FR2668301B1 - Procede et installation de transfert sans contamination. - Google Patents
Procede et installation de transfert sans contamination.Info
- Publication number
- FR2668301B1 FR2668301B1 FR9106177A FR9106177A FR2668301B1 FR 2668301 B1 FR2668301 B1 FR 2668301B1 FR 9106177 A FR9106177 A FR 9106177A FR 9106177 A FR9106177 A FR 9106177A FR 2668301 B1 FR2668301 B1 FR 2668301B1
- Authority
- FR
- France
- Prior art keywords
- contamination
- installation
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Rigid Containers With Two Or More Constituent Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2281997A JP2525284B2 (ja) | 1990-10-22 | 1990-10-22 | クリ―ン搬送方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2668301A1 FR2668301A1 (fr) | 1992-04-24 |
FR2668301B1 true FR2668301B1 (fr) | 1995-02-17 |
Family
ID=17646791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9106177A Expired - Fee Related FR2668301B1 (fr) | 1990-10-22 | 1991-05-22 | Procede et installation de transfert sans contamination. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5139459A (fr) |
JP (1) | JP2525284B2 (fr) |
KR (1) | KR0136266B1 (fr) |
DE (1) | DE4116554C2 (fr) |
FR (1) | FR2668301B1 (fr) |
GB (1) | GB2249145B (fr) |
HK (1) | HK35395A (fr) |
SG (1) | SG19095G (fr) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960007979B1 (ko) * | 1991-04-17 | 1996-06-17 | 마쯔시다덴기산교 가부시기가이샤 | 클리인공간시스템 |
JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
FR2682047B1 (fr) * | 1991-10-07 | 1993-11-12 | Commissariat A Energie Atomique | Reacteur de traitement chimique en phase gazeuse. |
US5223001A (en) * | 1991-11-21 | 1993-06-29 | Tokyo Electron Kabushiki Kaisha | Vacuum processing apparatus |
GB2262786B (en) * | 1991-12-05 | 1995-05-24 | Total Process Containment Ltd | Transfer Arrangement |
DE4207527A1 (de) * | 1992-03-10 | 1993-09-16 | Leybold Ag | Hochvakuum-beschichtungsanlage |
KR100303075B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
WO1994014191A1 (fr) * | 1992-12-14 | 1994-06-23 | Ebara Corporation | Dispositif de transfert de galette |
US6136168A (en) * | 1993-01-21 | 2000-10-24 | Tdk Corporation | Clean transfer method and apparatus therefor |
US5425400A (en) * | 1993-03-29 | 1995-06-20 | Lee A. Francis | Transfer port apparatus and method |
US5378107A (en) * | 1993-04-01 | 1995-01-03 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
US5409587A (en) * | 1993-09-16 | 1995-04-25 | Micron Technology, Inc. | Sputtering with collinator cleaning within the sputtering chamber |
TW273574B (fr) * | 1993-12-10 | 1996-04-01 | Tokyo Electron Co Ltd | |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
US5464475A (en) * | 1994-05-20 | 1995-11-07 | Advanced Micro Devices, Inc. | Work-in-process storage pod |
DE4425208C2 (de) * | 1994-07-16 | 1996-05-09 | Jenoptik Technologie Gmbh | Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen |
JPH0874028A (ja) * | 1994-09-01 | 1996-03-19 | Matsushita Electric Ind Co Ltd | 薄膜形成装置および薄膜形成方法 |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
AU699042B2 (en) * | 1995-03-09 | 1998-11-19 | Boc Group, Inc., The | Transfer port system |
DE59611078D1 (de) | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
