FR2462780B1 - - Google Patents

Info

Publication number
FR2462780B1
FR2462780B1 FR8016605A FR8016605A FR2462780B1 FR 2462780 B1 FR2462780 B1 FR 2462780B1 FR 8016605 A FR8016605 A FR 8016605A FR 8016605 A FR8016605 A FR 8016605A FR 2462780 B1 FR2462780 B1 FR 2462780B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8016605A
Other languages
French (fr)
Other versions
FR2462780A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Arris Technology Inc
General Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arris Technology Inc, General Instrument Corp filed Critical Arris Technology Inc
Publication of FR2462780A1 publication Critical patent/FR2462780A1/fr
Application granted granted Critical
Publication of FR2462780B1 publication Critical patent/FR2462780B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H10P30/212Through-implantation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
FR8016605A 1979-08-01 1980-07-28 Procede de fabrication d'une jonction p-n a tension de rupture elevee Granted FR2462780A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6267679A 1979-08-01 1979-08-01

Publications (2)

Publication Number Publication Date
FR2462780A1 FR2462780A1 (fr) 1981-02-13
FR2462780B1 true FR2462780B1 (enExample) 1983-02-18

Family

ID=22044093

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8016605A Granted FR2462780A1 (fr) 1979-08-01 1980-07-28 Procede de fabrication d'une jonction p-n a tension de rupture elevee

Country Status (5)

Country Link
JP (1) JPS5623742A (enExample)
DE (1) DE3028185A1 (enExample)
FR (1) FR2462780A1 (enExample)
GB (1) GB2056168A (enExample)
IT (1) IT1145411B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369072A (en) * 1981-01-22 1983-01-18 International Business Machines Corp. Method for forming IGFET devices having improved drain voltage characteristics
JPS60117681A (ja) * 1983-11-29 1985-06-25 Mitsubishi Electric Corp 半導体装置
JPH063798B2 (ja) * 1985-02-06 1994-01-12 日本電気株式会社 半導体装置の製造方法
JPH01147829A (ja) * 1987-12-04 1989-06-09 Toshiba Corp 半導体装置の製造方法
JP2706460B2 (ja) * 1988-03-14 1998-01-28 富士通株式会社 イオン注入方法
JP4629809B2 (ja) * 1996-03-27 2011-02-09 クリー,インコーポレイテッド SiCの半導体層を有する半導体素子を製造する方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT956828B (it) * 1971-08-05 1973-10-10 Rca Corp Processo per l ottenimento di regio ni diffuse a semiconduttore presen tanti un numero ridotto di difetti nel cristallo
IL40189A0 (en) * 1971-09-09 1972-10-29 Trusty J Method and apparatus for preparing and analyzing serum samples
DE2304647C2 (de) * 1973-01-31 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung einer dotierten Zone in einem Halbleiterkörper
JPS543479A (en) * 1977-06-09 1979-01-11 Toshiba Corp Semiconductor device and its manufacture

Also Published As

Publication number Publication date
FR2462780A1 (fr) 1981-02-13
JPS5623742A (en) 1981-03-06
IT1145411B (it) 1986-11-05
IT8049389A0 (it) 1980-07-31
DE3028185A1 (de) 1981-02-26
GB2056168A (en) 1981-03-11

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Legal Events

Date Code Title Description
ST Notification of lapse