BE878645A - Vervaardigingswerkwijze voor meerlagige gedrukte stroomloopkaarten - Google Patents

Vervaardigingswerkwijze voor meerlagige gedrukte stroomloopkaarten

Info

Publication number
BE878645A
BE878645A BE2/58053A BE2058053A BE878645A BE 878645 A BE878645 A BE 878645A BE 2/58053 A BE2/58053 A BE 2/58053A BE 2058053 A BE2058053 A BE 2058053A BE 878645 A BE878645 A BE 878645A
Authority
BE
Belgium
Prior art keywords
manufacturing
multilayer printed
printed flow
flow cards
cards
Prior art date
Application number
BE2/58053A
Other languages
English (en)
Inventor
S Schlag
K P Kreft
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of BE878645A publication Critical patent/BE878645A/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE2/58053A 1978-09-07 1979-09-07 Vervaardigingswerkwijze voor meerlagige gedrukte stroomloopkaarten BE878645A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (de) 1978-09-07 1978-09-07 Verfahren zum Herstellen von Mehrebenen-Leiterplatten

Publications (1)

Publication Number Publication Date
BE878645A true BE878645A (nl) 1980-03-07

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
BE2/58053A BE878645A (nl) 1978-09-07 1979-09-07 Vervaardigingswerkwijze voor meerlagige gedrukte stroomloopkaarten

Country Status (7)

Country Link
BE (1) BE878645A (nl)
DE (1) DE2838982B2 (nl)
ES (1) ES483975A1 (nl)
FR (1) FR2447131A1 (nl)
GB (1) GB2030781B (nl)
NL (1) NL7906603A (nl)
SE (1) SE7907298L (nl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
SE455148B (sv) * 1985-11-15 1988-06-20 Leeb Karl Erik Anordning innefattande ett substrat och derpa applicerat ledningsmonster vid framstellning av monsterkort samt forfarande for framstellning av anordningen
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
DE4237611A1 (de) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Verfahren zur Herstellung von Leiterplatten

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (de) * 1969-05-14 1971-06-09 Verfahren zur herstellung einer leiterplatte
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies

Also Published As

Publication number Publication date
ES483975A1 (es) 1980-04-01
SE7907298L (sv) 1980-03-08
DE2838982A1 (de) 1980-03-20
DE2838982B2 (de) 1980-09-18
NL7906603A (nl) 1980-03-11
FR2447131A1 (fr) 1980-08-14
GB2030781A (en) 1980-04-10
GB2030781B (en) 1982-10-13

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: INTERNATIONAL STANDARD ELECTRIC CORP.

Effective date: 19860930