US5641354A (en) * | 1995-07-10 | 1997-06-24 | Seh America, Inc. | Puller cell |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
SE9503102D0 (sv) * | 1995-09-08 | 1995-09-08 | Astra Ab | Aseptic transfer |
US5842917A (en) * | 1996-01-11 | 1998-12-01 | United Microelectronics Corproration | Automated manufacturing plant for semiconductor devices |
FR2747111B1 (fr) * | 1996-04-03 | 1998-04-30 | Commissariat Energie Atomique | Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet |
TW333658B (en) * | 1996-05-30 | 1998-06-11 | Tokyo Electron Co Ltd | The substrate processing method and substrate processing system |
US5892200A (en) * | 1996-09-19 | 1999-04-06 | The Boc Group, Inc. | Transfer port system |
DE19715151A1 (de) * | 1997-04-11 | 1998-10-15 | Leybold Systems Gmbh | Verfahren zum Be- und Entladen einer evakuierbaren Behandlungskammer und Handlingsvorrichtung zur Durchführung des Verfahrens |
EP0870850B1 (fr) * | 1997-04-11 | 2002-09-18 | Leybold Systems GmbH | Procédé et appareil de chargement et déchargement d'une enceinte de traitement |
US6157866A (en) | 1997-06-19 | 2000-12-05 | Advanced Micro Devices, Inc. | Automated material handling system for a manufacturing facility divided into separate fabrication areas |
US5924833A (en) * | 1997-06-19 | 1999-07-20 | Advanced Micro Devices, Inc. | Automated wafer transfer system |
US6045620A (en) * | 1997-07-11 | 2000-04-04 | Applied Materials, Inc. | Two-piece slit valve insert for vacuum processing system |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
JP2974069B2 (ja) * | 1997-09-25 | 1999-11-08 | イノテック株式会社 | 半導体デバイスの製造装置 |
JP3167970B2 (ja) | 1997-10-13 | 2001-05-21 | ティーディーケイ株式会社 | クリーンボックス、クリーン搬送方法及び装置 |
DE29718996U1 (de) * | 1997-10-24 | 1997-12-18 | Siemens AG, 80333 München | Fertigungseinrichtung mit einem Roboter |
JP3417821B2 (ja) | 1997-11-17 | 2003-06-16 | ティーディーケイ株式会社 | クリーンボックス、クリーン搬送方法及び装置 |
GB9808175D0 (en) * | 1998-04-17 | 1998-06-17 | Coles Timothy P | Rotary gas sanitiser |
US6561894B1 (en) | 1999-04-19 | 2003-05-13 | Tdk Corporation | Clean box, clean transfer method and apparatus therefor |
US6168364B1 (en) | 1999-04-19 | 2001-01-02 | Tdk Corporation | Vacuum clean box, clean transfer method and apparatus therefor |
US6641349B1 (en) | 1999-04-30 | 2003-11-04 | Tdk Corporation | Clean box, clean transfer method and system |
JP3226511B2 (ja) | 1999-06-23 | 2001-11-05 | ティーディーケイ株式会社 | 容器および容器の封止方法 |
JP3405937B2 (ja) | 1999-08-11 | 2003-05-12 | ティーディーケイ株式会社 | クリーンボックスの蓋ラッチ機構 |
KR100558471B1 (ko) * | 1999-12-07 | 2006-03-07 | 삼성전자주식회사 | 반도체 디바이스 반송 시스템 |
US6364593B1 (en) | 2000-06-06 | 2002-04-02 | Brooks Automation | Material transport system |
JP3581310B2 (ja) | 2000-08-31 | 2004-10-27 | Tdk株式会社 | 防塵機能を備えた半導体ウェーハ処理装置 |
JP2002203887A (ja) * | 2001-01-05 | 2002-07-19 | Tdk Corp | ミニエンバイロンメントシステムおよびその操作方法 |
DE10104555B4 (de) * | 2001-02-01 | 2007-11-08 | Krauss Maffei Gmbh | Lagervorrichtung zum Einsatz in Reinumgebungen |
JP2002319609A (ja) * | 2001-04-19 | 2002-10-31 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6592318B2 (en) * | 2001-07-13 | 2003-07-15 | Asm America, Inc. | Docking cart with integrated load port |
JP3697478B2 (ja) * | 2001-08-20 | 2005-09-21 | ソニー株式会社 | 基板の移送方法及びロードポート装置並びに基板移送システム |
