | 2002-08-27 | Analog Devices Imi, Inc. | Microfabrication using germanium-based release masks |
DE10034315C2 (de) * | 2000-07-14 | 2002-11-28 | Infineon Technologies Ag | Analog-Digital-Wandler |
US7122395B2 (en) * | 2002-12-23 | 2006-10-17 | Motorola, Inc. | Method of forming semiconductor devices through epitaxy |
US6916728B2 (en) * | 2002-12-23 | 2005-07-12 | Freescale Semiconductor, Inc. | Method for forming a semiconductor structure through epitaxial growth |
US6770506B2 (en) * | 2002-12-23 | 2004-08-03 | Motorola, Inc. | Release etch method for micromachined sensors |
JP4386002B2 (ja) * | 2004-07-06 | 2009-12-16 | 株式会社デンソー | 半導体力学量センサの製造方法 |
JP4591000B2 (ja) * | 2004-09-16 | 2010-12-01 | 株式会社デンソー | 半導体力学量センサおよびその製造方法 |
JP2006167849A (ja) * | 2004-12-15 | 2006-06-29 | Denso Corp | マイクロ構造体の製造方法 |
US7069784B1 (en) * | 2004-12-29 | 2006-07-04 | Honeywell International Inc. | Pendulous in-plane MEMS accelerometer device |
US7412892B1 (en) | 2007-06-06 | 2008-08-19 | Measurement Specialties, Inc. | Method of making pressure transducer and apparatus |
DE102008003242B4 (de) | 2008-01-04 | 2017-03-30 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements |
JP2009216693A (ja) * | 2008-02-13 | 2009-09-24 | Denso Corp | 物理量センサ |
JP4557034B2 (ja) * | 2008-04-01 | 2010-10-06 | 株式会社デンソー | 半導体力学量センサおよびその製造方法 |
JP4640459B2 (ja) * | 2008-07-04 | 2011-03-02 | ソニー株式会社 | 角速度センサ |
JP2010060398A (ja) * | 2008-09-03 | 2010-03-18 | Alps Electric Co Ltd | ジャイロセンサ及びその製造方法 |
JP2010127763A (ja) * | 2008-11-27 | 2010-06-10 | Hitachi Ltd | 半導体力学量検出センサ及びそれを用いた制御装置 |
US8648432B2 (en) * | 2011-11-28 | 2014-02-11 | Texas Instruments Deutschland Gmbh | Fully embedded micromechanical device, system on chip and method for manufacturing the same |
DE102014204727A1 (de) * | 2014-03-14 | 2015-09-17 | Robert Bosch Gmbh | Inertialsensor und Herstellungsverfahren zum Herstellen eines Inertialsensors |
US11463268B2 (en) * | 2019-09-17 | 2022-10-04 | International Business Machines Corporation | Sensor calibration |
CN111620299B (zh) * | 2020-05-29 | 2023-03-28 | 华中科技大学 | 一种兼容高温处理的双面柔性电子器件及其集成制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3922705A (en) * | 1973-06-04 | 1975-11-25 | Gen Electric | Dielectrically isolated integral silicon diaphram or other semiconductor product |
JPS6042839A (ja) * | 1983-08-19 | 1985-03-07 | Toshiba Corp | 半導体ウエハの処理方法 |
US4665610A (en) * | 1985-04-22 | 1987-05-19 | Stanford University | Method of making a semiconductor transducer having multiple level diaphragm structure |
NL8800847A (nl) * | 1988-04-05 | 1989-11-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een soi-struktuur. |
US5059556A (en) * | 1988-09-28 | 1991-10-22 | Siemens-Bendix Automotive Electronics, L.P. | Low stress polysilicon microstructures |
US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
US5006487A (en) * | 1989-07-27 | 1991-04-09 | Honeywell Inc. | Method of making an electrostatic silicon accelerometer |
DE4000903C1 (fr) * | 1990-01-15 | 1990-08-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
DE4012071A1 (de) * | 1990-04-14 | 1991-10-17 | Bosch Gmbh Robert | Verfahren zur herstellung mikromechanischer strukturen |
DE4017265A1 (de) * | 1990-05-29 | 1991-12-05 | Fraunhofer Ges Forschung | Mikromechanisches bauelement und verfahren zur herstellung desselben |
US5172205A (en) * | 1990-09-26 | 1992-12-15 | Nissan Motor Co., Ltd. | Piezoresistive semiconductor device suitable for use in a pressure sensor |
US5295395A (en) * | 1991-02-07 | 1994-03-22 | Hocker G Benjamin | Diaphragm-based-sensors |
WO1992022820A2 (fr) * | 1991-06-12 | 1992-12-23 | Harris Corporation | Accelerometre a semi-conducteurs et procede de fabrication |
DE4122435A1 (de) * | 1991-07-06 | 1993-01-07 | Bosch Gmbh Robert | Verfahren zur herstellung von beschleunigungssensoren und beschleunigungssensor |
US5332469A (en) * | 1992-11-12 | 1994-07-26 | Ford Motor Company | Capacitive surface micromachined differential pressure sensor |
US5369544A (en) * | 1993-04-05 | 1994-11-29 | Ford Motor Company | Silicon-on-insulator capacitive surface micromachined absolute pressure sensor |
-
1993
- 1993-05-06 DE DE4315012A patent/DE4315012B4/de not_active Expired - Lifetime
-
1994
- 1994-04-29 FR FR9405245A patent/FR2704949B1/fr not_active Expired - Lifetime
- 1994-05-06 JP JP6094545A patent/JPH06349806A/ja active Pending
-
1996
- 1996-04-02 US US08/627,819 patent/US5616523A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE4315012B4 (de) | 2007-01-11 |
DE4315012A1 (de) | 1994-11-10 |
JPH06349806A (ja) | 1994-12-22 |
FR2704949A1 (fr) | 1994-11-10 |
US5616523A (en) | 1997-04-01 |
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