SE7907298L - PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS WITH MULTIPLE LAYERS - Google Patents

PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS WITH MULTIPLE LAYERS

Info

Publication number
SE7907298L
SE7907298L SE7907298A SE7907298A SE7907298L SE 7907298 L SE7907298 L SE 7907298L SE 7907298 A SE7907298 A SE 7907298A SE 7907298 A SE7907298 A SE 7907298A SE 7907298 L SE7907298 L SE 7907298L
Authority
SE
Sweden
Prior art keywords
procedure
processed
circuit board
printed circuit
known manner
Prior art date
Application number
SE7907298A
Other languages
Swedish (sv)
Inventor
S Schlag
K-P Kreft
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of SE7907298L publication Critical patent/SE7907298L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method of fabricating a multilayer printed circuit board in which a glass fibre reinforced epoxy resin sheet 1, clad on both sides with copper foil 2, 3 is first processed to form a double sided printed circuit board. The two sides are then covered with thin films 4, 5 of partially cured adhesive rubber material. The adhesive layers are processed and provided with separate conductor patterns 6, 7 in known manner. The adhesive layers and conductor patterns are repeated until the requisite number have been provided. Interconnecting holes are then formed and plated through in known manner. Finally the whole structure is post cured. <IMAGE>
SE7907298A 1978-09-07 1979-09-03 PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS WITH MULTIPLE LAYERS SE7907298L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (en) 1978-09-07 1978-09-07 Method of manufacturing multilevel printed circuit boards

Publications (1)

Publication Number Publication Date
SE7907298L true SE7907298L (en) 1980-03-08

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7907298A SE7907298L (en) 1978-09-07 1979-09-03 PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS WITH MULTIPLE LAYERS

Country Status (7)

Country Link
BE (1) BE878645A (en)
DE (1) DE2838982B2 (en)
ES (1) ES483975A1 (en)
FR (1) FR2447131A1 (en)
GB (1) GB2030781B (en)
NL (1) NL7906603A (en)
SE (1) SE7907298L (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
JPS6276600A (en) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 Forming method for conductive circuit on substrate
SE455148B (en) * 1985-11-15 1988-06-20 Leeb Karl Erik DEVICE CONTAINING A SUBSTRATE AND DERPA APPLICATED CONDUCTING SAMPLES FOR THE PREPARATION OF SAMPLE CARDS AND PROCEDURE FOR PREPARING THE DEVICE
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
DE4237611A1 (en) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Circuit board prodn. and circuit board - uses further layer of resin-impregnated fabric to cover conductive paths formed on composite baseboard

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (en) * 1969-05-14 1971-06-09 METHOD OF MANUFACTURING A CIRCUIT BOARD
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies

Also Published As

Publication number Publication date
GB2030781A (en) 1980-04-10
ES483975A1 (en) 1980-04-01
DE2838982A1 (en) 1980-03-20
BE878645A (en) 1980-03-07
DE2838982B2 (en) 1980-09-18
NL7906603A (en) 1980-03-11
GB2030781B (en) 1982-10-13
FR2447131A1 (en) 1980-08-14

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Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 7907298-9