FR2617667B1 - Procede de fabrication d'une plaquette a circuit imprime et cette plaquette - Google Patents

Procede de fabrication d'une plaquette a circuit imprime et cette plaquette

Info

Publication number
FR2617667B1
FR2617667B1 FR8808955A FR8808955A FR2617667B1 FR 2617667 B1 FR2617667 B1 FR 2617667B1 FR 8808955 A FR8808955 A FR 8808955A FR 8808955 A FR8808955 A FR 8808955A FR 2617667 B1 FR2617667 B1 FR 2617667B1
Authority
FR
France
Prior art keywords
manufacturing
same
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8808955A
Other languages
English (en)
Other versions
FR2617667A1 (fr
Inventor
Daniel Barnett
Paulo A Diehl
Norvell J Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSI Star Inc
Original Assignee
PSI Star Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PSI Star Inc filed Critical PSI Star Inc
Publication of FR2617667A1 publication Critical patent/FR2617667A1/fr
Application granted granted Critical
Publication of FR2617667B1 publication Critical patent/FR2617667B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
FR8808955A 1987-07-02 1988-07-01 Procede de fabrication d'une plaquette a circuit imprime et cette plaquette Expired - Lifetime FR2617667B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6938287A 1987-07-02 1987-07-02

Publications (2)

Publication Number Publication Date
FR2617667A1 FR2617667A1 (fr) 1989-01-06
FR2617667B1 true FR2617667B1 (fr) 1991-04-26

Family

ID=22088623

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8808955A Expired - Lifetime FR2617667B1 (fr) 1987-07-02 1988-07-01 Procede de fabrication d'une plaquette a circuit imprime et cette plaquette

Country Status (4)

Country Link
JP (1) JPS6489588A (fr)
DE (1) DE3822403A1 (fr)
FR (1) FR2617667B1 (fr)
GB (1) GB2206541A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912733A (en) * 1989-03-27 1990-03-27 General Electric Company Steam-water separating system for boiling water nuclear reactors
EP0563744B1 (fr) * 1992-03-30 1998-09-09 Seiko Instruments Inc. Procédé d'usinage électrochimique fin
EP3518631A1 (fr) 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Gravure anisotrope faisant appel à des polymères fortement ramifiés
CN110927422B (zh) * 2019-02-22 2021-11-02 宁波三星医疗电气股份有限公司 一种电能表底壳及该底壳的注塑工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (fr) * 1972-10-18 1974-06-14
JPS528473A (en) * 1975-07-08 1977-01-22 Hirotoshi Nomura Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist
JPS5999793A (ja) * 1982-11-29 1984-06-08 山下サーキテック株式会社 プリント配線板
JPS59175189A (ja) * 1983-03-23 1984-10-03 株式会社　サト−セン プリント配線板の製造法
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask
US4545850A (en) * 1984-08-20 1985-10-08 Psi Star Regenerative copper etching process and solution
JPS61226997A (ja) * 1985-03-30 1986-10-08 株式会社東芝 プリント配線板の製造方法
US4605471A (en) * 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards
US4632727A (en) * 1985-08-12 1986-12-30 Psi Star Copper etching process and solution

Also Published As

Publication number Publication date
FR2617667A1 (fr) 1989-01-06
DE3822403A1 (de) 1989-01-12
GB8815275D0 (en) 1988-08-03
JPS6489588A (en) 1989-04-04
GB2206541A (en) 1989-01-11

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Legal Events

Date Code Title Description
ST Notification of lapse