US6655759B2 (en) * | 2002-02-19 | 2003-12-02 | Giuseppe Sacca | Container assembly for use with a rapid transfer port |
US7677859B2 (en) * | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
US6869263B2 (en) | 2002-07-22 | 2005-03-22 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
US7537425B2 (en) | 2002-12-30 | 2009-05-26 | Tdk Corporation | Wafer processing apparatus having dust proof function |
US7360985B2 (en) | 2002-12-30 | 2008-04-22 | Tdk Corporation | Wafer processing apparatus including clean box stopping mechanism |
DE10319379A1 (de) * | 2003-04-30 | 2004-11-25 | Applied Films Gmbh & Co. Kg | Vorrichtung zum Transportieren eines flachen Substrats in einer Vakuumkammer |
KR100729699B1 (ko) | 2003-05-15 | 2007-06-19 | 티디케이가부시기가이샤 | 클린 박스 개폐 장치를 구비하는 클린 장치 |
US7393373B1 (en) | 2004-06-14 | 2008-07-01 | H.K. Plastics Engineering, Inc. | Portable clean molding apparatus and method of use |
DE102004032659B4 (de) * | 2004-07-01 | 2008-10-30 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung |
DE102004035336A1 (de) * | 2004-07-21 | 2006-02-16 | Schott Ag | Reinraumfähige Beschichtungsanlage |
JP4563219B2 (ja) * | 2005-03-01 | 2010-10-13 | 東京エレクトロン株式会社 | 中継ステーション及び中継ステーションを用いた基板処理システム |
US10627809B2 (en) | 2005-06-18 | 2020-04-21 | Frederick A. Flitsch | Multilevel fabricators |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US9159592B2 (en) | 2005-06-18 | 2015-10-13 | Futrfab, Inc. | Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator |
US7513822B2 (en) | 2005-06-18 | 2009-04-07 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US11024527B2 (en) | 2005-06-18 | 2021-06-01 | Frederick A. Flitsch | Methods and apparatus for novel fabricators with Cleanspace |
US10651063B2 (en) | 2005-06-18 | 2020-05-12 | Frederick A. Flitsch | Methods of prototyping and manufacturing with cleanspace fabricators |
US9059227B2 (en) | 2005-06-18 | 2015-06-16 | Futrfab, Inc. | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US9339900B2 (en) * | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
WO2007025199A2 (fr) * | 2005-08-26 | 2007-03-01 | Flitsch Frederick A | Procede et appareil d'un systeme d'ascenseur pour dispositif de fabrication a espace a empoussierage controle |
DE102006026363A1 (de) * | 2006-04-13 | 2007-10-18 | Colandis Gmbh | Transport- und Dockingsystem für Reinraumanwendungen |
US8272825B2 (en) * | 2007-05-18 | 2012-09-25 | Brooks Automation, Inc. | Load lock fast pump vent |
US10541157B2 (en) | 2007-05-18 | 2020-01-21 | Brooks Automation, Inc. | Load lock fast pump vent |
US8550887B2 (en) * | 2009-09-18 | 2013-10-08 | Lacks Enterprises, Inc. | Vehicle grill with moveable louvers |
US9564350B1 (en) * | 2015-09-18 | 2017-02-07 | Globalfoundries Inc. | Method and apparatus for storing and transporting semiconductor wafers in a vacuum pod |
US10453726B2 (en) * | 2016-11-10 | 2019-10-22 | Applied Materials, Inc. | Electronic device manufacturing load port apparatus, systems, and methods |
JP6975373B2 (ja) * | 2017-12-27 | 2021-12-01 | 澁谷工業株式会社 | 無菌作業システム |
CN114464550A (zh) * | 2020-11-09 | 2022-05-10 | 东京毅力科创株式会社 | 基片处理系统 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5619635A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Manufacturing apparatus |
