FR2447131A1 - Procede de fabrication de plaquettes a circuits imprimes multi-couches - Google Patents

Procede de fabrication de plaquettes a circuits imprimes multi-couches

Info

Publication number
FR2447131A1
FR2447131A1 FR7922427A FR7922427A FR2447131A1 FR 2447131 A1 FR2447131 A1 FR 2447131A1 FR 7922427 A FR7922427 A FR 7922427A FR 7922427 A FR7922427 A FR 7922427A FR 2447131 A1 FR2447131 A1 FR 2447131A1
Authority
FR
France
Prior art keywords
circuit boards
printed circuit
interconnections
printed
planes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7922427A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of FR2447131A1 publication Critical patent/FR2447131A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procédé de fabrication de plaquettes à circuits imprimés multi-couches. La présente invention concerne un procédé de fabrication de plaquettes à circuits imprimés multi-couches comprenant deux ou plusieurs plans d'interconnexion et des interconnexions parmi les connexions des divers plans d'interconnexion dans lesquels, en premier lieu, les interconnexions du premier ou des deux premiers plans sont produites sur la surface d'un matériau de base, à la suite de quoi le ou les plans ainsi pourvus d'interconnexions sont recouverts d'une couche de matériau isolant, les conducteurs imprimés correspondant au dessin d'interconnexion désiré des plans suivants étant produits, avec production simultanée des conducteurs imprimés et des interconnexions parmi les conducteurs imprimés. Application à la fabrication des circuits imprimés.
FR7922427A 1978-09-07 1979-09-07 Procede de fabrication de plaquettes a circuits imprimes multi-couches Withdrawn FR2447131A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (de) 1978-09-07 1978-09-07 Verfahren zum Herstellen von Mehrebenen-Leiterplatten

Publications (1)

Publication Number Publication Date
FR2447131A1 true FR2447131A1 (fr) 1980-08-14

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7922427A Withdrawn FR2447131A1 (fr) 1978-09-07 1979-09-07 Procede de fabrication de plaquettes a circuits imprimes multi-couches

Country Status (7)

Country Link
BE (1) BE878645A (fr)
DE (1) DE2838982B2 (fr)
ES (1) ES483975A1 (fr)
FR (1) FR2447131A1 (fr)
GB (1) GB2030781B (fr)
NL (1) NL7906603A (fr)
SE (1) SE7907298L (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
SE455148B (sv) * 1985-11-15 1988-06-20 Leeb Karl Erik Anordning innefattande ett substrat och derpa applicerat ledningsmonster vid framstellning av monsterkort samt forfarande for framstellning av anordningen
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
DE4237611A1 (de) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Verfahren zur Herstellung von Leiterplatten

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
FR2047563A5 (fr) * 1969-05-14 1971-03-12 Siemens Ag
FR2051133A5 (fr) * 1969-06-13 1971-04-02 Microponent Dev

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
FR2047563A5 (fr) * 1969-05-14 1971-03-12 Siemens Ag
US3675318A (en) * 1969-05-14 1972-07-11 Siemens Ag Process for the production of a circuit board
FR2051133A5 (fr) * 1969-06-13 1971-04-02 Microponent Dev

Also Published As

Publication number Publication date
GB2030781A (en) 1980-04-10
ES483975A1 (es) 1980-04-01
DE2838982A1 (de) 1980-03-20
BE878645A (nl) 1980-03-07
DE2838982B2 (de) 1980-09-18
NL7906603A (nl) 1980-03-11
GB2030781B (en) 1982-10-13
SE7907298L (sv) 1980-03-08

Similar Documents

Publication Publication Date Title
ATE59756T1 (de) Verfahren zur herstellung von durchkontaktierten flexiblen leiterplatten fuer hohe biegebeanspruchung.
DE3856021D1 (de) Mehrschichtverbindung für integrierte Schaltungsstruktur mit zwei oder mehreren metallischen Leiterschichten und Verfahren zum Herstellen derselben
ATA28979A (de) Mehrschichtiges, gesintertes glaskeramiksubstrat mit aus gold, silber oder kupfer bestehenden leitungsmustern und, verfahren zu dessen herstellung
FR2408973A1 (fr) Support de circuit imprime avec des resistances
MY109360A (en) Two-layer of multilayer printed circuit board,vmethod of manufacturing such a printed circuit board,vand laminate for the manufacture of such a printed circuit board by such a method
ES8202469A1 (es) Un procedimiento para fabricar una placa de circuito impresomultiple hueca
FR2447131A1 (fr) Procede de fabrication de plaquettes a circuits imprimes multi-couches
IE851596L (en) Flexible circuit board
US4808434A (en) Process for application of overlay conductors to surface of printed circuit board assemblies
FR2412225A1 (fr) Module electronique pour pieces d'horlogerie et son procede de fabrication
KR900019545A (ko) 표면장착용 배선기판의 제조방법
FR2556916B1 (fr) Procede pour fabriquer un substrat de circuit electronique presentant une ou plusieurs ouvertures traversantes
US3325379A (en) Method of making metallic patterns having continuous interconnections
SE8702704D0 (sv) Sett for tillverkning av ett monsterkort samt anordning for anvendning vid genomforande av settet
SE8205343L (sv) Sett att framstella elektroniska komponenter
GB2156593A (en) Through hole interconnections
JPS6035543A (ja) 半導体装置の製造方法
JPS57190341A (en) Circuit borad composition
FR2566612B1 (fr) Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenue
JPS647637A (en) Multilayer interconnection for integrated circuit
JPS6480097A (en) Manufacture of printed wiring board
JPS5662318A (en) Semiconductor device and manufacturing of thereof
JP3110329B2 (ja) 電子部品の半田付け方法
JPS6484224A (en) Electrode forming method
JPH0443698A (ja) 多層積層配線基板

Legal Events

Date Code Title Description
ST Notification of lapse