CA1024661A - Wireable planar integrated circuit chip structure - Google Patents

Wireable planar integrated circuit chip structure

Info

Publication number
CA1024661A
CA1024661A CA225,413A CA225413A CA1024661A CA 1024661 A CA1024661 A CA 1024661A CA 225413 A CA225413 A CA 225413A CA 1024661 A CA1024661 A CA 1024661A
Authority
CA
Canada
Prior art keywords
wireable
integrated circuit
circuit chip
chip structure
planar integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA225,413A
Other languages
English (en)
French (fr)
Inventor
Eugene E. Cass
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1024661A publication Critical patent/CA1024661A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CA225,413A 1974-06-26 1975-04-22 Wireable planar integrated circuit chip structure Expired CA1024661A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48346374A 1974-06-26 1974-06-26

Publications (1)

Publication Number Publication Date
CA1024661A true CA1024661A (en) 1978-01-17

Family

ID=23920133

Family Applications (1)

Application Number Title Priority Date Filing Date
CA225,413A Expired CA1024661A (en) 1974-06-26 1975-04-22 Wireable planar integrated circuit chip structure

Country Status (8)

Country Link
JP (2) JPS5753984B2 (enrdf_load_stackoverflow)
CA (1) CA1024661A (enrdf_load_stackoverflow)
CH (1) CH583970A5 (enrdf_load_stackoverflow)
DE (1) DE2523221A1 (enrdf_load_stackoverflow)
ES (1) ES438666A1 (enrdf_load_stackoverflow)
FR (1) FR2276693A1 (enrdf_load_stackoverflow)
GB (1) GB1513893A (enrdf_load_stackoverflow)
IT (1) IT1038108B (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL185431C (nl) * 1977-05-31 1990-04-02 Fujitsu Ltd Geintegreerde halfgeleiderschakeling, omvattende een halfgeleiderlichaam met ten minste twee basisschakelingen van complementaire veldeffekttransistoren met geisoleerde stuurelektrode.
CA1102009A (en) * 1977-09-06 1981-05-26 Algirdas J. Gruodis Integrated circuit layout utilizing separated active circuit and wiring regions
DE2822011C3 (de) * 1978-05-19 1987-09-10 Fujitsu Ltd., Kawasaki, Kanagawa Halbleiteranordnung und Verfahren zu deren Herstellung
US4249193A (en) * 1978-05-25 1981-02-03 International Business Machines Corporation LSI Semiconductor device and fabrication thereof
FR2443185A1 (fr) * 1978-11-30 1980-06-27 Ibm Topologie de circuits integres semi-conducteurs et procede pour l'obtention de cette topologie
JPS5712534A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
JPS57186350A (en) * 1981-05-13 1982-11-16 Hitachi Ltd Semiconductor integrated circuit device
JPS58112343A (ja) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd 半導体装置およびその製造方法
JPS58143550A (ja) * 1982-02-22 1983-08-26 Nec Corp 半導体装置
JPS5943548A (ja) * 1982-09-06 1984-03-10 Hitachi Ltd 半導体集積回路装置
JPS59103455U (ja) * 1982-12-28 1984-07-12 富士通株式会社 半導体装置
EP0113828B1 (en) * 1983-01-12 1990-02-28 International Business Machines Corporation Master slice semiconductor chip having a new multi-function fet cell
JPS59159558A (ja) * 1983-03-01 1984-09-10 Toshiba Corp 半導体基板
JPS63278249A (ja) * 1986-12-26 1988-11-15 Toshiba Corp 半導体集積回路装置の配線方法
US5124776A (en) * 1989-03-14 1992-06-23 Fujitsu Limited Bipolar integrated circuit having a unit block structure
DE10317018A1 (de) * 2003-04-11 2004-11-18 Infineon Technologies Ag Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
DE1789137A1 (de) * 1967-06-23 1973-05-03 Rca Corp Aus einheitszellen aufgebaute lsischaltung
US3558992A (en) * 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
US3584269A (en) * 1968-10-11 1971-06-08 Ibm Diffused equal impedance interconnections for integrated circuits
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
US3621562A (en) * 1970-04-29 1971-11-23 Sylvania Electric Prod Method of manufacturing integrated circuit arrays
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
US3725743A (en) * 1971-05-19 1973-04-03 Hitachi Ltd Multilayer wiring structure
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method

Also Published As

Publication number Publication date
FR2276693B1 (enrdf_load_stackoverflow) 1977-04-15
GB1513893A (en) 1978-06-14
DE2523221A1 (de) 1976-01-15
JPS5753984B2 (enrdf_load_stackoverflow) 1982-11-16
IT1038108B (it) 1979-11-20
ES438666A1 (es) 1977-03-16
DE2523221C2 (enrdf_load_stackoverflow) 1992-09-17
JPS5989435A (ja) 1984-05-23
FR2276693A1 (fr) 1976-01-23
CH583970A5 (enrdf_load_stackoverflow) 1977-01-14
JPS5125085A (enrdf_load_stackoverflow) 1976-03-01

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