FR2609821B1 - Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede - Google Patents

Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede

Info

Publication number
FR2609821B1
FR2609821B1 FR8700446A FR8700446A FR2609821B1 FR 2609821 B1 FR2609821 B1 FR 2609821B1 FR 8700446 A FR8700446 A FR 8700446A FR 8700446 A FR8700446 A FR 8700446A FR 2609821 B1 FR2609821 B1 FR 2609821B1
Authority
FR
France
Prior art keywords
cards
implementation
realizing memory
memory cards
mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8700446A
Other languages
English (en)
French (fr)
Other versions
FR2609821A1 (fr
Inventor
Marc Brignet
Emile Droche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flonic SA
Original Assignee
Flonic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9346968&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2609821(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Flonic SA filed Critical Flonic SA
Priority to FR8700446A priority Critical patent/FR2609821B1/fr
Priority to AU10160/88A priority patent/AU600785B2/en
Priority to IN17/MAS/88A priority patent/IN170183B/en
Priority to KR1019880000153A priority patent/KR880009317A/ko
Priority to JP63005678A priority patent/JPS63239097A/ja
Priority to ES198888400068T priority patent/ES2031248T3/es
Priority to EP88400068A priority patent/EP0277854B1/fr
Priority to DE8888400068T priority patent/DE3869635D1/de
Priority to FI880152A priority patent/FI93156C/fi
Priority to DK016988A priority patent/DK16988A/da
Priority to AT88400068T priority patent/ATE74456T1/de
Priority to NZ223192A priority patent/NZ223192A/xx
Priority to BR8800135A priority patent/BR8800135A/pt
Priority to PT86557A priority patent/PT86557A/pt
Priority to CA000556637A priority patent/CA1306058C/en
Priority to NO880166A priority patent/NO178089C/no
Priority to ZA880279A priority patent/ZA88279B/xx
Publication of FR2609821A1 publication Critical patent/FR2609821A1/fr
Publication of FR2609821B1 publication Critical patent/FR2609821B1/fr
Application granted granted Critical
Priority to GR920401244T priority patent/GR3004900T3/el
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Packaging For Recording Disks (AREA)
  • External Artificial Organs (AREA)
  • Collating Specific Patterns (AREA)
  • Non-Volatile Memory (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
FR8700446A 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede Expired FR2609821B1 (fr)

Priority Applications (18)

Application Number Priority Date Filing Date Title
FR8700446A FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
AU10160/88A AU600785B2 (en) 1987-01-16 1988-01-11 A method of making memory cards, and cards obtained by implementing said method
IN17/MAS/88A IN170183B (enExample) 1987-01-16 1988-01-12
KR1019880000153A KR880009317A (ko) 1987-01-16 1988-01-12 메모리 카드 및 그 제조방법
JP63005678A JPS63239097A (ja) 1987-01-16 1988-01-13 メモリカードの製造方法及びこの方法を実施することによって作られたメモリカード
AT88400068T ATE74456T1 (de) 1987-01-16 1988-01-14 Herstellungsverfahren fuer speicherkarten und durch dieses verfahren erhaltene karten.
EP88400068A EP0277854B1 (fr) 1987-01-16 1988-01-14 Procédé de réalisation de cartes à mémoire et cartes obtenues par la mise en oeuvre dudit procédé
DE8888400068T DE3869635D1 (de) 1987-01-16 1988-01-14 Herstellungsverfahren fuer speicherkarten und durch dieses verfahren erhaltene karten.
FI880152A FI93156C (fi) 1987-01-16 1988-01-14 Muistikorttien valmistusmenetelmä ja tällä menetelmällä aikaansaadut kortit
DK016988A DK16988A (da) 1987-01-16 1988-01-14 Fremgangsmaade til fremstilling af lagerkort og kort fremstillet ved anvendelse af fremgangsmaaden
ES198888400068T ES2031248T3 (es) 1987-01-16 1988-01-14 Procedimiento de realizacion de una tarjeta de memoria electronica.
NZ223192A NZ223192A (en) 1987-01-16 1988-01-14 Molding 'smart' card
CA000556637A CA1306058C (en) 1987-01-16 1988-01-15 Method of making memory cards, and cards obtained by implementing said method
PT86557A PT86557A (pt) 1987-01-16 1988-01-15 Processo para a realizacao de cartoes de memoria e cartoes obtidos pela realizacao do referido processo
BR8800135A BR8800135A (pt) 1987-01-16 1988-01-15 Processo para a realizacao de cartoes de memoria e cartoes obtidos pelo referido processo
NO880166A NO178089C (no) 1987-01-16 1988-01-15 Fremgangsmåte for fremstilling av et elektronisk hukommelseskort
ZA880279A ZA88279B (en) 1987-01-16 1988-01-15 A method of making memory cards,and cards obtained by implementing said method
GR920401244T GR3004900T3 (enExample) 1987-01-16 1992-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8700446A FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede

Publications (2)

Publication Number Publication Date
FR2609821A1 FR2609821A1 (fr) 1988-07-22
FR2609821B1 true FR2609821B1 (fr) 1989-03-31

Family

ID=9346968

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8700446A Expired FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede

Country Status (18)

Country Link
EP (1) EP0277854B1 (enExample)
JP (1) JPS63239097A (enExample)
KR (1) KR880009317A (enExample)
AT (1) ATE74456T1 (enExample)
AU (1) AU600785B2 (enExample)
BR (1) BR8800135A (enExample)
CA (1) CA1306058C (enExample)
DE (1) DE3869635D1 (enExample)
DK (1) DK16988A (enExample)
ES (1) ES2031248T3 (enExample)
FI (1) FI93156C (enExample)
FR (1) FR2609821B1 (enExample)
GR (1) GR3004900T3 (enExample)
IN (1) IN170183B (enExample)
NO (1) NO178089C (enExample)
NZ (1) NZ223192A (enExample)
PT (1) PT86557A (enExample)
ZA (1) ZA88279B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
FR2636755B1 (fr) * 1988-09-16 1992-05-22 Schlumberger Ind Sa Procede de realisation de cartes a memoire et cartes obtenues par ledit procede
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JP2559834B2 (ja) * 1989-01-12 1996-12-04 三菱電機株式会社 Ｉｃカード
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2647571B1 (fr) * 1989-05-26 1994-07-22 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2666687A1 (fr) * 1990-09-06 1992-03-13 Sgs Thomson Microelectronics Circuit integre a boitier moule comprenant un dissipateur thermique et procede de fabrication.
IT1243817B (it) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
FI913357A7 (fi) * 1991-07-10 1993-01-11 Valtion Teknillinen Tutkimuskeskus Menetelmä ja muotti ruiskupuristetun elektroniikkamodulin valmistamiseksi
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
DE4403513A1 (de) * 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
JPH0890600A (ja) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ｉｃカード製造金型
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
JP3409943B2 (ja) * 1995-05-25 2003-05-26 昭和電工株式会社 輸液容器用口栓体及びその製法
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
DE19625228C2 (de) 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
EP0890928A3 (en) * 1997-07-10 2001-06-13 Sarnoff Corporation Transmission apparatus and remotely identifying an electronically coded article
EP0938060A1 (de) * 1998-02-20 1999-08-25 ESEC Management SA Verfahren zur Herstellung eines Chipobjektes und Chipobjekt
WO2000019513A1 (de) * 1998-09-29 2000-04-06 Tyco Electronics Logistics Ag Verfahren zum eingiessen eines flachen elektronikmoduls in einem kunststoffkartenkörper durch thermoplastisches spritzgiessen
FR2895547B1 (fr) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
ATE551668T1 (de) 2006-11-17 2012-04-15 Oberthur Technologies Verfahren zur herstellung einer entität und entsprechende vorrichtung
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
PL3491584T3 (pl) 2016-07-27 2022-11-07 Composecure Llc Elektroniczne komponenty do kart transakcyjnych i sposoby ich wytwarzania
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
PE20250343A1 (es) 2017-09-07 2025-02-06 Composecure Llc Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion
EP4109337B1 (en) 2017-10-18 2024-08-28 Composecure LLC Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
CN116852632A (zh) * 2023-07-04 2023-10-10 中国银行股份有限公司 卡片制作装置

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Publication number Priority date Publication date Assignee Title
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
JPS6086850A (ja) * 1983-10-18 1985-05-16 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS60146383A (ja) * 1984-01-10 1985-08-02 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS61222712A (ja) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp 樹脂封止成形体の製造方法
JPS6232094A (ja) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Ｉｃカ−ド

Also Published As

Publication number Publication date
FI880152A0 (fi) 1988-01-14
AU600785B2 (en) 1990-08-23
NO880166L (no) 1988-07-18
DE3869635D1 (de) 1992-05-07
KR880009317A (ko) 1988-09-14
FI93156C (fi) 1995-02-27
NO178089C (no) 1996-01-17
PT86557A (pt) 1989-01-30
EP0277854A1 (fr) 1988-08-10
AU1016088A (en) 1988-07-21
NO880166D0 (no) 1988-01-15
FI880152L (fi) 1988-07-17
FR2609821A1 (fr) 1988-07-22
NO178089B (no) 1995-10-09
ZA88279B (en) 1988-07-01
DK16988D0 (da) 1988-01-14
CA1306058C (en) 1992-08-04
FI93156B (fi) 1994-11-15
BR8800135A (pt) 1988-08-23
JPS63239097A (ja) 1988-10-05
NZ223192A (en) 1989-09-27
IN170183B (enExample) 1992-02-22
ES2031248T3 (es) 1992-12-01
ATE74456T1 (de) 1992-04-15
DK16988A (da) 1988-07-17
EP0277854B1 (fr) 1992-04-01
GR3004900T3 (enExample) 1993-04-28

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TP Transmission of property