IT1274573B - Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip - Google Patents

Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip

Info

Publication number
IT1274573B
IT1274573B ITMI951076A ITMI951076A IT1274573B IT 1274573 B IT1274573 B IT 1274573B IT MI951076 A ITMI951076 A IT MI951076A IT MI951076 A ITMI951076 A IT MI951076A IT 1274573 B IT1274573 B IT 1274573B
Authority
IT
Italy
Prior art keywords
chip
manufacturing process
electronic devices
process including
circuit modules
Prior art date
Application number
ITMI951076A
Other languages
English (en)
Inventor
Paolo Bonato
Giorgio Carcano
Giovanni Lambrughi
Original Assignee
Sits Soc It Telecom Siemens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sits Soc It Telecom Siemens filed Critical Sits Soc It Telecom Siemens
Priority to ITMI951076A priority Critical patent/IT1274573B/it
Publication of ITMI951076A0 publication Critical patent/ITMI951076A0/it
Priority to AU59010/96A priority patent/AU5901096A/en
Priority to PCT/EP1996/002199 priority patent/WO1996037914A1/en
Priority to ZA964181A priority patent/ZA964181B/xx
Publication of ITMI951076A1 publication Critical patent/ITMI951076A1/it
Application granted granted Critical
Publication of IT1274573B publication Critical patent/IT1274573B/it

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
ITMI951076A 1995-05-25 1995-05-25 Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip IT1274573B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITMI951076A IT1274573B (it) 1995-05-25 1995-05-25 Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip
AU59010/96A AU5901096A (en) 1995-05-25 1996-05-22 Manufacturing process for hybrid circuit modules including e lectronic chip devices
PCT/EP1996/002199 WO1996037914A1 (en) 1995-05-25 1996-05-22 Manufacturing process for hybrid circuit modules including electronic chip devices
ZA964181A ZA964181B (en) 1995-05-25 1996-05-24 Manufacturing process for hybrid circuit modules including electronic chip devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI951076A IT1274573B (it) 1995-05-25 1995-05-25 Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip

Publications (3)

Publication Number Publication Date
ITMI951076A0 ITMI951076A0 (it) 1995-05-25
ITMI951076A1 ITMI951076A1 (it) 1996-11-25
IT1274573B true IT1274573B (it) 1997-07-17

Family

ID=11371675

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI951076A IT1274573B (it) 1995-05-25 1995-05-25 Processo di fabbricazione di moduli circuitali ibridi includenti dispositivi elettronici in chip

Country Status (4)

Country Link
AU (1) AU5901096A (it)
IT (1) IT1274573B (it)
WO (1) WO1996037914A1 (it)
ZA (1) ZA964181B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1211723C (zh) * 2000-04-04 2005-07-20 胜开科技股份有限公司 计算机卡制作方法
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
NZ583290A (en) 2004-09-24 2011-05-27 Alnylam Pharmaceuticals Inc Rnai modulation of apob and uses thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
JPS62188345A (ja) * 1986-02-14 1987-08-17 Sanyo Electric Co Ltd 混成集積回路の製造方法
US5014115A (en) * 1987-11-16 1991-05-07 Motorola, Inc. Coplanar waveguide semiconductor package
JPH0256987A (ja) * 1988-02-23 1990-02-26 Mitsubishi Electric Corp 混成集積回路の実装方法
JP2823461B2 (ja) * 1992-12-11 1998-11-11 三菱電機株式会社 高周波帯ｉｃ用パッケージ

Also Published As

Publication number Publication date
AU5901096A (en) 1996-12-11
ITMI951076A1 (it) 1996-11-25
ZA964181B (en) 1996-12-03
WO1996037914A1 (en) 1996-11-28
ITMI951076A0 (it) 1995-05-25

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