GB2021825A - Improvements in or relating to semi conductor circuits - Google Patents
Improvements in or relating to semi conductor circuitsInfo
- Publication number
- GB2021825A GB2021825A GB7917664A GB7917664A GB2021825A GB 2021825 A GB2021825 A GB 2021825A GB 7917664 A GB7917664 A GB 7917664A GB 7917664 A GB7917664 A GB 7917664A GB 2021825 A GB2021825 A GB 2021825A
- Authority
- GB
- United Kingdom
- Prior art keywords
- chip
- relating
- conductor circuits
- semi conductor
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
Abstract
Each chip in a circuit of the wafer scale integrated kind can store a plurality of bits of information, and all the chips can be accessed in parallel for write or read operations, all chips being provided with means for feeding in clock pulses and power. Each chip may be provided, in the electrical connections thereto, with resistor means which limits the current which can flow in any chip which is faulty without substantially affecting the functioning of a good chip. <IMAGE>
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7917664A GB2021825B (en) | 1978-05-25 | 1979-05-21 | Semi conductor circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2263778 | 1978-05-25 | ||
GB7917664A GB2021825B (en) | 1978-05-25 | 1979-05-21 | Semi conductor circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2021825A true GB2021825A (en) | 1979-12-05 |
GB2021825B GB2021825B (en) | 1982-10-27 |
Family
ID=26256037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7917664A Expired GB2021825B (en) | 1978-05-25 | 1979-05-21 | Semi conductor circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2021825B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1983002357A1 (en) * | 1981-12-21 | 1983-07-07 | Burroughs Corp | Improvements in or relating to wafer scale integrated circuits |
US4493055A (en) * | 1980-12-12 | 1985-01-08 | Burroughs Corporation | Wafer-scale integrated circuits |
EP0240864A2 (en) * | 1986-04-03 | 1987-10-14 | Hewlett-Packard Company | High-yield semiconductor memory devices |
EP0413590A2 (en) * | 1989-08-18 | 1991-02-20 | Fujitsu Limited | Wafer scale integrated circuit device |
EP0459316A2 (en) * | 1990-05-31 | 1991-12-04 | Oki Electric Industry Co., Ltd. | Semiconductor memory device |
-
1979
- 1979-05-21 GB GB7917664A patent/GB2021825B/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4493055A (en) * | 1980-12-12 | 1985-01-08 | Burroughs Corporation | Wafer-scale integrated circuits |
WO1983002357A1 (en) * | 1981-12-21 | 1983-07-07 | Burroughs Corp | Improvements in or relating to wafer scale integrated circuits |
EP0240864A2 (en) * | 1986-04-03 | 1987-10-14 | Hewlett-Packard Company | High-yield semiconductor memory devices |
EP0240864A3 (en) * | 1986-04-03 | 1989-05-24 | Hewlett-Packard Company | High-yield semiconductor memory devices |
EP0413590A2 (en) * | 1989-08-18 | 1991-02-20 | Fujitsu Limited | Wafer scale integrated circuit device |
EP0413590A3 (en) * | 1989-08-18 | 1991-07-31 | Fujitsu Limited | Wafer scale integrated circuit device |
EP0459316A2 (en) * | 1990-05-31 | 1991-12-04 | Oki Electric Industry Co., Ltd. | Semiconductor memory device |
EP0459316A3 (en) * | 1990-05-31 | 1992-07-22 | Oki Electric Industry Co., Ltd. | Semiconductor memory device |
US5321658A (en) * | 1990-05-31 | 1994-06-14 | Oki Electric Industry Co., Ltd. | Semiconductor memory device being coupled by auxiliary power lines to a main power line |
US5517444A (en) * | 1990-05-31 | 1996-05-14 | Oki Electric Industry Co., Ltd. | Semiconductor memory device with resistive power supply connection |
Also Published As
Publication number | Publication date |
---|---|
GB2021825B (en) | 1982-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19990518 |