FR2699330B1 - Boitier pour circuit integre a haute frequence. - Google Patents

Boitier pour circuit integre a haute frequence.

Info

Publication number
FR2699330B1
FR2699330B1 FR9309368A FR9309368A FR2699330B1 FR 2699330 B1 FR2699330 B1 FR 2699330B1 FR 9309368 A FR9309368 A FR 9309368A FR 9309368 A FR9309368 A FR 9309368A FR 2699330 B1 FR2699330 B1 FR 2699330B1
Authority
FR
France
Prior art keywords
integrated circuit
high frequency
frequency integrated
circuit box
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9309368A
Other languages
English (en)
Other versions
FR2699330A1 (fr
Inventor
Katoh Takayuki
Notani Yoshihiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2699330A1 publication Critical patent/FR2699330A1/fr
Application granted granted Critical
Publication of FR2699330B1 publication Critical patent/FR2699330B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
  • Waveguide Connection Structure (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
FR9309368A 1992-12-11 1993-07-29 Boitier pour circuit integre a haute frequence. Expired - Fee Related FR2699330B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4353082A JP2823461B2 (ja) 1992-12-11 1992-12-11 高周波帯ｉｃ用パッケージ

Publications (2)

Publication Number Publication Date
FR2699330A1 FR2699330A1 (fr) 1994-06-17
FR2699330B1 true FR2699330B1 (fr) 1995-09-29

Family

ID=18428442

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9309368A Expired - Fee Related FR2699330B1 (fr) 1992-12-11 1993-07-29 Boitier pour circuit integre a haute frequence.

Country Status (4)

Country Link
US (1) US5418329A (fr)
JP (1) JP2823461B2 (fr)
DE (1) DE4324817C2 (fr)
FR (1) FR2699330B1 (fr)

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US5536906A (en) * 1993-07-23 1996-07-16 Texas Instruments Incorporated Package for integrated circuits
JPH0870061A (ja) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp 高周波集積回路、及びその製造方法
US5444187A (en) * 1994-10-26 1995-08-22 Baier & Baier, Inc. Method of surface mounting radio frequency components and the components
CA2189233A1 (fr) * 1995-03-02 1996-09-06 Norman L. Greenman Boitier peu onereux, a haute performance, pour circuits hyperfrequence dans la gamme de frequences allant jusqu'a 90 ghz faisant intervenir un format de circuit d'acces de radiofrequences a matrice de grille a boules ou a bosses et une technologie de substrat ceramique
GB2298957A (en) * 1995-03-16 1996-09-18 Oxley Dev Co Ltd Microstrip microwave package
IT1274573B (it) * 1995-05-25 1997-07-17 Sits Soc It Telecom Siemens Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
JP3638173B2 (ja) * 1996-03-27 2005-04-13 本田技研工業株式会社 マイクロ波回路用パッケージ
US5898128A (en) * 1996-09-11 1999-04-27 Motorola, Inc. Electronic component
DE19709042A1 (de) * 1997-03-06 1998-09-10 Alsthom Cge Alcatel Gehäuse für mikrooptische und/oder mikroelektrische Bauelemente
JPH11135898A (ja) * 1997-10-31 1999-05-21 Asahi Optical Co Ltd プリント配線基板
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DE4324817C2 (de) 1998-10-29
JP2823461B2 (ja) 1998-11-11
US5418329A (en) 1995-05-23
FR2699330A1 (fr) 1994-06-17
DE4324817A1 (de) 1994-06-16
JPH06181266A (ja) 1994-06-28

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