FR2703510B1 - - Google Patents

Info

Publication number
FR2703510B1
FR2703510B1 FR9400939A FR9400939A FR2703510B1 FR 2703510 B1 FR2703510 B1 FR 2703510B1 FR 9400939 A FR9400939 A FR 9400939A FR 9400939 A FR9400939 A FR 9400939A FR 2703510 B1 FR2703510 B1 FR 2703510B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9400939A
Other versions
FR2703510A1 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26415213&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2703510(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of FR2703510A1 publication Critical patent/FR2703510A1/fr
Application granted granted Critical
Publication of FR2703510B1 publication Critical patent/FR2703510B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
FR9400939A 1993-03-31 1994-01-28 Appareil et procédé de traitement de la surface d'une couche semiconductrice par plasma. Granted FR2703510A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7407693 1993-03-31
JP5152381A JP2804700B2 (ja) 1993-03-31 1993-06-23 半導体装置の製造装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
FR2703510A1 FR2703510A1 (fr) 1994-10-07
FR2703510B1 true FR2703510B1 (fr) 1997-02-21

Family

ID=26415213

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9400939A Granted FR2703510A1 (fr) 1993-03-31 1994-01-28 Appareil et procédé de traitement de la surface d'une couche semiconductrice par plasma.

Country Status (5)

Country Link
US (2) US5919336A (fr)
JP (1) JP2804700B2 (fr)
KR (1) KR0126892B1 (fr)
FR (1) FR2703510A1 (fr)
GB (1) GB2276764B (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328416B2 (ja) * 1994-03-18 2002-09-24 富士通株式会社 半導体装置の製造方法と製造装置
US5679215A (en) * 1996-01-02 1997-10-21 Lam Research Corporation Method of in situ cleaning a vacuum plasma processing chamber
JPH10321610A (ja) * 1997-03-19 1998-12-04 Fujitsu Ltd 半導体装置の製造方法
US6017414A (en) 1997-03-31 2000-01-25 Lam Research Corporation Method of and apparatus for detecting and controlling in situ cleaning time of vacuum processing chambers
JPH10326771A (ja) * 1997-05-23 1998-12-08 Fujitsu Ltd 水素プラズマダウンストリーム処理装置及び水素プラズマダウンストリーム処理方法
JP3627451B2 (ja) * 1997-06-04 2005-03-09 東京エレクトロン株式会社 表面処理方法及びその装置
US6706334B1 (en) 1997-06-04 2004-03-16 Tokyo Electron Limited Processing method and apparatus for removing oxide film
US6291868B1 (en) 1998-02-26 2001-09-18 Micron Technology, Inc. Forming a conductive structure in a semiconductor device
TW448499B (en) * 1998-11-11 2001-08-01 Tokyo Electron Ltd Surface treatment method and surface treatment apparatus
JP4612063B2 (ja) * 1998-11-11 2011-01-12 東京エレクトロン株式会社 表面処理方法及びその装置
KR100542690B1 (ko) * 1998-12-30 2006-03-28 주식회사 하이닉스반도체 반도체 소자의 실리콘 산화막 형성 방법
KR100322545B1 (ko) * 1999-02-10 2002-03-18 윤종용 건식 세정 공정을 전 공정으로 이용하는 반도체 장치의콘택홀 채움 방법
JP4057198B2 (ja) * 1999-08-13 2008-03-05 東京エレクトロン株式会社 処理装置及び処理方法
KR100572880B1 (ko) * 2000-07-14 2006-04-24 엘지전자 주식회사 플라즈마를 이용한 기판의 홀가공방법
US6991739B2 (en) * 2001-10-15 2006-01-31 Applied Materials, Inc. Method of photoresist removal in the presence of a dielectric layer having a low k-value
US6680164B2 (en) 2001-11-30 2004-01-20 Applied Materials Inc. Solvent free photoresist strip and residue removal processing for post etching of low-k films
JP2004128281A (ja) 2002-10-03 2004-04-22 Tokyo Electron Ltd 基板処理方法および基板処理装置
US7556048B2 (en) * 2002-11-15 2009-07-07 Agere Systems Inc. In-situ removal of surface impurities prior to arsenic-doped polysilicon deposition in the fabrication of a heterojunction bipolar transistor
US20050158667A1 (en) * 2004-01-20 2005-07-21 Applied Materials, Inc. Solvent free photoresist strip and residue removal processing for post etching of low-k films
US20060017043A1 (en) * 2004-07-23 2006-01-26 Dingjun Wu Method for enhancing fluorine utilization
WO2006035893A1 (fr) * 2004-09-30 2006-04-06 Hamamatsu Photonics K.K. Procédé de traitement de substrat de silicium
JP2007201067A (ja) * 2006-01-25 2007-08-09 Sekisui Chem Co Ltd 表面処理方法及び装置
US7789965B2 (en) * 2006-09-19 2010-09-07 Asm Japan K.K. Method of cleaning UV irradiation chamber
US20080289650A1 (en) * 2007-05-24 2008-11-27 Asm America, Inc. Low-temperature cleaning of native oxide
WO2009057223A1 (fr) * 2007-11-02 2009-05-07 Canon Anelva Corporation Appareil de traitement de surface et procédé de traitement de substrat
US7871937B2 (en) 2008-05-16 2011-01-18 Asm America, Inc. Process and apparatus for treating wafers
JP6230954B2 (ja) * 2014-05-09 2017-11-15 東京エレクトロン株式会社 エッチング方法
WO2017210141A1 (fr) * 2016-05-29 2017-12-07 Tokyo Electron Limited Procédé de transfert d'images de parois latérales
US20230100863A1 (en) * 2021-09-27 2023-03-30 Applied Materials, Inc. Water vapor plasma to enhance surface hydrophilicity

