FR2566612B1 - Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenue - Google Patents
Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenueInfo
- Publication number
- FR2566612B1 FR2566612B1 FR8509483A FR8509483A FR2566612B1 FR 2566612 B1 FR2566612 B1 FR 2566612B1 FR 8509483 A FR8509483 A FR 8509483A FR 8509483 A FR8509483 A FR 8509483A FR 2566612 B1 FR2566612 B1 FR 2566612B1
- Authority
- FR
- France
- Prior art keywords
- wafer
- manufacture
- printed circuit
- circuit boards
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62419484A | 1984-06-25 | 1984-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2566612A1 FR2566612A1 (fr) | 1985-12-27 |
FR2566612B1 true FR2566612B1 (fr) | 1990-06-08 |
Family
ID=24501053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8509483A Expired - Fee Related FR2566612B1 (fr) | 1984-06-25 | 1985-06-21 | Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenue |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0168602A1 (fr) |
JP (1) | JPS6113690A (fr) |
AU (1) | AU4398685A (fr) |
DE (1) | DE3520258A1 (fr) |
ES (1) | ES8608770A1 (fr) |
FR (1) | FR2566612B1 (fr) |
GB (1) | GB2161325B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4693778A (en) * | 1985-07-19 | 1987-09-15 | Kollmorgen Technologies Corporation | Apparatus for making scribed circuit boards and circuit board modifications |
CH682964A5 (de) * | 1991-05-10 | 1993-12-15 | Josef Boeck | Vorrichtung zum Herstellen einer elektrischen Schaltung. |
TW398165B (en) * | 1997-03-03 | 2000-07-11 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
US8635767B2 (en) | 2011-01-05 | 2014-01-28 | Thoe Boeing Company | System for depositing microwire |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5550399B1 (fr) * | 1970-03-05 | 1980-12-17 | ||
DE2316176C3 (de) * | 1973-03-31 | 1975-09-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung mehrlagiger Leiterbahnenstrukturen auf einem Substrat mittels eines programmgesteuerten, für die Leiterbahnenherstellung herangezogenen Werkzeuges |
US4500389A (en) * | 1981-04-14 | 1985-02-19 | Kollmorgen Technologies Corporation | Process for the manufacture of substrates to interconnect electronic components |
US4414741A (en) * | 1981-05-22 | 1983-11-15 | Augat Inc. | Process for interconnecting components on a PCB |
US4427478A (en) * | 1982-06-28 | 1984-01-24 | International Business Machines Corporation | Process for making an encapsulated circuit board and products made thereby |
-
1985
- 1985-05-25 EP EP85106493A patent/EP0168602A1/fr not_active Withdrawn
- 1985-06-04 DE DE19853520258 patent/DE3520258A1/de active Granted
- 1985-06-05 GB GB8514162A patent/GB2161325B/en not_active Expired
- 1985-06-19 ES ES544354A patent/ES8608770A1/es not_active Expired
- 1985-06-21 FR FR8509483A patent/FR2566612B1/fr not_active Expired - Fee Related
- 1985-06-21 JP JP13673385A patent/JPS6113690A/ja active Pending
- 1985-06-24 AU AU43986/85A patent/AU4398685A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE3520258C2 (fr) | 1989-01-26 |
ES8608770A1 (es) | 1986-07-16 |
GB8514162D0 (en) | 1985-07-10 |
AU4398685A (en) | 1986-01-02 |
JPS6113690A (ja) | 1986-01-21 |
FR2566612A1 (fr) | 1985-12-27 |
EP0168602A1 (fr) | 1986-01-22 |
GB2161325A (en) | 1986-01-08 |
ES544354A0 (es) | 1986-07-16 |
GB2161325B (en) | 1989-06-01 |
DE3520258A1 (de) | 1986-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
TP | Transmission of property | ||
ST | Notification of lapse |