FR2464536B1 - Memoire semi-conductrice a grille flottante, programmable electriquement, et son procede de fabrication - Google Patents
Memoire semi-conductrice a grille flottante, programmable electriquement, et son procede de fabricationInfo
- Publication number
- FR2464536B1 FR2464536B1 FR8019082A FR8019082A FR2464536B1 FR 2464536 B1 FR2464536 B1 FR 2464536B1 FR 8019082 A FR8019082 A FR 8019082A FR 8019082 A FR8019082 A FR 8019082A FR 2464536 B1 FR2464536 B1 FR 2464536B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- semiconductor memory
- electrically programmable
- floating grid
- programmable floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7885—Hot carrier injection from the channel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/072,504 US4376947A (en) | 1979-09-04 | 1979-09-04 | Electrically programmable floating gate semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2464536A1 FR2464536A1 (fr) | 1981-03-06 |
FR2464536B1 true FR2464536B1 (fr) | 1985-11-08 |
Family
ID=22108027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8019082A Expired FR2464536B1 (fr) | 1979-09-04 | 1980-09-04 | Memoire semi-conductrice a grille flottante, programmable electriquement, et son procede de fabrication |
Country Status (4)
Country | Link |
---|---|
US (1) | US4376947A (fr) |
JP (1) | JPS5664469A (fr) |
DE (1) | DE3033333A1 (fr) |
FR (1) | FR2464536B1 (fr) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4514897A (en) * | 1979-09-04 | 1985-05-07 | Texas Instruments Incorporated | Electrically programmable floating gate semiconductor memory device |
DE3279662D1 (en) * | 1981-12-30 | 1989-06-01 | Thomson Components Mostek Corp | Triple diffused short channel device structure |
USRE32800E (en) * | 1981-12-30 | 1988-12-13 | Sgs-Thomson Microelectronics, Inc. | Method of making mosfet by multiple implantations followed by a diffusion step |
US4599118A (en) * | 1981-12-30 | 1986-07-08 | Mostek Corporation | Method of making MOSFET by multiple implantations followed by a diffusion step |
JPS5994873A (ja) * | 1982-11-22 | 1984-05-31 | Nissan Motor Co Ltd | Mosトランジスタ |
US4769340A (en) * | 1983-11-28 | 1988-09-06 | Exel Microelectronics, Inc. | Method for making electrically programmable memory device by doping the floating gate by implant |
JPS60182174A (ja) * | 1984-02-28 | 1985-09-17 | Nec Corp | 不揮発性半導体メモリ |
KR930007195B1 (ko) * | 1984-05-23 | 1993-07-31 | 가부시끼가이샤 히다찌세이사꾸쇼 | 반도체 장치와 그 제조 방법 |
US5352620A (en) * | 1984-05-23 | 1994-10-04 | Hitachi, Ltd. | Method of making semiconductor device with memory cells and peripheral transistors |
US4698787A (en) * | 1984-11-21 | 1987-10-06 | Exel Microelectronics, Inc. | Single transistor electrically programmable memory device and method |
KR890004962B1 (ko) * | 1985-02-08 | 1989-12-02 | 가부시끼가이샤 도오시바 | 반도체장치 및 그 제조방법 |
US4649629A (en) * | 1985-07-29 | 1987-03-17 | Thomson Components - Mostek Corp. | Method of late programming a read only memory |
KR900000065B1 (ko) * | 1985-08-13 | 1990-01-19 | 가부시끼가이샤 도오시바 | 독출전용 반도체기억장치와 그 제조방법 |
JP3059442B2 (ja) * | 1988-11-09 | 2000-07-04 | 株式会社日立製作所 | 半導体記憶装置 |
JP2555027B2 (ja) * | 1986-05-26 | 1996-11-20 | 株式会社日立製作所 | 半導体記憶装置 |
US5189497A (en) * | 1986-05-26 | 1993-02-23 | Hitachi, Ltd. | Semiconductor memory device |
US4758869A (en) * | 1986-08-29 | 1988-07-19 | Waferscale Integration, Inc. | Nonvolatile floating gate transistor structure |
US5034786A (en) * | 1986-08-29 | 1991-07-23 | Waferscale Integration, Inc. | Opaque cover for preventing erasure of an EPROM |
US4835740A (en) * | 1986-12-26 | 1989-05-30 | Kabushiki Kaisha Toshiba | Floating gate type semiconductor memory device |
DE3880860T2 (de) * | 1987-03-04 | 1993-10-28 | Toshiba Kawasaki Kk | Halbleiterspeicheranordnung und Verfahren zu ihrer Herstellung. |
US4874715A (en) * | 1987-05-20 | 1989-10-17 | Texas Instruments Incorporated | Read only memory with improved channel length control and method of forming |
US4861730A (en) * | 1988-01-25 | 1989-08-29 | Catalyst Semiconductor, Inc. | Process for making a high density split gate nonvolatile memory cell |
US5067111A (en) * | 1988-10-28 | 1991-11-19 | Kabushiki Kaisha Toshiba | Semiconductor memory device having a majority logic for determining data to be read out |
US5341329A (en) * | 1988-12-28 | 1994-08-23 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device capable of preventing read error caused by overerase state and method therefor |
US5844842A (en) | 1989-02-06 | 1998-12-01 | Hitachi, Ltd. | Nonvolatile semiconductor memory device |
IT1228720B (it) * | 1989-03-15 | 1991-07-03 | Sgs Thomson Microelectronics | Matrice a tovaglia di celle di memoria eprom con giunzioni sepolte, accessibili singolarmente mediante decodifica tradizionale. |
US5081054A (en) * | 1989-04-03 | 1992-01-14 | Atmel Corporation | Fabrication process for programmable and erasable MOS memory device |
US5045489A (en) * | 1989-06-30 | 1991-09-03 | Texas Instruments Incorporated | Method of making a high-speed 2-transistor cell for programmable/EEPROM devices with separate read and write transistors |
US5172200A (en) * | 1990-01-12 | 1992-12-15 | Mitsubishi Denki Kabushiki Kaisha | MOS memory device having a LDD structure and a visor-like insulating layer |
US5111270A (en) * | 1990-02-22 | 1992-05-05 | Intel Corporation | Three-dimensional contactless non-volatile memory cell |
IT1239707B (it) * | 1990-03-15 | 1993-11-15 | St Microelectrics Srl | Processo per la realizzazione di una cella di memoria rom a bassa capacita' di drain |
US5266509A (en) * | 1990-05-11 | 1993-11-30 | North American Philips Corporation | Fabrication method for a floating-gate field-effect transistor structure |
US5032881A (en) * | 1990-06-29 | 1991-07-16 | National Semiconductor Corporation | Asymmetric virtual ground EPROM cell and fabrication method |
US5355332A (en) * | 1990-10-23 | 1994-10-11 | Kabushiki Kaisha Toshiba | Electrically erasable programmable read-only memory with an array of one-transistor memory cells |
US5424567A (en) * | 1991-05-15 | 1995-06-13 | North American Philips Corporation | Protected programmable transistor with reduced parasitic capacitances and method of fabrication |
US5264384A (en) * | 1991-08-30 | 1993-11-23 | Texas Instruments Incorporated | Method of making a non-volatile memory cell |
EP0575688B1 (fr) * | 1992-06-26 | 1998-05-27 | STMicroelectronics S.r.l. | Programmation des cellules LDD-ROM |
US5349225A (en) * | 1993-04-12 | 1994-09-20 | Texas Instruments Incorporated | Field effect transistor with a lightly doped drain |
US5378909A (en) * | 1993-10-18 | 1995-01-03 | Hughes Aircraft Company | Flash EEPROM cell having gap between floating gate and drain for high hot electron injection efficiency for programming |
US5677215A (en) * | 1993-11-17 | 1997-10-14 | Lg Semicon Co., Ltd. | Method of fabricating a nonvolatile semiconductor memory device |
DE4340592C2 (de) * | 1993-11-29 | 2002-04-18 | Gold Star Electronics | Verfahren zum Herstellen eines nichtflüchtigen Halbleiterspeichers und einen nach diesem Verfahren hergestellten Halbleiterspeicher |
JP2848223B2 (ja) * | 1993-12-01 | 1999-01-20 | 日本電気株式会社 | 不揮発性半導体記憶装置の消去方法及び製造方法 |
JP2806234B2 (ja) * | 1993-12-13 | 1998-09-30 | 日本電気株式会社 | 半導体装置及びその製造方法 |
EP0748521B1 (fr) * | 1994-03-03 | 2001-11-07 | Rohm Corporation | Detection de sureffacement dans une cellule memoire flash eeprom mono-transistor basse tension programmable et effa able selon le procede fowler-nordheim |
JP3461998B2 (ja) * | 1995-03-24 | 2003-10-27 | セイコーインスツルメンツ株式会社 | 電気的書き換え可能な半導体不揮発性メモリ装置とその製造方法 |