JPS6051537A (ja) * | 1983-08-31 | 1985-03-23 | Anelva Corp | 真空系内と大気圧部間の物質移動装置 |
JPS6052574A (ja) * | 1983-09-02 | 1985-03-25 | Hitachi Ltd | 連続スパツタ装置 |
EP0151336B1 (fr) * | 1983-09-28 | 1991-01-02 | Hewlett-Packard Company | Système de traitement de circuits intégrés |
FR2560710B1 (fr) * | 1984-03-02 | 1986-11-07 | Sgn Soc Gen Tech Nouvelle | Procede de transfert d'objet sans rupture de confinement |
JPS60184678A (ja) * | 1984-03-02 | 1985-09-20 | Canon Inc | 真空処理装置 |
US4674939A (en) * | 1984-07-30 | 1987-06-23 | Asyst Technologies | Sealed standard interface apparatus |
JPS6220875A (ja) * | 1985-07-19 | 1987-01-29 | Canon Inc | 堆積膜形成装置 |
EP0219826B1 (fr) * | 1985-10-24 | 1994-09-07 | Texas Instruments Incorporated | Système de traitement sous vide |
US4966519A (en) * | 1985-10-24 | 1990-10-30 | Texas Instruments Incorporated | Integrated circuit processing system |
DE3726025A1 (de) * | 1986-02-05 | 1989-02-16 | Fraunhofer Ges Forschung | Reinraum mit handhabungseinrichtung |
DE3711212A1 (de) * | 1986-04-03 | 1987-12-23 | Semax Gmbh Prozesstechnik | Anlage und verfahren zur herstellung von integrierten schaltkreisen o. dgl. aus si- oder aus gaas-scheiben o. dgl. |
US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
JPS6328047A (ja) * | 1986-07-22 | 1988-02-05 | Tdk Corp | クリ−ン搬送方法 |
DE3712064A1 (de) * | 1987-04-09 | 1988-10-27 | Prettl Laminar Flow & Prozesst | Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung |
US4831270A (en) * | 1987-05-21 | 1989-05-16 | Ion Implant Services | Ion implantation apparatus |
FR2621974B1 (fr) * | 1987-10-15 | 1990-01-12 | Commissariat Energie Atomique | Dispositif de raccordement deconnectable de deux enceintes etanches |
JPH0668962B2 (ja) * | 1987-12-21 | 1994-08-31 | 株式会社東芝 | 真空装置及びそれを用いてプロセスを行う方法 |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
US4995430A (en) * | 1989-05-19 | 1991-02-26 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
DE3931985A1 (de) * | 1989-09-26 | 1991-04-04 | Hls Halbleiter Produktionstech | Transportspeicher fuer waferscheiben |
-
1990
- 1990-10-22 JP JP2281997A patent/JP2525284B2/ja not_active Expired - Lifetime
-
1991
- 1991-02-28 US US07/662,556 patent/US5139459A/en not_active Expired - Lifetime
- 1991-05-21 GB GB9110967A patent/GB2249145B/en not_active Expired - Fee Related
- 1991-05-21 DE DE4116554A patent/DE4116554C2/de not_active Expired - Fee Related
- 1991-05-22 KR KR1019910008271A patent/KR0136266B1/ko not_active IP Right Cessation
- 1991-05-22 FR FR9106177A patent/FR2668301B1/fr not_active Expired - Fee Related
-
1995
- 1995-02-04 SG SG19095A patent/SG19095G/en unknown
- 1995-03-16 HK HK35395A patent/HK35395A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2249145B (en) | 1994-08-31 |
GB9110967D0 (en) | 1991-07-10 |
DE4116554C2 (de) | 2002-11-21 |
FR2668301A1 (fr) | 1992-04-24 |
US5139459A (en) | 1992-08-18 |
GB2249145A (en) | 1992-04-29 |
JPH04157749A (ja) | 1992-05-29 |
JP2525284B2 (ja) | 1996-08-14 |
HK35395A (en) | 1995-03-24 |
SG19095G (en) | 1995-06-16 |
KR0136266B1 (ko) | 1998-04-29 |
DE4116554A1 (de) | 1992-04-23 |
KR920008885A (ko) | 1992-05-28 |
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