JPS5753984B2 - - Google Patents

Info

Publication number
JPS5753984B2
JPS5753984B2 JP50066657A JP6665775A JPS5753984B2 JP S5753984 B2 JPS5753984 B2 JP S5753984B2 JP 50066657 A JP50066657 A JP 50066657A JP 6665775 A JP6665775 A JP 6665775A JP S5753984 B2 JPS5753984 B2 JP S5753984B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50066657A
Other languages
Japanese (ja)
Other versions
JPS5125085A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5125085A publication Critical patent/JPS5125085A/ja
Publication of JPS5753984B2 publication Critical patent/JPS5753984B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP50066657A 1974-06-26 1975-06-04 Expired JPS5753984B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48346374A 1974-06-26 1974-06-26

Publications (2)

Publication Number Publication Date
JPS5125085A JPS5125085A (enrdf_load_stackoverflow) 1976-03-01
JPS5753984B2 true JPS5753984B2 (enrdf_load_stackoverflow) 1982-11-16

Family

ID=23920133

Family Applications (2)

Application Number Title Priority Date Filing Date
JP50066657A Expired JPS5753984B2 (enrdf_load_stackoverflow) 1974-06-26 1975-06-04
JP58195409A Pending JPS5989435A (ja) 1974-06-26 1983-10-20 プレ−ナ半導体集積回路

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP58195409A Pending JPS5989435A (ja) 1974-06-26 1983-10-20 プレ−ナ半導体集積回路

Country Status (8)

Country Link
JP (2) JPS5753984B2 (enrdf_load_stackoverflow)
CA (1) CA1024661A (enrdf_load_stackoverflow)
CH (1) CH583970A5 (enrdf_load_stackoverflow)
DE (1) DE2523221A1 (enrdf_load_stackoverflow)
ES (1) ES438666A1 (enrdf_load_stackoverflow)
FR (1) FR2276693A1 (enrdf_load_stackoverflow)
GB (1) GB1513893A (enrdf_load_stackoverflow)
IT (1) IT1038108B (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL185431C (nl) * 1977-05-31 1990-04-02 Fujitsu Ltd Geintegreerde halfgeleiderschakeling, omvattende een halfgeleiderlichaam met ten minste twee basisschakelingen van complementaire veldeffekttransistoren met geisoleerde stuurelektrode.
CA1102009A (en) * 1977-09-06 1981-05-26 Algirdas J. Gruodis Integrated circuit layout utilizing separated active circuit and wiring regions
DE2822011C3 (de) * 1978-05-19 1987-09-10 Fujitsu Ltd., Kawasaki, Kanagawa Halbleiteranordnung und Verfahren zu deren Herstellung
US4249193A (en) * 1978-05-25 1981-02-03 International Business Machines Corporation LSI Semiconductor device and fabrication thereof
FR2443185A1 (fr) * 1978-11-30 1980-06-27 Ibm Topologie de circuits integres semi-conducteurs et procede pour l'obtention de cette topologie
JPS5712534A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
JPS57186350A (en) * 1981-05-13 1982-11-16 Hitachi Ltd Semiconductor integrated circuit device
JPS58112343A (ja) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd 半導体装置およびその製造方法
JPS58143550A (ja) * 1982-02-22 1983-08-26 Nec Corp 半導体装置
JPS5943548A (ja) * 1982-09-06 1984-03-10 Hitachi Ltd 半導体集積回路装置
JPS59103455U (ja) * 1982-12-28 1984-07-12 富士通株式会社 半導体装置
EP0113828B1 (en) * 1983-01-12 1990-02-28 International Business Machines Corporation Master slice semiconductor chip having a new multi-function fet cell
JPS59159558A (ja) * 1983-03-01 1984-09-10 Toshiba Corp 半導体基板
JPS63278249A (ja) * 1986-12-26 1988-11-15 Toshiba Corp 半導体集積回路装置の配線方法
US5124776A (en) * 1989-03-14 1992-06-23 Fujitsu Limited Bipolar integrated circuit having a unit block structure
DE10317018A1 (de) * 2003-04-11 2004-11-18 Infineon Technologies Ag Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
DE1789137A1 (de) * 1967-06-23 1973-05-03 Rca Corp Aus einheitszellen aufgebaute lsischaltung
US3558992A (en) * 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
US3584269A (en) * 1968-10-11 1971-06-08 Ibm Diffused equal impedance interconnections for integrated circuits
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
US3621562A (en) * 1970-04-29 1971-11-23 Sylvania Electric Prod Method of manufacturing integrated circuit arrays
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
US3725743A (en) * 1971-05-19 1973-04-03 Hitachi Ltd Multilayer wiring structure
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method

Also Published As

Publication number Publication date
FR2276693B1 (enrdf_load_stackoverflow) 1977-04-15
GB1513893A (en) 1978-06-14
CA1024661A (en) 1978-01-17
DE2523221A1 (de) 1976-01-15
IT1038108B (it) 1979-11-20
ES438666A1 (es) 1977-03-16
DE2523221C2 (enrdf_load_stackoverflow) 1992-09-17
JPS5989435A (ja) 1984-05-23
FR2276693A1 (fr) 1976-01-23
CH583970A5 (enrdf_load_stackoverflow) 1977-01-14
JPS5125085A (enrdf_load_stackoverflow) 1976-03-01

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