SE7907298L - Forfarande for framstellning av tryckta kretskort med flera skikt - Google Patents

Forfarande for framstellning av tryckta kretskort med flera skikt

Info

Publication number
SE7907298L
SE7907298L SE7907298A SE7907298A SE7907298L SE 7907298 L SE7907298 L SE 7907298L SE 7907298 A SE7907298 A SE 7907298A SE 7907298 A SE7907298 A SE 7907298A SE 7907298 L SE7907298 L SE 7907298L
Authority
SE
Sweden
Prior art keywords
procedure
processed
circuit board
printed circuit
known manner
Prior art date
Application number
SE7907298A
Other languages
English (en)
Swedish (sv)
Inventor
S Schlag
K-P Kreft
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of SE7907298L publication Critical patent/SE7907298L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE7907298A 1978-09-07 1979-09-03 Forfarande for framstellning av tryckta kretskort med flera skikt SE7907298L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (de) 1978-09-07 1978-09-07 Verfahren zum Herstellen von Mehrebenen-Leiterplatten

Publications (1)

Publication Number Publication Date
SE7907298L true SE7907298L (sv) 1980-03-08

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7907298A SE7907298L (sv) 1978-09-07 1979-09-03 Forfarande for framstellning av tryckta kretskort med flera skikt

Country Status (7)

Country Link
BE (1) BE878645A (xx)
DE (1) DE2838982B2 (xx)
ES (1) ES483975A1 (xx)
FR (1) FR2447131A1 (xx)
GB (1) GB2030781B (xx)
NL (1) NL7906603A (xx)
SE (1) SE7907298L (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
SE455148B (sv) * 1985-11-15 1988-06-20 Leeb Karl Erik Anordning innefattande ett substrat och derpa applicerat ledningsmonster vid framstellning av monsterkort samt forfarande for framstellning av anordningen
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
DE4237611A1 (de) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Verfahren zur Herstellung von Leiterplatten

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (de) * 1969-05-14 1971-06-09 Verfahren zur herstellung einer leiterplatte
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies

Also Published As

Publication number Publication date
GB2030781A (en) 1980-04-10
ES483975A1 (es) 1980-04-01
DE2838982A1 (de) 1980-03-20
BE878645A (nl) 1980-03-07
DE2838982B2 (de) 1980-09-18
NL7906603A (nl) 1980-03-11
GB2030781B (en) 1982-10-13
FR2447131A1 (fr) 1980-08-14

Similar Documents

Publication Publication Date Title
US4800461A (en) Multilayer combined rigid and flex printed circuits
DE69926939D1 (de) Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
EP0175045A3 (en) Method for the production of flexible printed circuit boards for high bending strain with conductive through-holes
EP0332834A1 (en) Low dielectric printed circuit boards
JPS5678342A (en) Printed circuit
FI891729A (fi) Hartslaminat och foerfarande foer deras framstaellning.
US4106187A (en) Curved rigid printed circuit boards
SE7714310L (sv) Sett att framstella formstyva ledningsplattor
SE7907298L (sv) Forfarande for framstellning av tryckta kretskort med flera skikt
ATE136420T1 (de) Verfahren zur herstellung von mehrschichtleiterplatten
KR910004077A (ko) 회로판
US5629497A (en) Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
KR900004225A (ko) 인쇄 배선판, 그러한 판의 제조 방법 및 그러한 판에 사용하기 위한 절연 필름
ES8500700A1 (es) Perfeccionamientos en placas de circuitos impresos
JP3153715B2 (ja) プリント配線板の多面取りの製造用フィルムおよびそれを用いた製造方法
JPH08107274A (ja) ４層型プリント配線板
JPH08107273A (ja) プリント配線板の製造方法
JPS6476796A (en) Manufacture of multilayer printed wiring board
JPH0955562A (ja) プリント配線板
JPS593879B2 (ja) 印刷配線板の製造法
JPS56159229A (en) Production of multilayer board
JPS6439097A (en) Manufacture of multilayer interconnection board
KR960036874A (ko) 플렉시블 pcb의 제조방법
JPS6459989A (en) Manufacture of printed wiring board
DE3869247D1 (de) Verfahren zur herstellung von gedruckten schaltungen.

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 7907298-9