FI71956B - Laoglegerad kopparlegering foerfarande foer dess framstaellning samt dess anvaendning - Google Patents

Laoglegerad kopparlegering foerfarande foer dess framstaellning samt dess anvaendning Download PDF

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Publication number
FI71956B
FI71956B FI844601A FI844601A FI71956B FI 71956 B FI71956 B FI 71956B FI 844601 A FI844601 A FI 844601A FI 844601 A FI844601 A FI 844601A FI 71956 B FI71956 B FI 71956B
Authority
FI
Finland
Prior art keywords
alloy
dess
copper
tin
nickel
Prior art date
Application number
FI844601A
Other languages
English (en)
Finnish (fi)
Other versions
FI844601L (fi
FI71956C (sv
FI844601A0 (fi
Inventor
Joerg Steeb
Original Assignee
Wieland Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke Ag filed Critical Wieland Werke Ag
Publication of FI844601A0 publication Critical patent/FI844601A0/fi
Publication of FI844601L publication Critical patent/FI844601L/fi
Publication of FI71956B publication Critical patent/FI71956B/fi
Application granted granted Critical
Publication of FI71956C publication Critical patent/FI71956C/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Claims (12)

1. Laglegerad kopparlegering, kanne tecknad därav, att den innehaller 0,03 - 0,2 % nickel 0,03 - 0,2 % tenn 0,015- 0,1 % titan Resten koppar och vanliga föroreningar
2. Kopparlegering enligt patentkrav 1, kännetecknad därav, att den innehaller 0,03 - 0,06 % nickel 0,03 - 0,06 % tenn 0,015- 0,03 % titan Resten koppar och vanliga föroreningar
3. Kopparlegering enligt patentkrav 1 eller 2, kännetecknad därav, att legeringens beständsdelar nickel, tenn och titan föreligger i proportionen a : b : c, varvid a = 1,8 - 2,2, b - 1,8 - 2,2 och c = 0,9 - 1,1.
4. Kopparlegering enligt patentkrav 3, kännetecknad därav, att legeringens beständsdelar nickel, tenn och titan föreligger i proportionen 2:2:1.
3. Förfarande för frams täilning av en kopparlegering enligt patentkraven 1-4, kännetecknat. därav, att kopparle- geringen a) homogeniseras 1 - 24h vid temperaturer av 850 - 950°C b) varmvalsas vid temperaturer av 600 - 800°C i en eller flera matningar och c) avkyles med en kylningshastighet mellan 10°C/min och 2000°C/min tili rumstemperatur.
6. Förfarande enligt patentkrav 5, kännetecknat därav, att förfarandets steg b) utföres vid temperaturer av 650 - 750°C.
FI844601A 1983-12-30 1984-11-23 Låglegerad kopparlegering, förfarande för dess framställning samt dess användning. FI71956C (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3347535 1983-12-30
DE3347535A DE3347535C1 (de) 1983-12-30 1983-12-30 Niedriglegierte Kupferlegierung,Verfahren zu ihrer Herstellung sowie ihre Verwendung

Publications (4)

Publication Number Publication Date
FI844601A0 FI844601A0 (fi) 1984-11-23
FI844601L FI844601L (fi) 1985-07-01
FI71956B true FI71956B (fi) 1986-11-28
FI71956C FI71956C (sv) 1987-03-09

Family

ID=6218426

Family Applications (1)

Application Number Title Priority Date Filing Date
FI844601A FI71956C (sv) 1983-12-30 1984-11-23 Låglegerad kopparlegering, förfarande för dess framställning samt dess användning.

Country Status (7)

Country Link
US (1) US4610843A (sv)
DE (1) DE3347535C1 (sv)
FI (1) FI71956C (sv)
FR (1) FR2557593B1 (sv)
GB (1) GB2152077B (sv)
IT (1) IT1179902B (sv)
SE (1) SE456427B (sv)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112708799A (zh) * 2020-12-21 2021-04-27 江西理工大学 一种高强导电抗软化铜合金及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54104596A (en) * 1978-02-03 1979-08-16 Nippon Mining Co Copper alloy for lead frame
DE2948916C2 (de) * 1979-12-05 1981-12-10 Wieland-Werke Ag, 7900 Ulm Kupfer-Zinn-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture

Also Published As

Publication number Publication date
SE456427B (sv) 1988-10-03
SE8406669D0 (sv) 1984-12-28
US4610843A (en) 1986-09-09
GB2152077B (en) 1987-04-23
FI844601L (fi) 1985-07-01
IT1179902B (it) 1987-09-16
GB8431681D0 (en) 1985-01-30
FI71956C (sv) 1987-03-09
SE8406669L (sv) 1985-07-01
IT8468290A0 (it) 1984-12-28
FR2557593B1 (fr) 1987-10-30
FI844601A0 (fi) 1984-11-23
DE3347535C1 (de) 1988-10-20
GB2152077A (en) 1985-07-31
FR2557593A1 (fr) 1985-07-05

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MM Patent lapsed

Owner name: WIELAND-WERKE AG