US5822242A (en) * | 1997-03-05 | 1998-10-13 | Macronix International Co, Ltd. | Asymmetric virtual ground p-channel flash cell with latid n-type pocket and method of fabrication therefor |
US6069382A (en) * | 1998-02-11 | 2000-05-30 | Cypress Semiconductor Corp. | Non-volatile memory cell having a high coupling ratio |
US6284598B1 (en) * | 1999-01-12 | 2001-09-04 | Agere Systems Guardian Corp. | Method of manufacturing a flash memory cell having inter-poly-dielectric isolation |
US6913980B2 (en) * | 2003-06-30 | 2005-07-05 | Texas Instruments Incorporated | Process method of source drain spacer engineering to improve transistor capacitance |
US7009248B2 (en) * | 2003-10-02 | 2006-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with asymmetric pocket implants |
US20060131634A1 (en) * | 2004-12-21 | 2006-06-22 | Tzu-Hsuan Hsu | Non-volatile memory, non-volatile memory cell and operation thereof |
US9287879B2 (en) * | 2011-06-07 | 2016-03-15 | Verisiti, Inc. | Semiconductor device having features to prevent reverse engineering |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623023A (en) * | 1967-12-01 | 1971-11-23 | Sperry Rand Corp | Variable threshold transistor memory using pulse coincident writing |
US3881180A (en) * | 1971-11-30 | 1975-04-29 | Texas Instruments Inc | Non-volatile memory cell |
US3882469A (en) * | 1971-11-30 | 1975-05-06 | Texas Instruments Inc | Non-volatile variable threshold memory cell |
US3868187A (en) * | 1972-08-31 | 1975-02-25 | Tokyo Shibaura Electric Co | Avalanche injection type mos memory |
FR2380639A2 (fr) * | 1976-09-29 | 1978-09-08 | Siemens Ag | Transistor a effet de champ de memorisation a canal n |
US4161039A (en) * | 1976-12-15 | 1979-07-10 | Siemens Aktiengesellschaft | N-Channel storage FET |
JPS5912419B2 (ja) * | 1976-12-16 | 1984-03-23 | 株式会社東芝 | テ−ブル装置 |
FR2375692A1 (fr) * | 1976-12-27 | 1978-07-21 | Texas Instruments Inc | Memoire semi-conductrice a grilles flottantes, programmable electriquement |
US4112509A (en) * | 1976-12-27 | 1978-09-05 | Texas Instruments Incorporated | Electrically alterable floating gate semiconductor memory device |
US4122544A (en) * | 1976-12-27 | 1978-10-24 | Texas Instruments Incorporated | Electrically alterable floating gate semiconductor memory device with series enhancement transistor |
US4151021A (en) * | 1977-01-26 | 1979-04-24 | Texas Instruments Incorporated | Method of making a high density floating gate electrically programmable ROM |
JPS5397381A (en) * | 1977-02-07 | 1978-08-25 | Toshiba Corp | Nonvoltile semiconductor memory |
JPS5419372A (en) * | 1977-07-14 | 1979-02-14 | Nec Corp | Production of semiconductor memory |
US4258378A (en) * | 1978-05-26 | 1981-03-24 | Texas Instruments Incorporated | Electrically alterable floating gate memory with self-aligned low-threshold series enhancement transistor |
US4222063A (en) * | 1978-05-30 | 1980-09-09 | American Microsystems | VMOS Floating gate memory with breakdown voltage lowering region |
US4302766A (en) * | 1979-01-05 | 1981-11-24 | Texas Instruments Incorporated | Self-limiting erasable memory cell with triple level polysilicon |
US4317273A (en) * | 1979-11-13 | 1982-03-02 | Texas Instruments Incorporated | Method of making high coupling ratio DMOS electrically programmable ROM |
-
1979
- 1979-09-04 US US06/072,504 patent/US4376947A/en not_active Expired - Lifetime
-
1980
- 1980-09-04 FR FR8019082A patent/FR2464536B1/fr not_active Expired
- 1980-09-04 DE DE19803033333 patent/DE3033333A1/de active Granted
- 1980-09-04 JP JP12183480A patent/JPS5664469A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4376947A (en) | 1983-03-15 |
FR2464536A1 (fr) | 1981-03-06 |
JPS5664469A (en) | 1981-06-01 |
DE3033333A1 (de) | 1981-04-09 |
DE3033333C2 (fr) | 1992-01-30 |
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