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5751265A (en) * 1980-09-10 1982-03-26 Hitachi Ltd Microwave plasma etching device
US4737379A (en) * 1982-09-24 1988-04-12 Energy Conversion Devices, Inc. Plasma deposited coatings, and low temperature plasma method of making same
KR920004171B1 (ko) * 1984-07-11 1992-05-30 가부시기가이샤 히다찌세이사꾸쇼 드라이에칭장치
JPS61222534A (ja) * 1985-03-28 1986-10-03 Anelva Corp 表面処理方法および装置
JPS62272541A (ja) * 1986-05-20 1987-11-26 Fujitsu Ltd 半導体基板の表面処理方法
US4863561A (en) * 1986-12-09 1989-09-05 Texas Instruments Incorporated Method and apparatus for cleaning integrated circuit wafers
JPS6414218A (en) * 1987-07-06 1989-01-18 Harima Chemicals Inc Production of highly water-absorptive resin
US5298112A (en) * 1987-08-28 1994-03-29 Kabushiki Kaisha Toshiba Method for removing composite attached to material by dry etching
JP3001891B2 (ja) * 1987-10-01 2000-01-24 グンゼ株式会社 透明導電膜のエッチング方法及びその装置
US5007983A (en) * 1988-01-29 1991-04-16 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Etching method for photoresists or polymers
JPH01219184A (ja) * 1988-02-26 1989-09-01 Nippon Mining Co Ltd 酸化第二銅粉末の製造方法
US5225036A (en) * 1988-03-28 1993-07-06 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
JPH0277124A (ja) * 1988-06-29 1990-03-16 Tokyo Electron Ltd ドライエッチング方法
DE68926855T2 (de) * 1988-11-18 1997-02-13 Shibaura Eng Works Ltd Trockenätzverfahren
EP0376252B1 (fr) * 1988-12-27 1997-10-22 Kabushiki Kaisha Toshiba Méthode d'enlèvement d'une couche d'oxyde sur un substrat
JP2890432B2 (ja) * 1989-01-10 1999-05-17 富士通株式会社 有機物の灰化方法
JPH03129732A (ja) * 1989-07-19 1991-06-03 Matsushita Electric Ind Co Ltd 半導体の処理方法
US4992134A (en) * 1989-11-14 1991-02-12 Advanced Micro Devices, Inc. Dopant-independent polysilicon plasma etch
US5002632A (en) * 1989-11-22 1991-03-26 Texas Instruments Incorporated Method and apparatus for etching semiconductor materials
JP2673380B2 (ja) * 1990-02-20 1997-11-05 三菱電機株式会社 プラズマエッチングの方法
US5089441A (en) * 1990-04-16 1992-02-18 Texas Instruments Incorporated Low-temperature in-situ dry cleaning process for semiconductor wafers
JP2920850B2 (ja) * 1991-03-25 1999-07-19 東京エレクトロン株式会社 半導体の表面処理方法及びその装置
JP3371143B2 (ja) * 1991-06-03 2003-01-27 ソニー株式会社 ドライエッチング方法
US5326406A (en) * 1991-07-31 1994-07-05 Kawasaki Steel Corporation Method of cleaning semiconductor substrate and apparatus for carrying out the same
JP3084497B2 (ja) * 1992-03-25 2000-09-04 東京エレクトロン株式会社 ＳｉＯ２膜のエッチング方法

Also Published As

Publication number Publication date
JP2804700B2 (ja) 1998-09-30
KR0126892B1 (ko) 1998-04-02
GB9401772D0 (en) 1994-03-23
US5919336A (en) 1999-07-06
JPH06338478A (ja) 1994-12-06
FR2703510A1 (fr) 1994-10-07
US6024045A (en) 2000-02-15
GB2276764B (en) 1996-11-20
KR940022731A (ko) 1994-10-21
GB2276764A (en) 1994-10-05

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Legal Events

Date Code Title Description
ER Errata listed in the french official journal (bopi)

Free format text: 40/94

ST Notification of lapse

Effective date: 20091030