GB2030781B - Multilayer printed circuit - Google Patents

Multilayer printed circuit

Info

Publication number
GB2030781B
GB2030781B GB7929756A GB7929756A GB2030781B GB 2030781 B GB2030781 B GB 2030781B GB 7929756 A GB7929756 A GB 7929756A GB 7929756 A GB7929756 A GB 7929756A GB 2030781 B GB2030781 B GB 2030781B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
multilayer printed
multilayer
circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7929756A
Other versions
GB2030781A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB2030781A publication Critical patent/GB2030781A/en
Application granted granted Critical
Publication of GB2030781B publication Critical patent/GB2030781B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
GB7929756A 1978-09-07 1979-08-28 Multilayer printed circuit Expired GB2030781B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782838982 DE2838982B2 (en) 1978-09-07 1978-09-07 Method of manufacturing multilevel printed circuit boards

Publications (2)

Publication Number Publication Date
GB2030781A GB2030781A (en) 1980-04-10
GB2030781B true GB2030781B (en) 1982-10-13

Family

ID=6048893

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7929756A Expired GB2030781B (en) 1978-09-07 1979-08-28 Multilayer printed circuit

Country Status (7)

Country Link
BE (1) BE878645A (en)
DE (1) DE2838982B2 (en)
ES (1) ES483975A1 (en)
FR (1) FR2447131A1 (en)
GB (1) GB2030781B (en)
NL (1) NL7906603A (en)
SE (1) SE7907298L (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
JPS6276600A (en) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 Forming method for conductive circuit on substrate
SE455148B (en) * 1985-11-15 1988-06-20 Leeb Karl Erik DEVICE CONTAINING A SUBSTRATE AND DERPA APPLICATED CONDUCTING SAMPLES FOR THE PREPARATION OF SAMPLE CARDS AND PROCEDURE FOR PREPARING THE DEVICE
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
DE4237611A1 (en) * 1992-11-09 1994-05-11 Lueberg Elektronik Gmbh & Co R Circuit board prodn. and circuit board - uses further layer of resin-impregnated fabric to cover conductive paths formed on composite baseboard

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892451A (en) * 1957-12-03 1962-03-28 Radio And Allied Ind Ltd Improvements in and relating to the manufacture of printed circuits
US3349162A (en) * 1965-08-23 1967-10-24 Automatic Elect Lab Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (en) * 1969-05-14 1971-06-09 METHOD OF MANUFACTURING A CIRCUIT BOARD
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies

Also Published As

Publication number Publication date
GB2030781A (en) 1980-04-10
DE2838982B2 (en) 1980-09-18
DE2838982A1 (en) 1980-03-20
FR2447131A1 (en) 1980-08-14
ES483975A1 (en) 1980-04-01
NL7906603A (en) 1980-03-11
SE7907298L (en) 1980-03-08
BE878645A (en) 1980-03-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee