JPS5712534A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5712534A JPS5712534A JP8661380A JP8661380A JPS5712534A JP S5712534 A JPS5712534 A JP S5712534A JP 8661380 A JP8661380 A JP 8661380A JP 8661380 A JP8661380 A JP 8661380A JP S5712534 A JPS5712534 A JP S5712534A
- Authority
- JP
- Japan
- Prior art keywords
- vss
- vdd
- pads
- voltage
- doing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To optimize the condition for voltage stress, by providing the wiring for the power source-signal line in an IC in such a manner as to electrically separate by high and low of breakdown voltage required on a circuit. CONSTITUTION:A power source-signal line VDD(VSS) of capacity section of a memory cell and a peripheral circuit line VDD(VSS) are separated and connected to respectively different joining pads. It is possible, by doing so, to impress high voltage, when an IC is inspected in wafer condition, on the capacity section of the memory cell irrespective of a voltage VDD(VSS) of the peripheral circuit, and at the time of assembling, it is also possible to connect these two circuits by two pads. It is also favorable to provide independent pads for VDD(VSS) by peripheral circuits. It is possible, by doing so, to obtain an IC of good quality.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8661380A JPS5712534A (en) | 1980-06-27 | 1980-06-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8661380A JPS5712534A (en) | 1980-06-27 | 1980-06-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5712534A true JPS5712534A (en) | 1982-01-22 |
Family
ID=13891858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8661380A Pending JPS5712534A (en) | 1980-06-27 | 1980-06-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5712534A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6130502A (en) * | 1996-05-21 | 2000-10-10 | Kabushiki Kaisha Toshiba | Cathode assembly, electron gun assembly, electron tube, heater, and method of manufacturing cathode assembly and electron gun assembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125085A (en) * | 1974-06-26 | 1976-03-01 | Ibm | BUREENAHANDOTAISHUSEKIKAIROCHITSUPUKOZO |
JPS5332685A (en) * | 1976-09-08 | 1978-03-28 | Hitachi Ltd | Semiconductor memory |
JPS5420680A (en) * | 1977-07-18 | 1979-02-16 | Hitachi Ltd | Large scale integrated circuit |
-
1980
- 1980-06-27 JP JP8661380A patent/JPS5712534A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125085A (en) * | 1974-06-26 | 1976-03-01 | Ibm | BUREENAHANDOTAISHUSEKIKAIROCHITSUPUKOZO |
JPS5332685A (en) * | 1976-09-08 | 1978-03-28 | Hitachi Ltd | Semiconductor memory |
JPS5420680A (en) * | 1977-07-18 | 1979-02-16 | Hitachi Ltd | Large scale integrated circuit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6130502A (en) * | 1996-05-21 | 2000-10-10 | Kabushiki Kaisha Toshiba | Cathode assembly, electron gun assembly, electron tube, heater, and method of manufacturing cathode assembly and electron gun assembly |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1437024A (en) | Semiconductor integrated circuit structures | |
US4527254A (en) | Dynamic random access memory having separated VDD pads for improved burn-in | |
EP0377932A3 (en) | Package of semiconductor integrated circuits | |
HK135794A (en) | Apparatus and method for measuring battery condition | |
JPS6459831A (en) | Semiconductor integrated circuit | |
US20070176632A1 (en) | Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package | |
MY112140A (en) | Jig for measuring the characteristics of a semiconductor, manufacturing method for the same, and usage of the same | |
JPS5712534A (en) | Semiconductor device | |
US6599764B1 (en) | Isolation testing scheme for multi-die packages | |
HK95791A (en) | Integrated digital mos semiconductor circuit | |
JPS5735342A (en) | Manufacturing method of large scale integrated circuit | |
JPS5740951A (en) | Manufacture of semiconductor device | |
JPS5448562A (en) | Recording head | |
GB2021825A (en) | Improvements in or relating to semi conductor circuits | |
ES295772Y (en) | A FLAT CAPSULE FOR INTEGRATED CIRCUIT MEMORY PADS, SPECIAL APPLICATION TO AVIATION CIRCUITS | |
JP3495835B2 (en) | Semiconductor integrated circuit device and inspection method thereof | |
JPS554903A (en) | Method for constructing semi-conductor integrated circuit | |
JPS57149763A (en) | Integrated circuit device | |
JPS56124240A (en) | Semiconductor integrated circuit device | |
JPS644998A (en) | Semiconductor memory device | |
JPS6464332A (en) | Manufacture of tape carrier type semiconductor device | |
JPS52115193A (en) | Lsi structure | |
JPS57128938A (en) | Device for measuring characteristic of semiconductor | |
JPH04217341A (en) | Semiconductor integrated circuit device | |
JPH02165664A (en) | Semiconductor integrated device |