FR2276693A1 - Structure de microplaquette de circuits integres et son procede de fabrication - Google Patents

Structure de microplaquette de circuits integres et son procede de fabrication

Info

Publication number
FR2276693A1
FR2276693A1 FR7516533A FR7516533A FR2276693A1 FR 2276693 A1 FR2276693 A1 FR 2276693A1 FR 7516533 A FR7516533 A FR 7516533A FR 7516533 A FR7516533 A FR 7516533A FR 2276693 A1 FR2276693 A1 FR 2276693A1
Authority
FR
France
Prior art keywords
manufacturing process
integrated circuits
microplate structure
microplate
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7516533A
Other languages
English (en)
French (fr)
Other versions
FR2276693B1 (enrdf_load_stackoverflow
Inventor
Eugene E Cass
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2276693A1 publication Critical patent/FR2276693A1/fr
Application granted granted Critical
Publication of FR2276693B1 publication Critical patent/FR2276693B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7516533A 1974-06-26 1975-05-21 Structure de microplaquette de circuits integres et son procede de fabrication Granted FR2276693A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48346374A 1974-06-26 1974-06-26

Publications (2)

Publication Number Publication Date
FR2276693A1 true FR2276693A1 (fr) 1976-01-23
FR2276693B1 FR2276693B1 (enrdf_load_stackoverflow) 1977-04-15

Family

ID=23920133

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7516533A Granted FR2276693A1 (fr) 1974-06-26 1975-05-21 Structure de microplaquette de circuits integres et son procede de fabrication

Country Status (8)

Country Link
JP (2) JPS5753984B2 (enrdf_load_stackoverflow)
CA (1) CA1024661A (enrdf_load_stackoverflow)
CH (1) CH583970A5 (enrdf_load_stackoverflow)
DE (1) DE2523221A1 (enrdf_load_stackoverflow)
ES (1) ES438666A1 (enrdf_load_stackoverflow)
FR (1) FR2276693A1 (enrdf_load_stackoverflow)
GB (1) GB1513893A (enrdf_load_stackoverflow)
IT (1) IT1038108B (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2393427A1 (fr) * 1977-05-31 1978-12-29 Fujitsu Ltd Circuit integre cellulaire et procede hierarchique de realisation
EP0011737A1 (fr) * 1978-11-30 1980-06-11 International Business Machines Corporation Structure de circuits intégrés semi-conducteurs et procédé pour l'obtention de cette structure
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
EP0113828A3 (en) * 1983-01-12 1986-06-11 International Business Machines Corporation Master slice semiconductor chip having a new multi-function fet cell
EP0387812A3 (en) * 1989-03-14 1992-08-05 Fujitsu Limited Bipolar integrated circuit having a unit block structure

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1102009A (en) * 1977-09-06 1981-05-26 Algirdas J. Gruodis Integrated circuit layout utilizing separated active circuit and wiring regions
DE2822011C3 (de) * 1978-05-19 1987-09-10 Fujitsu Ltd., Kawasaki, Kanagawa Halbleiteranordnung und Verfahren zu deren Herstellung
US4249193A (en) * 1978-05-25 1981-02-03 International Business Machines Corporation LSI Semiconductor device and fabrication thereof
JPS5712534A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
JPS57186350A (en) * 1981-05-13 1982-11-16 Hitachi Ltd Semiconductor integrated circuit device
JPS58112343A (ja) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd 半導体装置およびその製造方法
JPS58143550A (ja) * 1982-02-22 1983-08-26 Nec Corp 半導体装置
JPS5943548A (ja) * 1982-09-06 1984-03-10 Hitachi Ltd 半導体集積回路装置
JPS59103455U (ja) * 1982-12-28 1984-07-12 富士通株式会社 半導体装置
JPS59159558A (ja) * 1983-03-01 1984-09-10 Toshiba Corp 半導体基板
JPS63278249A (ja) * 1986-12-26 1988-11-15 Toshiba Corp 半導体集積回路装置の配線方法
DE10317018A1 (de) * 2003-04-11 2004-11-18 Infineon Technologies Ag Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
DE1789137A1 (de) * 1967-06-23 1973-05-03 Rca Corp Aus einheitszellen aufgebaute lsischaltung
US3558992A (en) * 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
US3584269A (en) * 1968-10-11 1971-06-08 Ibm Diffused equal impedance interconnections for integrated circuits
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
US3621562A (en) * 1970-04-29 1971-11-23 Sylvania Electric Prod Method of manufacturing integrated circuit arrays
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
US3725743A (en) * 1971-05-19 1973-04-03 Hitachi Ltd Multilayer wiring structure
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2393427A1 (fr) * 1977-05-31 1978-12-29 Fujitsu Ltd Circuit integre cellulaire et procede hierarchique de realisation
EP0011737A1 (fr) * 1978-11-30 1980-06-11 International Business Machines Corporation Structure de circuits intégrés semi-conducteurs et procédé pour l'obtention de cette structure
FR2443185A1 (fr) * 1978-11-30 1980-06-27 Ibm Topologie de circuits integres semi-conducteurs et procede pour l'obtention de cette topologie
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
EP0113828A3 (en) * 1983-01-12 1986-06-11 International Business Machines Corporation Master slice semiconductor chip having a new multi-function fet cell
EP0387812A3 (en) * 1989-03-14 1992-08-05 Fujitsu Limited Bipolar integrated circuit having a unit block structure

Also Published As

Publication number Publication date
FR2276693B1 (enrdf_load_stackoverflow) 1977-04-15
GB1513893A (en) 1978-06-14
CA1024661A (en) 1978-01-17
DE2523221A1 (de) 1976-01-15
JPS5753984B2 (enrdf_load_stackoverflow) 1982-11-16
IT1038108B (it) 1979-11-20
ES438666A1 (es) 1977-03-16
DE2523221C2 (enrdf_load_stackoverflow) 1992-09-17
JPS5989435A (ja) 1984-05-23
CH583970A5 (enrdf_load_stackoverflow) 1977-01-14
JPS5125085A (enrdf_load_stackoverflow) 1976-03-01

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Legal Events

Date Code Title Description
ST Notification of lapse